Product Specifications
Core Architecture
The XC2S300E-5FT256C features a robust architecture optimized for performance and efficiency:
- Logic Cells: 300,000 system gates equivalent
- Configurable Logic Blocks (CLBs): Advanced CLB architecture with 4-input look-up tables (LUTs)
- Input/Output Pins: 176 user I/O pins for maximum connectivity
- Speed Grade: -5 speed grade for high-performance applications
- Package Type: FT256 Fine-pitch Ball Grid Array (FBGA)
- Operating Voltage: 2.5V core voltage with 3.3V I/O compatibility
Memory and Storage
- Block RAM: Dedicated memory blocks for efficient data storage
- Distributed RAM: Flexible memory implementation using CLB resources
- Configuration Memory: Non-volatile configuration storage capability
Clocking and Timing
- Digital Clock Managers (DCMs): Advanced clock management and distribution
- Maximum Operating Frequency: Up to 200+ MHz depending on design complexity
- Low Skew Global Clock Networks: Optimized for high-speed synchronous designs
Pricing Information
The XC2S300E-5FT256C offers competitive pricing in the mid-range FPGA market segment. Pricing varies based on quantity, distribution channel, and current market conditions. For the most accurate and up-to-date pricing information, contact authorized Xilinx distributors or visit official electronics component suppliers. Volume discounts are typically available for quantities over 100 units.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and timing parameters
- User Guide: Comprehensive implementation and design guidelines
- Application Notes: Specific use-case implementations and best practices
- Pinout Diagrams: Detailed pin assignments and package information
- Timing Reports: Speed and timing characterization data
Development Resources
- ISE Design Suite: Compatible with Xilinx ISE development environment
- Reference Designs: Pre-built design examples and templates
- Simulation Models: VHDL and Verilog behavioral models
- Constraint Files: UCF files for proper pin assignment and timing constraints
Related Resources
Compatible Development Boards
Several development platforms support the XC2S300E-5FT256C for rapid prototyping:
- Xilinx Spartan-II E evaluation boards
- Third-party FPGA development modules
- Custom PCB reference designs
Software Tools
- Xilinx ISE WebPACK: Free development environment
- ModelSim: Advanced simulation and verification tools
- ChipScope Pro: Integrated logic analyzer for debugging
Technical Support
- Online knowledge base and community forums
- Application engineering support
- Training courses and webinars
Environmental & Export Classifications
Environmental Specifications
The XC2S300E-5FT256C meets stringent environmental standards:
- Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature Range: -65ยฐC to +150ยฐC
- Humidity: 10% to 85% non-condensing
- RoHS Compliance: Lead-free, environmentally friendly manufacturing
- Halogen-Free: Meets halogen-free requirements for green electronics
Quality and Reliability
- JEDEC Standards: Compliant with industry reliability standards
- Mean Time Between Failures (MTBF): >1,000,000 hours at 25ยฐC
- ESD Protection: Robust electrostatic discharge protection
Export Classifications
- ECCN: Export Control Classification Number compliance
- Country of Origin: Manufacturing location specifications
- Trade Compliance: Meets international trade regulations
The XC2S300E-5FT256C represents an excellent balance of performance, features, and cost-effectiveness, making it suitable for applications including digital signal processing, communications systems, industrial automation, and embedded control systems. Its proven Spartan-II E architecture ensures reliable operation while providing the flexibility needed for complex digital designs.
