Product Specifications
Core Architecture
- Device Family: Spartan-II E series
- Logic Cells: 200,000 equivalent system gates
- CLBs (Configurable Logic Blocks): 1,176 total CLBs
- Flip-Flops: 4,704 maximum user flip-flops
- Block RAM: 56 Kbits total block RAM
- Speed Grade: -6 (high-performance grade)
Package Details
- Package Type: PQ208 (Plastic Quad Flat Pack)
- Pin Count: 208 pins
- Temperature Grade: Industrial (-40ยฐC to +85ยฐC)
- Package Dimensions: 28mm x 28mm body size
- Lead Pitch: 0.5mm
I/O Specifications
- User I/O Pins: 146 maximum user I/O
- Voltage Standards: Supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL+
- Single-Ended I/O Standards: 3.3V, 2.5V, 1.8V, and 1.5V support
- Differential I/O: LVDS, LVPECL support available
Performance Characteristics
- System Clock: Up to 200+ MHz internal performance
- Power Consumption: Low power design optimized for battery-powered applications
- Configuration: SRAM-based configuration with multiple configuration modes
Price Information
Pricing for the XC2S200E-6PQ208I varies based on quantity, distribution channel, and current market conditions. For the most accurate and up-to-date pricing information:
- Contact authorized Xilinx distributors
- Request quotes for volume purchases
- Check electronic component suppliers for current availability
- Consider lead times for production planning
Note: Prices are subject to change based on market conditions and quantity requirements.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Spartan-II FPGA User Guide with detailed architecture information
- Package Information: Mechanical drawings and package specifications
- Pin Mapping: Complete pinout diagrams and I/O bank assignments
Design Resources
- Reference Designs: Application-specific design examples
- Constraint Files: UCF templates for timing and placement constraints
- Simulation Models: IBIS and SPICE models for signal integrity analysis
- Development Tools: ISE Design Suite compatibility information
Application Notes
- Configuration and programming guidelines
- Power management recommendations
- PCB layout best practices
- Thermal management considerations
Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete design environment for synthesis, implementation, and programming
- ChipScope Pro: Integrated logic analyzer for debugging
- PlanAhead: Advanced floorplanning and analysis tool
Evaluation Boards
- Spartan-II E starter kits and development boards
- Third-party evaluation platforms
- Reference design demonstrations
Support Resources
- Xilinx technical support and documentation
- Community forums and knowledge base
- Training materials and webinars
- Application engineering support
Compatible Components
- Configuration memory devices (Platform Flash, serial PROM)
- Power management solutions
- Clock generation and distribution circuits
- Interface components and connectors
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package meets RoHS directives
- Halogen-Free: Environmentally friendly package materials
- REACH Compliant: Meets European chemical safety regulations
- Green Package: Xilinx green package initiative compliant
Operating Conditions
- Operating Temperature: -40ยฐC to +85ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Non-condensing environments
- ESD Rating: HBM Class 1C (โฅ2000V)
Export Classifications
- ECCN (Export Control Classification Number): Subject to US export regulations
- Country of Origin: Manufacturing location specifications
- Trade Compliance: International shipping and handling requirements
- Documentation: Certificate of origin and compliance documentation available
Quality Standards
- Qualification Level: Industrial grade qualification
- Reliability Standards: Meets JEDEC standards for semiconductor reliability
- Quality System: ISO 9001 certified manufacturing
- Traceability: Full lot traceability and quality documentation
The XC2S200E-6PQ208I represents an excellent balance of performance, features, and cost-effectiveness for demanding FPGA applications. Its industrial temperature range and robust package make it suitable for harsh environment deployments while maintaining the flexibility and programmability that make FPGAs the preferred choice for complex digital designs.
