XC2S200E-4FG456C – Xilinx Spartan-IIE FPGA Product Description

1. Product Specifications

Core Architecture

• Device Family: Xilinx Spartan-IIE 1.8V FPGA
• Part Number: XC2S200E-4FG456C
• Logic Cells: 5,292 configurable logic cells
• System Gates: 71,000 to 200,000 (Logic and RAM)
• CLB Array: 28 x 42 (1,176 total CLBs)
• Speed Grade: -4 (4ns delay)
• Operating Voltage: 1.8V core, multiple I/O standards supported

Memory Resources

• Block RAM: 56K bits total (14 blocks of 4K bits each)
• Distributed RAM: 75,264 bits maximum
• SelectRAM™ Hierarchical Memory: 16 bits/LUT distributed RAM
• Configurable 4K-bit true dual-port block RAM

I/O Capabilities

• Maximum User I/O: 289 pins
• Available I/O (FG456 Package): 289 user I/O pins
• Differential I/O Pairs: 120 maximum
• I/O Standards Supported: 19 selectable standards including:
  • LVTTL, LVCMOS (1.8V, 2.5V)
  • LVDS, LVPECL (differential signaling)
  • PCI 3.3V (33MHz/66MHz compliant)
  • HSTL, SSTL2/3, CTT, AGP, GTL/GTL+

Clock Management

• Global Clock Networks: 4 dedicated low-skew global clocks
• Delay-Locked Loops (DLLs): 4 DLLs for advanced clock control
• Clock Multiplication/Division: Support for clock synthesis
• Maximum System Performance: Beyond 200 MHz

Package Details

• Package Type: FG456 (456-pin Fine-pitch Ball Grid Array)
• Package Dimensions: 23mm x 23mm
• Ball Pitch: 1.0mm
• Height: 2.60mm
• Lead-Free Options: Available (FGG456 variant)

Technology

• Process Technology: 0.15 micron CMOS
• Architecture: Based on proven Virtex-E platform
• Configuration: Unlimited in-system reprogrammability
• Configuration Memory: Static RAM cells

---

2. Pricing Information

Current Market Pricing

• Price Range: Contact authorized distributors for current pricing
• Availability: In stock at multiple electronic component distributors
• Stock Levels:
  • Xilinx-ADM: 2,645+ pieces available
  • Various distributors maintain inventory for immediate shipment

Purchasing Options

• Minimum Order Quantity: Varies by distributor (typically 1+ pieces)
• Volume Discounts: Available for larger quantities
• Lead Times: Most distributors offer same-day or next-day shipping
• Payment Methods: Wire transfer, PayPal, corporate accounts accepted

Cost-Effective Alternative

The XC2S200E-4FG456C provides a superior alternative to mask-programmed ASICs, eliminating:

• High initial NRE costs
• Lengthy development cycles
• Manufacturing risks
• Hardware replacement costs for design updates

---

3. Documents & Media

Official Documentation

• Datasheet: DS077 Spartan-IIE FPGA Family Data Sheet
  • Module 1: Introduction and Ordering Information
  • Module 2: Functional Description
  • Module 3: DC and Switching Characteristics
  • Module 4: Pinout Tables

Technical Resources

• Application Notes:
  • XAPP179: Using SelectIO Interfaces in Spartan-II and Spartan-IIE FPGAs
  • XAPP176: Configuration and Readback of Spartan-II and Spartan-IIE FPGA Families
  • XAPP174: DLL Implementation and Usage
  • XAPP173: Block RAM Usage Guide

Development Tools

• ISE Design Suite: Complete development environment
• CORE Generator™: IP library with optimized functions
• ChipScope™ Pro: Real-time verification and debugging
• FPGA Editor: Low-level design implementation tool

Package Information

• Mechanical Drawings: Available from Xilinx documentation
• IBIS Models: For signal integrity analysis
• Thermal Models: Junction-to-ambient thermal resistance data
• BSDL Files: Boundary scan description language files

---

4. Related Resources

Development Boards & Kits

• Spartan-IIE Evaluation Boards: For rapid prototyping
• Compatible Development Platforms: Third-party evaluation boards
• Reference Designs: Example implementations and tutorials

Software Tools

• Xilinx ISE WebPACK: Free development software
• ModelSim: HDL simulation environment
• ChipScope Pro: In-system verification tool
• CORE Generator: Optimized IP cores library

Technical Support

• Xilinx Answer Database: Searchable technical solutions
• Application Engineers: Direct technical support
• Community Forums: User-to-user assistance
• Training Courses: Online and instructor-led training

Compatible Devices

• Pin-Compatible Upgrades: XC2S300E-4FG456C for higher density
• Package Alternatives:
  • XC2S200E-4FT256C (256-pin FBGA)
  • XC2S200E-4PQ208C (208-pin PQFP)
• Speed Grade Options: -6 and -7 speed grades available

Configuration Solutions

• Platform Flash PROMs: In-system programmable configuration memory
• Serial Configuration: Master/slave serial modes
• Parallel Configuration: High-speed SelectMAP interface
• JTAG Programming: Boundary scan configuration capability

---

5. Environmental & Export Classifications

RoHS Compliance

• Lead-Free Status: RoHS compliant options available
• Green Package Options: FGG456 variant for lead-free requirements
• Environmental Compliance: Meets international environmental standards

Operating Conditions

• Commercial Temperature Range: 0°C to +85°C junction temperature
• Industrial Temperature Range: -40°C to +100°C (select variants)
• Supply Voltage Tolerance: ±5% on VCCINT (1.8V core)
• I/O Voltage Range: 1.2V to 3.6V depending on standard

Reliability & Quality

• Quality Standards: ISO 9001 certified manufacturing
• Reliability Testing: Comprehensive qualification program
• ESD Protection: Built-in electrostatic discharge protection
• Latch-up Immunity: CMOS latch-up resistant design

Export Control Information

• Export Classification: Subject to U.S. Export Administration Regulations
• ECCN: Check current export control classification
• International Shipping: Available through authorized distributors worldwide
• Country Restrictions: Verify current export restrictions before ordering

Package Materials

• Substrate Material: BT (Bismaleimide Triazine) resin
• Ball Material: Lead-free solder (RoHS versions)
• Moisture Sensitivity Level: MSL 3 (168 hours at 30°C/60% RH)
• Storage Requirements: Anti-static packaging required

Thermal Characteristics

• Junction-to-Case (θJC): 3.9°C/W
• Junction-to-Board (θJB): 11.4°C/W
• Junction-to-Ambient (θJA): 21.9°C/W (still air)
• Maximum Power Dissipation: Varies with operating conditions

---

Applications

The XC2S200E-4FG456C is ideal for:

• Digital Signal Processing: High-performance DSP implementations
• Communications Systems: Protocol processing and interface control
• Industrial Control: Automation and process control systems
• Automotive Electronics: Advanced driver assistance systems
• Medical Devices: Real-time signal processing applications
• Aerospace & Defense: Mission-critical embedded systems
• Prototyping: Rapid proof-of-concept development

---

Why Choose XC2S200E-4FG456C?

✅ Proven Architecture: Based on industry-leading Virtex-E platform
✅ Cost-Effective: Lower total cost of ownership vs. ASICs
✅ High Performance: System speeds beyond 200 MHz
✅ Flexible I/O: 19 industry-standard I/O interfaces
✅ Rich Memory: Hierarchical memory architecture with block RAM
✅ Design Security: Unlimited reprogrammability for updates
✅ Comprehensive Tools: Complete development ecosystem
✅ Wide Availability: Multiple authorized distributors worldwide

---

For technical support, pricing, and availability information, contact your local authorized Xilinx distributor or visit the official Xilinx documentation portal.