1. Product Specifications
Core Architecture
- Device Family: Xilinx Spartan-II
- Part Number: XC2S300E-6FTG256C
- Logic Cells: 300,000 system gates
- Speed Grade: -6 (high-performance grade)
- Package Type: FTG256 (Fine-Pitch Ball Grid Array)
- Pin Count: 256 pins
- Operating Voltage: 2.5V core, 3.3V I/O
Memory and Resources
- Block RAM: 40 Kbits total
- Distributed RAM: 38 Kbits
- Maximum User I/O: 176 pins
- Differential I/O Pairs: 88 pairs
- Clock Management: Up to 4 Digital Clock Managers (DCMs)
Performance Characteristics
- Maximum Frequency: Up to 200 MHz
- Propagation Delay: 4.1 ns typical
- Power Consumption: Low-power CMOS technology
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
The XC2S300E-6FTG256C features advanced I/O standards support including LVDS, SSTL, and HSTL, ensuring compatibility with modern high-speed interfaces and memory controllers.
2. Pricing Information
Note: Pricing for the XC2S300E-6FTG256C varies based on quantity, distributor, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability.
Typical Price Range:
- Single unit: $150-250 USD
- Volume pricing available for orders of 100+ units
- Educational discounts may apply for qualifying institutions
Availability: The XC2S300E-6FTG256C is considered a mature product and may have limited availability. Check with distributors for current stock levels and lead times.
3. Documents & Media
Technical Documentation
- Datasheet: Spartan-II FPGA Family Complete Data Sheet
- User Guide: Spartan-II FPGA User Guide
- Package Information: FTG256 Package Specifications
- Pinout Documentation: XC2S300E Pin Assignments and Descriptions
- Thermal Guidelines: Package Thermal Characteristics
Design Resources
- Reference Designs: Sample projects and implementation examples
- Application Notes: Best practices for XC2S300E-6FTG256C implementation
- Layout Guidelines: PCB design recommendations for FTG256 package
- Power Analysis Tools: Xilinx Power Estimator (XPE) support files
Software Compatibility
- ISE Design Suite: Compatible with legacy Xilinx ISE versions
- Development Tools: ChipScope Pro, ModelSim integration
- Simulation Models: VHDL and Verilog behavioral models
4. Related Resources
Development Platforms
- Evaluation Boards: Spartan-II development kits and reference boards
- Programming Cables: Platform USB and Parallel Cable III/IV compatibility
- Debug Tools: ChipScope Pro Analyzer support
Complementary Products
- Configuration Memory: Serial and parallel PROM options
- Power Management: Recommended voltage regulators and power supplies
- Oscillators: Compatible clock sources and timing solutions
- Connectors: FTG256-compatible sockets and development accessories
Technical Support
- Community Forums: Xilinx developer community and user groups
- Knowledge Base: Searchable database of solutions and FAQs
- Application Engineering: Technical support for complex implementations
- Training Resources: Online courses and certification programs
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European RoHS directive requirements
- Lead-Free: Compatible with lead-free assembly processes
- Halogen-Free: Environmentally friendly package materials
- REACH Compliance: Conforms to EU chemical regulations
Operating Conditions
- Temperature Grade: Commercial (C) – 0ยฐC to +85ยฐC ambient
- Humidity: 10% to 90% non-condensing
- Storage Temperature: -65ยฐC to +150ยฐC
- ESD Rating: Class 1 (>1000V HBM)
Export Classifications
- ECCN: Export Control Classification Number varies by destination
- Country of Origin: Manufactured in authorized facilities
- Trade Compliance: Subject to international trade regulations
- Documentation: Certificate of compliance available upon request
Quality Standards
- ISO Certification: Manufactured in ISO 9001 certified facilities
- Automotive: Not qualified for automotive applications
- Industrial: Suitable for industrial temperature applications
- Reliability: Comprehensive qualification and testing programs
The XC2S300E-6FTG256C represents a proven solution for applications requiring high-performance programmable logic in a compact, cost-effective package. Its robust feature set and extensive development ecosystem make it an excellent choice for both prototyping and production implementations across diverse industries including telecommunications, industrial automation, and embedded computing systems.
