1. Product Specifications
Core Architecture
- Device Family: Spartan-IIE
- System Gates: 200,000
- Logic Cells: 5,292
- Configurable Logic Blocks (CLBs): 1,176
- CLB Array: 28 ร 42
- Maximum Operating Frequency: 357 MHz
- Technology Node: 0.15 micron
Memory Resources
- Block RAM: 56K bits (14 blocks ร 4K bits each)
- Distributed RAM: 75,264 bits
- RAM Configuration: Dual-port block RAM with configurable aspect ratios (1ร4096 to 16ร256)
I/O Capabilities
- Maximum User I/O: 289 pins
- Maximum Differential I/O Pairs: 120
- I/O Banks: 8 independent banks with individual VCCO control
- Supported I/O Standards: 19 standards including:
- LVTTL (3.3V)
- LVCMOS (1.8V, 2.5V)
- LVDS, LVPECL (differential signaling)
- HSTL, SSTL2/3, GTL, CTT
- PCI 33/66 MHz compliant
- AGP 1ร/2ร compliant
Package Details
- Package Type: FTG256 (Fine-pitch Ball Grid Array)
- Pin Count: 256 pins
- Package Dimensions: 17mm ร 17mm
- Ball Pitch: 1.0mm
- Package Height: 1.55mm (max)
- Package Mass: 1.0g (ยฑ10%)
Power Requirements
- Core Voltage (VCCINT): 1.8V ยฑ5%
- I/O Voltage (VCCO): 1.5V to 3.3V (bank dependent)
- Quiescent Current (ICCINT): <300mA typical
- Data Retention Voltage: 1.5V minimum
Operating Conditions
- Commercial Grade (C-suffix): 0ยฐC to +85ยฐC junction temperature
- Industrial Grade (I-suffix): -40ยฐC to +100ยฐC junction temperature
- Speed Grade: -6 (6ns maximum delay)
Advanced Features
- Delay-Locked Loops (DLLs): 4 units for clock management
- Dedicated Carry Logic: Fast arithmetic operations
- Boundary Scan: IEEE 1149.1 compliant
- Hot-Swap Support: CompactPCI friendly
- Configuration Options: Master/Slave Serial, Slave Parallel, Boundary Scan
- Unlimited Reprogrammability: SRAM-based configuration
2. Pricing Information
Market Availability
Current Status: Obsolete/Discontinued (2013) – Available through specialized distributors
Typical Pricing Ranges*
- Small Quantities (1-9 units): $150-300 USD
- Medium Quantities (10-99 units): $120-250 USD
- Large Quantities (100+ units): Request for quotation (RFQ)
Authorized Distributors
- Ariat Technology Ltd.
- Ovaga Technologies
- IC-Components Limited
- Various regional electronics distributors
Procurement Notes
- Prices vary significantly based on supplier and availability
- Lead times may be extended due to obsolete status
- New and original parts available with warranties (typically 1 year)
- Alternative packaging options may affect pricing
*Prices are estimates based on current market research and may vary
3. Documents & Media
Official Documentation
- Primary Datasheet: DS077 – Spartan-IIE FPGA Family Data Sheet (4 modules)
- Module 1: Introduction and Ordering Information
- Module 2: Functional Description
- Module 3: DC and Switching Characteristics
- Module 4: Pinout Tables
Design Resources
- Package Drawings: Mechanical specifications and dimensions
- IBIS Models: For signal integrity analysis
- BSDL Files: Boundary scan description language files
- Thermal Data: Junction-to-ambient thermal resistance specifications
Development Tools
- ISE Design Suite: Legacy Xilinx development environment
- CORE Generator: Pre-verified IP library
- ChipScope Pro: Real-time debugging and analysis
Application Notes
- XAPP176: Configuration and Readback
- XAPP179: Using SelectIO Interfaces
- XAPP174: Using Delay-Locked Loops (DLLs)
- XAPP450: Power-On Current Requirements
4. Related Resources
Compatible Family Members
- XC2S50E-6FTG256C – 50,000 gates (smaller capacity)
- XC2S150E-6FTG256C – 150,000 gates
- XC2S300E-6FTG256C – 300,000 gates (larger capacity)
- XC2S400E-6FTG256C – 400,000 gates
Alternative Package Options
- XC2S200E-6PQG208C – 208-pin Plastic Quad Flat Pack
- XC2S200E-6FGG456C – 456-pin Fine-pitch Ball Grid Array
- XC2S200E-6TQG144C – 144-pin Thin Quad Flat Pack
Speed Grade Variants
- XC2S200E-7FTG256C – Faster speed grade (-7)
- XC2S200E-6FTG256I – Industrial temperature range
Migration Path
- Spartan-3E Series: XC3S200E (recommended migration path)
- Spartan-6 Series: XC6SLX16 (modern equivalent)
- Spartan-7 Series: XC7S15 (current generation)
Development Boards
- Spartan-IIE Starter Kit (discontinued)
- Third-party evaluation boards
- Custom PCB reference designs
Support Communities
- Xilinx Community Forums (legacy device section)
- FPGA development forums
- Academic and research institutions using legacy devices
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Pre-RoHS (contains lead)
- Pb-Free Alternative: XC2S200E-6FTGG256C (with “G” suffix)
- REACH Compliance: Material Declaration Data Sheets (MDDS) available
- Halogen Status: Contains halogens
Package Environmental Data
- Moisture Sensitivity Level (MSL): Level 3
- Peak Reflow Temperature: 260ยฐC (Pb-containing packages)
- Storage Conditions: -55ยฐC to +150ยฐC
- ESD Sensitivity: Class 1 (>2000V HBM)
Export Control Classification
- ECCN (Export Control Classification Number): 3A001.a.2
- HTS Code: 8542.31.0001
- Country of Origin: Varies by manufacturing location
- Export License: May be required for certain destinations
Quality Standards
- ISO Certification: Manufacturing facilities ISO 9001 certified
- Quality Grade: Industrial standard
- Screening Level: Commercial/Industrial grade testing
- Reliability Data: MTBF data available upon request
Packaging & Handling
- Anti-Static Packaging: Required (ESD sensitive)
- Tape and Reel: Available for automated assembly
- Handling Precautions: MSL 3 requires baking before reflow
- Storage Requirements: Dry storage recommended
Compliance Certifications
- JEDEC Standards: Package and test method compliance
- IPC Standards: PCB assembly guidelines compliance
- FCC/CE: End-product certification required based on application
Summary
The XC2S200E-6FTG256C remains a capable FPGA solution for legacy system support and cost-sensitive applications requiring moderate logic density. While obsolete, its proven architecture, comprehensive I/O capabilities, and robust design make it suitable for maintaining existing designs and educational applications. Users should consider migration to current-generation devices for new designs while leveraging available stock for maintenance and legacy support requirements.
For technical support and detailed application guidance, consult the complete Spartan-IIE documentation package and consider engaging with specialized FPGA distributors who maintain expertise in legacy device support.
