Product Specifications
Core Architecture
- Device Family: Xilinx Spartan-2E
- Part Number: XC2S150E-6PQG208C
- Logic Cells: 1,728 cells
- System Gates: 150,000 gates
- Process Technology: 0.15-micron CMOS
- Speed Grade: -6 (standard commercial grade)
Package Details
- Package Type: 208-pin Plastic Quad Flat Pack (PQFP)
- Package Code: PQG208
- Pin Count: 208 pins
- User I/O Pins: 72 maximum
- Package Size: 28mm x 28mm
- Pin Pitch: 0.5mm
Memory Resources
- Block RAM: 72 Kbits total
- Distributed RAM: Available through LUT configuration
- Configuration Memory: SRAM-based
- Configuration Modes: Master Serial, Slave Serial, Boundary Scan
Performance Characteristics
- Maximum System Clock: Up to 200 MHz (design dependent)
- Logic Delay: Optimized for speed grade -6
- Power Consumption: Low static power, dynamic power scales with utilization
- Operating Junction Temperature: 0ยฐC to +85ยฐC (commercial grade)
I/O Capabilities
- Supported I/O Standards: LVTTL, LVCMOS (3.3V, 2.5V), PCI, GTL+
- Input/Output Configuration: Flexible per-pin configuration
- Differential I/O Support: Available on select pins
- Hot-pluggable I/O: Supported for 3.3V interfaces
Price Information
The XC2S150E-6PQG208C pricing varies based on quantity, distribution channel, and current market conditions. Commercial pricing typically falls within the following ranges:
- Single Unit Price: $45 – $65 USD (estimated retail)
- Volume Pricing (100+ units): $25 – $40 USD per unit
- Volume Pricing (1000+ units): $20 – $30 USD per unit
- Educational/University Pricing: Significant discounts available through Xilinx University Program
Pricing may fluctuate based on semiconductor market conditions, supply chain factors, and regional availability. For current pricing and volume discounts, contact authorized Xilinx distributors such as Digi-Key, Mouser Electronics, Arrow Electronics, or Avnet.
Documents & Media
Official Documentation
- Datasheet: Spartan-2E FPGA Family Complete Data Sheet (DS077)
- User Guide: Spartan-2E FPGA User Guide (UG002)
- Package and Pinout: Spartan-2E FPGA Packaging and Pinout Specifications
- Configuration Guide: Spartan-2E Configuration User Guide
- Design Guidelines: PCB Design Guidelines for Spartan-2E FPGAs
Development Tools Documentation
- ISE Software: Xilinx ISE Design Suite documentation and tutorials
- Synthesis Guide: XST User Guide for Spartan-2E synthesis optimization
- Implementation Guide: Place and Route optimization for Spartan-2E
- Timing Analysis: Static Timing Analysis guidelines and best practices
Application Notes and Technical Resources
- Power Management: Power consumption analysis and optimization techniques
- Clock Management: Clock distribution and management strategies
- I/O Design: High-speed I/O design considerations
- Signal Integrity: PCB layout guidelines for optimal signal integrity
Related Resources
Development Boards and Kits
- Spartan-2E Starter Kit: Complete evaluation platform with XC2S150E
- Third-party Development Boards: Various educational and prototyping boards
- Custom Carrier Boards: Reference designs for application-specific implementations
Compatible Components
- Configuration Memory: Xilinx Platform Flash PROMs (XCF series)
- Oscillators and Clocks: Low-jitter clock sources for optimal performance
- Power Management: Switching regulators optimized for FPGA applications
- Interface Components: Level translators, buffers, and transceivers
Software Tools and IP Cores
- Xilinx ISE WebPACK: Free development environment for Spartan-2E
- IP Core Library: Pre-verified intellectual property blocks
- Third-party Tools: Simulation, synthesis, and verification software
- Open-source Tools: Community-developed design flows and utilities
Technical Support Resources
- Xilinx Support: Online knowledge base, forums, and technical support
- Training Materials: Online courses and webinars for FPGA design
- Community Resources: User forums, application examples, and design contests
- University Program: Educational resources and academic licensing
Environmental & Export Classifications
Environmental Compliance
The XC2S150E-6PQG208C meets stringent environmental standards and regulations:
- RoHS Compliance: Fully compliant with EU RoHS directive for hazardous substances
- REACH Compliance: Meets European REACH regulation requirements
- Conflict Minerals: Xilinx maintains conflict-free mineral sourcing policies
- Green Packaging: Uses environmentally friendly packaging materials
- Recycling Program: Supports electronic waste recycling initiatives
Operating Environmental Specifications
- Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 10% to 90% non-condensing relative humidity
- Altitude: Up to 2000 meters operational altitude
- Vibration Resistance: Meets JEDEC standards for mechanical stress
Export Control Classifications
- US Export Control: Subject to Export Administration Regulations (EAR)
- ECCN Classification: 3A001.a.7 (check current regulations)
- License Requirements: May require export license for certain destinations
- Dual-Use Technology: Classified as dual-use technology under US regulations
- End-Use Restrictions: Restrictions apply for military and sensitive applications
Quality and Reliability Standards
- ISO Certification: Manufactured in ISO 9001:2015 certified facilities
- Automotive Grade: Industrial grade suitable for extended temperature applications
- Reliability Testing: Extensive qualification testing including HTOL, TC, and HAST
- Quality Metrics: Measured and reported quality metrics including FIT rates
- Traceability: Full supply chain traceability and lot tracking
International Certifications
- CE Marking: Complies with European conformity requirements
- FCC Part 15: Meets electromagnetic compatibility standards
- ICES Compliance: Industry Canada electromagnetic compatibility standards
- Safety Standards: UL and CSA recognition for safety-critical applications
The XC2S150E-6PQG208C represents a mature, reliable solution for FPGA-based designs requiring proven performance, comprehensive tool support, and long-term availability. Its combination of logic capacity, I/O flexibility, and cost-effectiveness makes it an excellent choice for industrial automation, communications infrastructure, and embedded control applications.
