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XC2S150E-7FGG456C: High-Performance Spartan-IIE FPGA for Advanced Digital Applications

Original price was: $20.00.Current price is: $19.00.

Product Specifications

Core Architecture

  • Device Family: Spartan-IIE Series
  • Part Number: XC2S150E-7FGG456C
  • Logic Cells: 150,000 system gates equivalent
  • Configurable Logic Blocks (CLBs): 1,728 CLBs
  • Total I/O Pins: 333 user I/O pins
  • Maximum User I/O: 333

Memory and Storage

  • Block RAM: 72 Kbits total block RAM
  • RAM Blocks: 12 blocks of 4K bits each
  • Distributed RAM: Available through LUT configuration
  • Configuration Memory: SRAM-based

Performance Characteristics

  • Speed Grade: -7 (high performance)
  • Maximum System Clock: Up to 200 MHz
  • Propagation Delay: 7ns (speed grade designation)
  • Power Consumption: Low power CMOS technology

Package Information

  • Package Type: FGG456 (Fine-Pitch Ball Grid Array)
  • Pin Count: 456 pins
  • Package Size: 23mm x 23mm
  • Pitch: 1.0mm ball pitch
  • Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)

Advanced Features

  • Digital Clock Manager (DCM): 4 DCMs for clock management
  • Multipliers: Dedicated 18×18 multipliers
  • I/O Standards Support: Multiple voltage standards including LVTTL, LVCMOS, SSTL, HSTL
  • Configuration Options: Multiple configuration modes supported

Price Information

Note: Pricing for the XC2S150E-7FGG456C varies based on quantity, distributor, and market conditions. For current pricing information:

  • Contact authorized Xilinx distributors
  • Check major electronic component suppliers
  • Request quotes for volume pricing
  • Consider long-term availability and lifecycle status

Pricing typically ranges from moderate to premium tier depending on volume and supplier relationship.

Documents & Media

Technical Documentation

  • Datasheet: XC2S150E complete technical specifications and electrical characteristics
  • User Guide: Spartan-IIE FPGA Family Complete Data Sheet
  • Application Notes: Design implementation guides and best practices
  • Reference Manual: Detailed architecture and configuration information

Design Resources

  • Development Tools: ISE Design Suite compatibility information
  • IP Cores: Available intellectual property cores for the XC2S150E-7FGG456C
  • Evaluation Boards: Compatible development and evaluation platforms
  • Design Examples: Reference designs and application circuits

Software and Tools

  • Xilinx ISE: Integrated Software Environment for design implementation
  • Impact: Configuration and programming software
  • ChipScope Pro: On-chip debugging and analysis tools
  • Timing Analyzer: Performance optimization utilities

Related Resources

Compatible Products

  • Configuration Devices: Platform Flash PROMs for bitstream storage
  • Development Boards: Spartan-IIE evaluation and development platforms
  • Programming Cables: USB and parallel programming solutions
  • Socket Solutions: Test and prototyping socket options

Alternative Devices

  • XC2S100E-7FGG456C: Lower logic density option in same package
  • XC2S200E-7FGG456C: Higher capacity alternative
  • XC2S150E-6FGG456C: Same logic capacity with different speed grade

Application Areas

  • Communications: Protocol processing and signal conditioning
  • Industrial Control: Motor control and sensor interfaces
  • Consumer Electronics: Digital signal processing applications
  • Automotive: Advanced driver assistance systems
  • Medical Devices: Signal processing and control applications

Design Support

  • Technical Forums: Community support and design discussions
  • Application Engineers: Direct technical support channels
  • Training Resources: Design methodology and tool training
  • Third-Party IP: Extensive ecosystem of compatible IP solutions

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Meets Restriction of Hazardous Substances directive
  • Lead-Free Package: Environmentally friendly packaging materials
  • Halogen-Free: Reduced environmental impact manufacturing
  • REACH Compliant: European chemical regulation compliance

Operating Conditions

  • Operating Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Relative Humidity: 5% to 85% non-condensing
  • Altitude: Up to 2000 meters operational

Export and Trade Classifications

  • ECCN Classification: Check current export control classification
  • Country of Origin: Manufacturing location information
  • HS Code: Harmonized system classification for customs
  • REACH Registration: European chemical safety compliance

Quality and Reliability

  • Quality Standards: ISO 9001 manufacturing quality systems
  • Reliability Testing: Extensive qualification and stress testing
  • Lifecycle Support: Long-term availability and support commitment
  • Traceability: Full manufacturing and supply chain traceability

Packaging and Shipping

  • Moisture Sensitivity Level: MSL rating for handling requirements
  • Anti-Static Packaging: ESD protection during shipping and storage
  • Tape and Reel: Available in production-ready packaging formats
  • Tray Packaging: Alternative packaging for prototyping and small volumes

The XC2S150E-7FGG456C represents a proven solution for high-performance FPGA applications, offering the reliability and feature set required for demanding digital design projects. With comprehensive development tool support and extensive documentation, this device enables rapid prototyping and efficient production implementation across diverse application domains.