1. Product Specifications
Core Architecture
- Device Family: Spartan-IIE 1.8V FPGA
- Manufacturer: Xilinx (now AMD)
- Part Number: XC2S200E-6FT256Q
- System Gates: 200,000 gates
- Logic Cells: 5,292 cells
- Configurable Logic Blocks (CLBs): 1,176 CLBs
Performance Characteristics
- Maximum Operating Frequency: 357 MHz
- Speed Grade: -6 (commercial grade timing)
- Supply Voltage: 1.8V core, 3.3V I/O
- Technology Node: 0.15ฮผm CMOS process
- Power Consumption: Low power consumption optimized design
Memory Resources
- Block RAM: Up to 288K bits configurable dual-port block RAM
- Distributed RAM: Up to 221,184 bits using LUT-based distributed RAM
- SelectRAM Hierarchical Memory: 16 bits/LUT distributed RAM
Package & Pinout
- Package Type: 256-pin Fine Pitch Ball Grid Array (FPPBGA)
- Package Code: FT256Q
- Package Dimensions: 17mm x 17mm
- Ball Pitch: 1.0mm
- Automotive Grade: Q-suffix indicates automotive qualification
- Pin Count: 256 pins total with up to 200+ user I/O pins
I/O Features
- I/O Standards Supported: 19 selectable I/O standards including LVTTL, LVCMOS, PCI, GTL+
- I/O Banks: 8 independent I/O banks for flexible voltage support
- Differential Signaling: Support for LVDS and other differential standards
- 3-State Buffers: Integrated 3-state buffer capability
Clock Management
- Delay-Locked Loops (DLLs): 4 DLLs for clock management and skew elimination
- Clock Distribution: Low-skew global clock distribution network
- Clock Inputs: Multiple dedicated clock input pins
Special Features
- Boundary Scan: IEEE 1149.1 JTAG boundary scan support
- Configuration Options: Multiple configuration modes (Master Serial, Slave Serial, Slave Parallel, Boundary Scan)
- Reprogrammability: Unlimited in-system reprogramming cycles
- Design Security: Optional bitstream encryption support
2. Price Information
Current Market Pricing (July 2025)
Note: Pricing varies significantly based on quantity, availability, and distributor. The XC2S200E-6FT256Q is considered a legacy/mature product with limited availability.
Estimated Price Ranges:
- Small Quantities (1-99 units): $150 – $300 per unit
- Medium Quantities (100-999 units): $120 – $200 per unit
- Large Quantities (1000+ units): $89 – $150 per unit
- Automotive Grade Premium: 15-30% premium over commercial variants
Factors Affecting Pricing:
- Limited production status (not recommended for new designs)
- Automotive qualification premium
- Supply chain availability
- Long-term support requirements
- Distributor inventory levels
Cost-Effective Alternatives: For new designs, consider newer Spartan-7 or Artix-7 families offering better performance per dollar with active product status.
3. Documents & Media
Official Documentation
- Product Data Sheet: DS077 – Spartan-IIE FPGA Family Complete Data Sheet
- User Guide: UG002 – Spartan-IIE FPGA User Guide
- Package Information: Package drawings and thermal characteristics
- Pin Assignment: Comprehensive pinout tables and I/O bank assignments
Design Resources
- Reference Designs: Application-specific reference implementations
- Constraint Files: UCF (User Constraint File) templates
- PCB Layout Guidelines: Routing recommendations and signal integrity guidelines
- Thermal Management: Junction temperature and power dissipation calculations
Software & Tools
- ISE Design Suite: Legacy development environment (ISE 14.7 final version)
- Impact Programming Tool: Device configuration and programming
- ChipScope Pro: Integrated logic analyzer for debugging
- CORE Generator: IP core generation and customization
Application Notes
- Configuration Guide: Multiple configuration mode implementations
- Clock Domain Crossing: Best practices for multi-clock designs
- Power Optimization: Techniques for minimizing power consumption
- Signal Integrity: High-speed design considerations
4. Related Resources
Development Platforms
- Spartan-IIE Starter Kit: Complete development platform with XC2S200E device
- Evaluation Boards: Third-party boards supporting automotive applications
- Programming Cables: USB and parallel cable options for device configuration
Compatible IP Cores
- Processor Cores: MicroBlaze soft processor implementation
- Communication Interfaces: UART, SPI, I2C, CAN controller IP
- Memory Controllers: DDR, SRAM, and Flash memory interfaces
- DSP Functions: FIR filters, FFT, and other signal processing cores
Migration Paths
- Spartan-6 Family: Pin-compatible upgrades with enhanced performance
- Spartan-7 Family: Modern replacement with improved power efficiency
- Artix-7 Family: Higher performance alternative for demanding applications
Support Resources
- AMD Xilinx Forums: Community support and technical discussions
- Application Engineers: Direct technical support for complex implementations
- Training Materials: Online courses and documentation
- Third-Party Services: Design services and consulting partners
Ecosystem Partners
- EDA Tool Support: Mentor Graphics, Synopsys, Cadence tool compatibility
- IP Vendors: Extensive third-party IP core ecosystem
- Board Manufacturers: Carrier boards and development platforms
- Contract Manufacturers: Automotive-qualified assembly services
5. Environmental & Export Classifications
Automotive Qualification
- Grade: Automotive Grade (Q-suffix designation)
- Temperature Range: Extended automotive temperature range (-40ยฐC to +125ยฐC junction)
- Reliability Standards: Enhanced screening and qualification testing
- Quality System: ISO/TS 16949 automotive quality management
- Moisture Sensitivity Level: MSL-3 (168 hours at 30ยฐC/60% RH)
Environmental Compliance
- RoHS Compliance: EU RoHS Directive 2011/65/EU compliant (lead-free)
- REACH Regulation: Compliant with EU REACH regulation
- Conflict Minerals: Compliant with conflict minerals regulations
- Halogen-Free: Available in halogen-free package variants
- Green Package: Environmentally friendly packaging options
Export Control Classification
- ECCN: 3A001.a.7 (Export Control Classification Number)
- Export License: May require export license for certain destinations
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufactured in multiple locations (check specific lot codes)
- Dual-Use Technology: Subject to dual-use export control regulations
Operating Conditions
- Operating Temperature:
- Commercial (C): 0ยฐC to +85ยฐC
- Industrial (I): -40ยฐC to +100ยฐC
- Automotive (Q): -40ยฐC to +125ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Supply Voltage Tolerance: ยฑ5% for core voltage, ยฑ10% for I/O voltage
- Humidity: 10% to 90% non-condensing
Reliability & Quality
- MTBF: >1,000,000 hours at 25ยฐC operating temperature
- Qualification Standards: JEDEC standards for automotive applications
- Test Coverage: 100% production testing including boundary scan
- Traceability: Full lot traceability for automotive applications
- Warranty: Standard manufacturer warranty terms apply
Safety & Certifications
- Functional Safety: Suitable for automotive safety-critical applications with proper design
- EMC Compliance: Supports automotive EMC requirements
- ESD Protection: Enhanced ESD protection for automotive environments
- Latch-up Immunity: Automotive-grade latch-up protection
Important Notice: The XC2S200E-6FT256Q is a mature product that may have limited availability. For new designs, AMD Xilinx recommends considering newer FPGA families that offer improved performance, lower power consumption, and long-term product availability. Contact authorized distributors for current availability and pricing information.
Keywords: XC2S200E-6FT256Q, Xilinx FPGA, Spartan-IIE, automotive FPGA, programmable logic, 200K gates, 357MHz, BGA256, automotive grade semiconductor
