Product Specifications
Core Architecture
- Device Family: Xilinx Spartan-IIE
- Logic Elements: 150,000 system gates
- Package Type: Fine-pitch Ball Grid Array (FTBGA)
- Pin Count: 256 pins
- Speed Grade: -6 (commercial temperature range)
- Operating Temperature: 0ยฐC to +85ยฐC
Memory and I/O Features
- Block RAM: 72 Kbits total capacity
- Distributed RAM: 19,200 bits
- Maximum User I/O: 176 pins
- Digital Clock Manager (DCM): 4 units for advanced clock management
- Global Clock Networks: 8 high-speed clock distribution networks
Performance Characteristics
- Maximum Operating Frequency: Up to 200 MHz
- Power Consumption: Low-power CMOS technology
- Configuration Options: Multiple configuration modes including JTAG, SelectMAP, and slave serial
- Voltage Requirements: 3.3V I/O, 1.8V core voltage
The XC2S150E-6FTG256C offers excellent logic density with its 3,840 logic cells and comprehensive DSP capabilities, making it suitable for complex digital designs requiring moderate gate counts and flexible I/O configurations.
Price Information
Current Market Price: Contact authorized distributors for current pricing Volume Pricing: Available for quantities of 1,000+ units Lead Time: Typically 8-12 weeks for standard orders Minimum Order Quantity: 1 unit for prototyping, 90 units for production
Note: Prices vary based on market conditions, order quantity, and supplier. Contact Xilinx authorized distributors for the most current XC2S150E-6FTG256C pricing and availability.
Documents & Media
Technical Documentation
- Product Data Sheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Comprehensive implementation guide with design examples
- Migration Guide: Instructions for upgrading from previous Spartan generations
- Package Drawing: Detailed mechanical specifications and pin assignments
Development Resources
- Reference Designs: Sample VHDL/Verilog code for common applications
- Application Notes: Best practices for power management, signal integrity, and thermal considerations
- Evaluation Boards: Development platforms featuring the XC2S150E-6FTG256C
- Software Tools: ISE Design Suite compatibility information
Multimedia Resources
- Product Videos: Overview presentations and technical deep-dives
- Webinar Recordings: Training sessions on Spartan-IIE implementation
- Block Diagrams: Visual representations of internal architecture
Related Resources
Compatible Development Tools
- Xilinx ISE Design Suite: Primary development environment for the XC2S150E-6FTG256C
- ModelSim: Industry-standard simulation software
- ChipScope Pro: Integrated logic analyzer for debugging
- CORE Generator: IP core integration toolkit
Complementary Products
- Configuration Memory: Compatible PROM and Flash memory devices
- Power Management ICs: Recommended voltage regulators and power sequencers
- Clock Generation: Crystal oscillators and clock synthesizers
- Interface Components: Level shifters and signal conditioning devices
Application Areas
- Industrial Automation: Control systems and sensor interfaces
- Communications: Protocol processing and data formatting
- Medical Devices: Signal processing and patient monitoring
- Automotive Electronics: Engine control and safety systems
- Test Equipment: Automated test systems and measurement instruments
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Registration: Compliant with European chemical regulation
- Halogen-Free: Available in halogen-free package options upon request
- Lead-Free: Standard lead-free solder ball attachment
Operating Environment
- Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Humidity Rating: Up to 85% relative humidity, non-condensing
- Altitude: Operational up to 2,000 meters above sea level
- Shock and Vibration: Meets JEDEC standards for handling and transport
Export Control Classification
- ECCN: 3A001.a.7 (Export Control Classification Number)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to US Department of Commerce regulations
Quality and Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: JEDEC JESD47 qualification standards
- Mean Time Between Failures (MTBF): > 1,000,000 hours at 55ยฐC
- Package Moisture Sensitivity: Level 3 per JEDEC J-STD-020
The XC2S150E-6FTG256C represents a proven solution for engineers requiring a balance of performance, cost-effectiveness, and design flexibility. Its mature technology platform ensures long-term availability and extensive third-party support, making it an excellent choice for both prototype development and volume production applications.
For the latest XC2S150E-6FTG256C specifications, pricing, and availability, consult with authorized Xilinx distributors or visit the official Xilinx website. Product specifications are subject to change without notice.
