1. Product Specifications
Core Architecture
- Logic Cells: 5,292 configurable logic cells
- System Gates: 71,000 – 200,000 (logic and RAM combined)
- CLB Array: 28 x 42 matrix (1,176 total CLBs)
- Technology Node: 0.15 micron CMOS process
- Operating Voltage: 1.8V core, 3.3V I/O
Memory Resources
- Distributed RAM: 75,264 bits
- Block RAM: 56K bits configurable dual-port
- SelectRAMโข Hierarchical Memory: 16 bits/LUT distributed RAM support
I/O and Connectivity
- User I/O Pins: 289 maximum available
- Differential I/O Pairs: Up to 120 pairs
- I/O Standards: 19 supported standards including LVTTL, LVCMOS, HSTL, SSTL, LVDS, GTL
- Package: 256-pin Fine Pitch Ball Grid Array (FTBGA256)
- Speed Grade: -6 (357 MHz maximum system performance)
Advanced Features
- DLLs (Delay-Locked Loops): 4 dedicated for advanced clock control
- Global Clock Networks: 4 primary low-skew distribution nets
- Dedicated Carry Logic: High-speed arithmetic operations
- Boundary Scan: IEEE 1149.1 compatible
- PCI Compliance: Fully 3.3V PCI compliant to 64 bits at 66 MHz
2. Price Information
Current Market Pricing (2025):
- Distributor Availability: Stock available from multiple authorized distributors with quantities ranging from 160 to 2,746+ pieces
- Price Range: Contact distributors for current pricing (prices vary by quantity and supplier)
- Lead Time: Typically in stock for immediate shipment
- Packaging: Anti-static ESD protection included
Authorized Distributors:
- Mouser Electronics
- DigiKey
- Various specialty component distributors
Note: Pricing subject to market conditions and quantity breaks. Contact authorized distributors for current quotations.
3. Documents & Media
Technical Documentation
- Primary Datasheet: DS077-1 (v2.3) Spartan-IIE FPGA Family Specification
- User Guides: Complete ISE development system documentation
- Application Notes: Available through AMD Xilinx documentation portal
- Package Information: 256-pin FTBGA mechanical drawings and specifications
Development Resources
- Design Software: Xilinx ISE Development System (legacy support)
- IP Library: Extensive library including DSP functions and soft processors
- Reference Designs: Available through Xilinx design centers
- Migration Guides: Upgrade paths to current FPGA families
Support Materials
- PCN (Product Change Notifications): Available through AMD Xilinx
- Errata Documentation: Known issues and workarounds
- Thermal Management: Junction temperature and package thermal data
4. Related Resources
Compatible Products
- Configuration Memory: Compatible with Xilinx configuration PROMs
- Development Boards: Legacy Spartan-IIE evaluation platforms
- Cable Solutions: JTAG programming cables and adapters
Design Migration
- Upgrade Path: Migration available to current Spartan-7, Artix-7, or Zynq families
- Pin Compatibility: Consider family footprint compatibility for future designs
- Performance Scaling: Modern alternatives offer improved performance/power ratios
Technical Support
- Legacy Support: Continued support through AMD Xilinx technical forums
- Community Resources: Active user community and design examples
- Training Materials: Historical documentation and design methodologies
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS compliant (Restriction of Hazardous Substances Directive 2011/65/EU)
- REACH Compliance: Compliant with EU REACH regulations for chemical safety
- Lead-Free: Pb-free package options available
- Halogen-Free: Meets halogen-free requirements where specified
Export and Trade Classifications
- Country of Origin: Manufactured in various global locations
- ECCN Classification: Subject to U.S. Export Administration Regulations
- ITAR Status: Not subject to International Traffic in Arms Regulations
- Conflict Minerals: Compliant with conflict minerals reporting requirements
Operating Environment
- Operating Temperature: Commercial (0ยฐC to +85ยฐC) and Industrial (-40ยฐC to +100ยฐC) grades available
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 10% to 85% non-condensing
- MSL Rating: Moisture Sensitivity Level per JEDEC standards
Quality Standards
- ISO Certification: Manufactured in ISO 9001 certified facilities
- Quality Assurance: 100% functional testing and burn-in available
- Reliability Data: MTBF and FIT rate data available upon request
- Traceability: Full supply chain traceability and documentation
Key Benefits & Applications
Ideal Applications:
- Legacy system maintenance and upgrades
- Communications infrastructure
- Industrial control systems
- Automotive electronics
- Medical device implementations
- Aerospace and defense systems
Competitive Advantages:
- Proven reliability in deployed systems
- Cost-effective solution for moderate complexity designs
- Extensive ecosystem support and documentation
- Field-upgradeable functionality eliminates costly hardware revisions
For the latest technical specifications, pricing, and availability, please contact authorized AMD Xilinx distributors or visit the official AMD Xilinx documentation portal.
