Product Specifications
Core Features of XC2S300E-6FG456I
- Logic Cells: 300,000 system gates providing extensive programmable logic capacity
- Package Type: 456-pin Fine-Pitch Ball Grid Array (FG456)
- Speed Grade: -6 (high-performance grade for demanding applications)
- Temperature Range: Industrial grade (-40ยฐC to +100ยฐC)
- Supply Voltage: 2.5V core with 3.3V I/O compatibility
- Block RAM: 216 Kbits of dedicated memory blocks
- Distributed RAM: Additional embedded memory resources
- I/O Pins: Up to 333 user I/O pins for maximum connectivity
- Clock Management: Digital Clock Manager (DCM) for precise timing control
Technical Specifications
- Process Technology: 0.15ฮผm CMOS process
- Configuration Memory: SRAM-based for fast reconfiguration
- Power Consumption: Optimized for low-power applications
- Operating Frequency: Up to 200 MHz+ depending on design complexity
- Programming: In-System Programmable (ISP) capability
Price Information
The XC2S300E-6FG456I pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing:
- Small Quantities (1-99 units): Contact for quote
- Volume Pricing (100+ units): Significant discounts available
- Production Quantities (1000+ units): Custom pricing negotiations
Note: Prices subject to change based on market conditions and availability. Request official quotes from authorized distributors for accurate pricing.
Documents & Media
Official Documentation
- Datasheet: XC2S300E-6FG456I complete specifications and electrical characteristics
- User Guide: Spartan-IIE FPGA Family comprehensive implementation guide
- Package Information: FG456 pinout diagrams and mechanical drawings
- Application Notes: Design implementation best practices and optimization techniques
- Errata: Known issues and workarounds for the XC2S300E-6FG456I
Development Resources
- ISE Design Suite: Complete development environment for XC2S300E-6FG456I
- Reference Designs: Proven implementations for common applications
- IP Cores: Pre-verified intellectual property blocks
- Simulation Models: VHDL and Verilog models for design verification
Related Resources
Development Tools
- Xilinx ISE WebPACK: Free development software supporting XC2S300E-6FG456I
- ChipScope Pro: Advanced debugging and analysis tools
- CORE Generator: IP core customization and generation utility
- iMPACT: Configuration and programming software
Compatible Products
- Configuration Devices: Platform Flash PROMs for XC2S300E-6FG456I storage
- Development Boards: Evaluation platforms featuring the XC2S300E-6FG456I
- Programming Cables: USB and parallel cable solutions
- Power Supplies: Recommended power management solutions
Application Areas
- Digital Signal Processing: High-speed filtering and signal conditioning
- Communications: Protocol processing and interface bridging
- Industrial Control: Motor control and automation systems
- Automotive Electronics: Advanced driver assistance systems
- Medical Devices: Real-time processing and data acquisition
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package meeting European environmental standards
- REACH Regulation: Compliant with European chemical safety requirements
- Conflict Minerals: Sourced from conflict-free suppliers
- Green Initiative: Part of Xilinx’s environmental sustainability program
Export Control Information
- ECCN Classification: 3A001.a.7 (subject to US Export Administration Regulations)
- Country Restrictions: Export licensing may be required for certain destinations
- HTS Code: Harmonized Tariff Schedule classification for customs purposes
- COO: Country of Origin documentation available
Quality & Reliability
- Automotive Grade: AEC-Q100 qualified versions available
- Temperature Cycling: Extensive thermal stress testing
- MTBF Rating: Mean Time Between Failure specifications
- Quality Management: ISO 9001 certified manufacturing processes
Package & Handling
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) 3 classification
- Storage Requirements: Proper handling and storage guidelines
- Tray Packaging: Anti-static trays for component protection
- Lead-Free Assembly: Compatible with lead-free soldering processes
The XC2S300E-6FG456I represents an excellent choice for designers seeking a high-performance, cost-effective FPGA solution. Its combination of substantial logic capacity, flexible I/O options, and robust industrial-grade specifications makes it suitable for a wide range of demanding applications. Whether you’re developing next-generation communication systems, implementing complex digital signal processing algorithms, or creating innovative industrial control solutions, the XC2S300E-6FG456I provides the programmable logic resources and performance capabilities needed for successful project implementation.
