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XC2S150E-7FTG256C FPGA: Compact Spartan-II Series Field-Programmable Gate Array

Original price was: $20.00.Current price is: $19.00.

Product Specifications

The XC2S150E-7FTG256C delivers comprehensive technical capabilities optimized for mid-range applications:

Logic Capacity & Performance:

  • System gates: 150,000 gates
  • Logic cells: 3,456 configurable logic blocks
  • Speed grade: -7 (standard performance)
  • Maximum frequency: Up to 180 MHz
  • Flip-flops: 3,456 available

Memory Architecture:

  • Block RAM: 38 Kbits total embedded memory
  • Distributed RAM: Integrated within configurable logic blocks
  • Memory blocks: 10 x 4K bit dual-port block RAMs
  • Memory flexibility for data buffering and storage

I/O Configuration:

  • Package type: FTG256 (Thin Fine-pitch Ball Grid Array)
  • Total I/O pins: 176 user I/O pins
  • Voltage standards: Multiple I/O standard support including LVTTL, LVCMOS, PCI, and GTL
  • Differential pair support available

Physical Characteristics:

  • Package: 256-pin Thin Fine-pitch BGA
  • Operating temperature: Commercial grade (0ยฐC to +85ยฐC)
  • Supply voltage: 2.5V core with flexible I/O voltage options
  • Low power consumption design

Price Information

The XC2S150E-7FTG256C offers competitive pricing for mid-range FPGA applications. Current pricing ranges from $35-$120 per unit based on order quantity and market conditions. Contact authorized Xilinx distributors for:

  • Volume pricing schedules
  • Stock availability updates
  • Lead time information
  • Special pricing for high-volume applications

Documents & Media

Technical Documentation:

  • XC2S150E-7FTG256C complete datasheet with electrical specifications
  • Spartan-II FPGA family comprehensive user guide
  • FTG256 package mechanical drawings and pinout diagrams
  • Timing characteristics and AC/DC parameter specifications
  • Configuration and programming reference manual

Design Resources:

  • PCB design guidelines for FTG256 package
  • Power supply design recommendations
  • Clock distribution best practices
  • Signal integrity guidelines for high-speed designs
  • Thermal analysis and heat dissipation guidance

Application Notes:

  • Digital signal processing implementation guides
  • Communication protocol implementation examples
  • Power optimization techniques for battery-powered applications

Related Resources

Development Environment:

  • Xilinx ISE Design Suite full compatibility
  • WebPACK design software support (free version)
  • ChipScope Pro integrated logic analyzer
  • Third-party synthesis tool compatibility (Synplify, Leonardo)

Compatible Devices:

  • XC2S100E and XC2S200E for design scalability
  • XC18V configuration memory devices
  • Power management solutions for optimal performance
  • Clock synthesis and jitter cleanup devices

Target Applications:

  • Handheld and portable device controllers
  • Wireless communication systems
  • Industrial sensor interfaces
  • Medical device electronics
  • Consumer electronics applications
  • Educational FPGA development platforms

Design Tools & IP:

  • LogiCORE IP library compatibility
  • DSP48 slice utilization guides
  • Memory controller IP cores
  • Communication protocol stacks

Environmental & Export Classifications

Environmental Compliance:

  • RoHS compliant manufacturing (lead-free assembly)
  • REACH regulation full compliance
  • Halogen-free package options available
  • Green manufacturing process certification

Operating Specifications:

  • Commercial temperature range: 0ยฐC to +85ยฐC
  • Extended temperature versions available on request
  • Junction temperature rating: Up to +125ยฐC maximum
  • Humidity tolerance: Non-condensing operation
  • ESD protection: Human Body Model and Machine Model compliant

Export Control Information:

  • ECCN (Export Control Classification Number): 3A991.a.2
  • HTS (Harmonized Tariff Schedule): 8542.31.0001
  • Country of origin marking: As per manufacturing location
  • Export documentation available for international shipments

Quality & Reliability:

  • ISO 9001:2015 certified manufacturing
  • Automotive-grade versions available (AEC-Q100 qualified)
  • Military temperature range options through special programs
  • Comprehensive reliability testing including HTOL, TC, and ELFR

Package Information:

  • Moisture sensitivity level: MSL-3 per IPC/JEDEC standards
  • Lead-free solder compatibility
  • Package marking includes date code and lot traceability
  • Anti-static handling requirements

The XC2S150E-7FTG256C delivers proven FPGA performance in a compact package, supported by mature development tools and extensive documentation. This makes it an ideal choice for designers seeking reliable programmable logic solutions with excellent price-performance ratio for space-constrained applications.