Product Specifications
The XC2S200E-7FT256C features robust specifications that make it suitable for demanding applications:
Core Architecture:
- Device Family: Spartan-II
- Logic Cells: 200,000 system gates
- CLBs (Configurable Logic Blocks): 1,176 CLBs
- Block RAM: 56 Kbits total memory
- I/O Pins: 176 user I/O pins
- Speed Grade: -7 (high performance)
Package Details:
- Package Type: FT256 (Fine-pitch Ball Grid Array)
- Pin Count: 256 pins
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Supply Voltage: 2.5V core, 3.3V I/O
Performance Characteristics:
- Maximum System Clock: Up to 200 MHz
- Power Consumption: Optimized for low-power applications
- Configuration Time: Fast configuration capability
- Propagation Delay: Industry-leading timing performance
Price
The XC2S200E-7FT256C pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing information and volume discounts. Typical price ranges fall within the mid-tier FPGA category, offering excellent value for the performance delivered.
Pricing Considerations:
- Volume pricing available for orders over 100 units
- Educational discounts may apply for academic institutions
- Long-term supply agreements available
- Contact suppliers for real-time pricing and availability
Documents & Media
Technical Documentation:
- Datasheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation guidelines
- Application Notes: Design best practices and optimization techniques
- IBIS Models: Signal integrity simulation models
- Package Information: Mechanical drawings and thermal data
Development Resources:
- ISE Design Suite compatibility
- Reference designs and example projects
- Constraint files and UCF templates
- Simulation models for major EDA tools
Support Materials:
- Product selection guides
- Migration guides from other FPGA families
- PCB design guidelines
- Thermal management recommendations
Related Resources
Development Tools:
- Xilinx ISE Design Suite: Complete development environment
- ChipScope Pro: Integrated logic analyzer
- EDK (Embedded Development Kit): Embedded processor design
- WebPACK: Free version of ISE for smaller devices
Evaluation Boards:
- Spartan-II development boards
- Third-party evaluation platforms
- Educational training kits
- Prototype development systems
Complementary Products:
- Configuration PROMs
- Clock management devices
- Power management solutions
- Interface and connectivity components
Design Services:
- Xilinx Alliance Program partners
- Design consulting services
- IP core libraries
- Training and certification programs
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Compliant with EU chemical regulations
- Conflict Minerals: Conflict-free sourcing certified
- Green Product: Environmentally conscious design
Quality Standards:
- ISO 9001: Quality management system certified
- Automotive Grade: AEC-Q100 qualified versions available
- Military/Aerospace: Extended temperature and screening options
- Industrial Grade: Enhanced reliability specifications
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.2
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Varies by manufacturing location
- Export License: May require export authorization for certain destinations
Packaging and Handling:
- Moisture Sensitivity Level: MSL 3
- ESD Classification: Class 1C sensitive device
- Storage Requirements: Dry pack storage recommended
- Handling Procedures: Anti-static precautions required
The XC2S200E-7FT256C represents an excellent balance of performance, cost-effectiveness, and design flexibility, making it a preferred choice for engineers developing next-generation digital systems across multiple industries including telecommunications, industrial automation, medical devices, and consumer electronics.
