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XC2S150E-6FT256C: High-Performance Spartan-II FPGA for Advanced Digital Design

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Architecture

  • Device Family: Xilinx Spartan-II
  • System Gates: 150,000
  • Logic Cells: 3,888
  • Total Block RAM: 73,728 bits
  • Speed Grade: -6 (high performance)
  • Package Type: FT256 (Fine-Pitch Ball Grid Array)

Performance Characteristics

  • Operating Voltage: 2.5V core, 3.3V I/O
  • Maximum Operating Frequency: Up to 200 MHz
  • Propagation Delay: 5.1 ns typical
  • Power Consumption: Low static power consumption
  • Operating Temperature Range: Commercial (0ยฐC to +85ยฐC)

I/O and Connectivity

  • User I/O Pins: 176
  • Differential I/O Pairs: 88
  • I/O Standards Support: LVTTL, LVCMOS, SSTL, HSTL, and more
  • Package Dimensions: 17mm x 17mm BGA
  • Pin Count: 256 pins total

Memory and Storage

  • Block RAM Blocks: 12
  • Block RAM per Block: 4K bits
  • Distributed RAM: Available from CLBs
  • Configuration Memory: SRAM-based
  • Configuration Methods: JTAG, Master Serial, Slave Serial, Parallel

2. Pricing Information

The XC2S150E-6FT256C pricing varies based on order quantity and distributor. Current market pricing typically ranges:

  • Single Unit Price: $45-65 USD
  • Volume Pricing (100+ units): $35-50 USD
  • High Volume (1000+ units): Contact for quote

Prices subject to change based on market conditions and availability. Contact authorized distributors for current pricing and lead times.

3. Documents & Media

Technical Documentation

  • Product Data Sheet: Comprehensive specifications and electrical characteristics
  • User Guide: Detailed implementation guidelines and design recommendations
  • Package Information: Mechanical drawings and thermal characteristics
  • Programming Guide: Configuration and bitstream generation procedures

Design Resources

  • Reference Designs: Example implementations and application notes
  • Development Board Schematics: Hardware reference designs
  • Constraint Files: Timing and placement constraint templates
  • IP Core Compatibility Guide: Supported intellectual property cores

Software Tools

  • ISE Design Suite: Complete development environment
  • ChipScope Pro: Real-time debugging and analysis
  • FPGA Editor: Low-level design modification tools
  • iMPACT: Device programming and configuration utility

4. Related Resources

Development Platforms

  • Spartan-II Development Boards: Ready-to-use evaluation platforms
  • Starter Kits: Educational and prototyping solutions
  • Reference Design Kits: Application-specific development platforms

Compatible Components

  • Configuration PROMs: XC18V series for bitstream storage
  • Clock Management: External clock sources and PLLs
  • Memory Interfaces: SDRAM, DDR, and SRAM controllers
  • Communication Interfaces: Ethernet, USB, and serial protocol support

Application Areas

  • Industrial Automation: Motor control and sensor interfacing
  • Communications: Protocol processing and data conversion
  • Medical Equipment: Signal processing and control systems
  • Automotive Electronics: Engine management and safety systems
  • Test and Measurement: Data acquisition and signal analysis

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Lead-free manufacturing process
  • REACH Compliant: European chemical safety standards
  • Halogen-Free: Environmentally friendly materials
  • Green Package: Reduced environmental impact packaging

Operating Conditions

  • Storage Temperature: -65ยฐC to +150ยฐC
  • Operating Humidity: 10% to 85% non-condensing
  • Altitude: Up to 2000 meters
  • Vibration Resistance: MIL-STD-883 qualified
  • Shock Resistance: 1500G, 0.5ms duration

Export and Trade Classifications

  • ECCN Classification: 5A002 (US Export Administration Regulations)
  • HS Tariff Code: 8542.31.0001
  • Country of Origin: Varies by manufacturing location
  • Export License: May be required for certain destinations

Quality and Reliability

  • Quality Standard: ISO 9001:2015 certified manufacturing
  • Reliability Testing: Extended burn-in and stress testing
  • MTBF Rating: >1,000,000 hours at 25ยฐC
  • Warranty: Standard manufacturer warranty included

Conclusion

The XC2S150E-6FT256C represents an excellent balance of performance, features, and value in the FPGA market. Its robust architecture, comprehensive development ecosystem, and proven reliability make it a preferred choice for engineers developing next-generation electronic systems. Whether you’re implementing complex digital signal processing algorithms, building high-speed communication interfaces, or developing sophisticated control systems, the XC2S150E-6FT256C provides the programmable logic resources and performance needed to bring your designs to life.

For detailed technical specifications, pricing information, and design support, contact your local Xilinx distributor or visit the official Xilinx website to access the complete range of documentation and development resources available for the XC2S150E-6FT256C FPGA.