Product Specifications
Core Architecture
- Device Family: Xilinx Spartan-IIE FPGA
- Part Number: XC2S150E-6PQG208I
- Logic Cells: 150,000 equivalent system gates
- CLBs (Configurable Logic Blocks): 1,728 CLBs
- Total I/O Pins: 173 user I/O pins
- Package Type: 208-pin Plastic Quad Flat Pack (PQFP)
- Speed Grade: -6 (high-performance grade)
Memory and Storage
- Block RAM: 72 Kbits of dual-port block RAM
- Distributed RAM: 27 Kbits available from CLB resources
- Configuration Memory: SRAM-based configuration
- External Memory Support: Compatible with various memory interfaces
Performance Characteristics
- Operating Frequency: Up to 200+ MHz system performance
- Propagation Delay: Optimized for high-speed applications
- Power Consumption: Low-power CMOS technology
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
I/O and Connectivity Features
- Differential I/O Standards: LVDS, LVPECL support
- Single-ended I/O Standards: LVCMOS, LVTTL, PCI, GTL+
- Digital Clock Managers (DCMs): 4 DCMs for clock management
- Global Clock Networks: 8 global clock distribution networks
Pricing Information
Note: Pricing for the XC2S150E-6PQG208I varies based on quantity, distributor, and current market conditions. Contact authorized Xilinx distributors for current pricing:
- Unit Price Range: Typically $15-45 USD per unit (varies by quantity)
- Volume Pricing: Significant discounts available for quantities >100 units
- Authorized Distributors: Digi-Key, Mouser Electronics, Arrow Electronics, Avnet
- Lead Time: Standard lead times range from 2-12 weeks depending on availability
Prices subject to change without notice. Contact distributors for current quotes and availability.
Documents & Media
Technical Documentation
- Datasheet: XC2S150E Complete Product Specification (DS077)
- User Guide: Spartan-IIE FPGA Family Complete Data Sheet
- Application Notes:
- XAPP151: Spartan-IIE FPGA Design Considerations
- XAPP154: Clock Management with Spartan-IIE DCMs
- Package Information: 208-pin PQFP Package Specifications
- PCB Design Guidelines: Layout recommendations and footprint data
Development Resources
- ISE Design Suite: Compatible with Xilinx ISE WebPACK (free) and Foundation
- Reference Designs: Sample VHDL/Verilog code examples
- Evaluation Boards: Spartan-IIE development kits and demo boards
- Simulation Models: IBIS models for signal integrity analysis
Media Resources
- Product Images: High-resolution package photos and pinout diagrams
- Block Diagrams: Internal architecture illustrations
- Application Videos: Design methodology and best practices tutorials
Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment for the XC2S150E-6PQG208I
- ModelSim: Simulation software for design verification
- ChipScope Pro: On-chip debugging and analysis tool
- CORE Generator: IP core creation and customization utility
Compatible Products
- Configuration Devices: Xilinx Platform Flash and Serial Flash memory
- Power Management: Compatible voltage regulators and power supplies
- Oscillators: Crystal oscillators and clock generation modules
- Connectors: FPGA-compatible headers and mezzanine connectors
Application Areas
- Digital Signal Processing: High-speed data processing applications
- Communications: Protocol processing and network interface designs
- Industrial Control: Motor control and automation systems
- Test Equipment: Automated test equipment and measurement systems
- Prototyping: Rapid prototyping of digital systems
Support Resources
- Xilinx Forums: Community support and technical discussions
- Application Engineer Support: Direct technical assistance
- Training Courses: FPGA design methodology and tools training
- Design Services: Third-party design consultation services
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- Lead-Free: Compatible with lead-free soldering processes
- REACH Compliant: Complies with EU chemical regulations
- Halogen-Free: Available in halogen-free package options
Operating Environment
- Temperature Range: -40ยฐC to +100ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 85% relative humidity, non-condensing
- Altitude: Up to 2000 meters operational altitude
Reliability Standards
- MTBF: >1,000,000 hours at 25ยฐC
- ESD Protection: Class 1C (>1000V) Human Body Model
- Latch-up Immunity: >100mA at 125ยฐC
- Quality Standards: ISO 9001 certified manufacturing
Export Classification
- ECCN: 3A001.a.7 (US Export Administration Regulations)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to US export control regulations
Packaging and Handling
- Package Marking: Industry-standard part number marking
- Moisture Sensitivity: MSL 3 (168 hours at 30ยฐC/60% RH)
- Handling Precautions: ESD-sensitive device requiring proper handling
- Storage Requirements: Sealed moisture barrier bag with desiccant
The XC2S150E-6PQG208I represents an excellent balance of performance, features, and cost-effectiveness for demanding FPGA applications. Its robust feature set and extensive development ecosystem make it a reliable choice for both prototype development and volume production applications.
