XC2S100E-7FGG456C – Xilinx Spartan-IIE FPGA Product Description

1. Product Specifications

Core Architecture

• Device Family: Xilinx Spartan-IIE FPGA
• Part Number: XC2S100E-7FGG456C
• Manufacturer: AMD Xilinx
• Logic Cells: 2,700 logic cells
• System Gates: 37,000 – 100,000 (logic and RAM)
• CLB Array: 20 x 30 configuration
• Total CLBs: 600

Memory Specifications

• Distributed RAM: 38,400 bits
• Block RAM: 40K bits (10 blocks of 4Kb each)
• Maximum Differential I/O Pairs: 86

Electrical Specifications

• Core Voltage (VCCINT): 1.8V ±5%
• I/O Voltage (VCCO): 1.2V to 3.6V (standard dependent)
• Speed Grade: -7 (highest performance)
• Temperature Range: Commercial (0°C to +85°C)
• Power Consumption: Low power segmented routing architecture

Package Details

• Package Type: FGG456 – Fine-pitch Ball Grid Array
• Pin Count: 456 pins
• Ball Pitch: 1.0mm
• Package Size: 23mm x 23mm
• Package Height: 2.60mm
• Weight: 2.2g ±10%

I/O Capabilities

• Maximum User I/O: 202 pins
• Supported Standards: 19 high-performance interface standards including:
  • LVTTL, LVCMOS (1.8V, 2.5V, 3.3V)
  • LVDS and LVPECL differential I/O
  • HSTL, SSTL, AGP, CTT, GTL standards
  • PCI compliant (3.3V, 64-bit at 66MHz)

Clock & Timing Features

• Global Clock Networks: 4 dedicated low-skew global clock nets
• DLLs (Delay-Locked Loops): 4 DLLs for advanced clock control
• Maximum Frequency: >200 MHz system performance
• Clock Distribution: Eliminates clock distribution delay

---

2. Pricing Information

Current Market Pricing (2025):

Quantity	Price Range (USD)	Availability
1-9 pcs	$15.00 – $45.00	In Stock
10-49 pcs	$12.00 – $35.00	Available
50-99 pcs	$8.00 – $25.00	Quote Required
100+ pcs	$6.00 – $20.00	Bulk Pricing

Note: Prices range from $6.00-$99.00 depending on supplier, quantity, and market conditions. Contact authorized distributors for current pricing and bulk discounts.

Status: ⚠️ OBSOLETE/DISCONTINUED – This product was marked obsolete as of August 9, 2013. Available through specialized distributors and surplus inventory.

---

3. Documents & Media

Official Documentation

• 📄 Official Datasheet: DS077 – Spartan-IIE FPGA Family Complete Data Sheet
• 📋 Product Brief: Spartan-IIE Introduction and Ordering Information
• 🔧 User Guide: Spartan-IIE Configuration and Programming Guide
• 📐 Package Drawings: Mechanical specifications and ball-out diagrams
• ⚡ IBIS Models: Signal integrity simulation models
• 🧪 BSDL Files: Boundary scan description language files

Development Tools

• Xilinx ISE® Design Suite: Complete development environment
• CORE Generator™: IP library access
• ChipScope Pro: Logic analyzer tool
• Programming Software: Device configuration utilities

Application Notes

• XAPP179: Using SelectIO Interfaces in Spartan-II and Spartan-IIE FPGAs
• XAPP173: Using Block RAM in Spartan-IIE FPGAs
• XAPP174: Using Delay-Locked Loops in Spartan-IIE FPGAs
• XAPP176: Configuration and Readback Guide

---

4. Related Resources

Compatible Products

• Configuration PROMs: XC18V01, XC18V02, XC18V04 series
• Development Boards: Spartan-IIE Starter Kits and Evaluation Boards
• Programming Cables: Platform Cable USB, Parallel Cable IV
• Oscillators: Compatible crystal oscillators and clock sources

Software Support

• Primary: Xilinx ISE Design Suite (legacy support)
• Synthesis: XST (Xilinx Synthesis Technology)
• Simulation: ModelSim, ISim integration
• Programming: iMPACT configuration tool

Migration Path

For new designs, consider these current alternatives:

• Spartan-7 Series: Modern equivalent with enhanced features
• Artix-7 Series: Higher performance successor
• Zynq Series: ARM + FPGA SoC solutions

Technical Support Resources

• AMD Xilinx Forums: Community support and discussions
• Application Engineering: Technical design assistance
• Knowledge Base: Extensive database of solutions
• Training Materials: Online courses and tutorials

---

5. Environmental & Export Classifications

Environmental Compliance

• RoHS Status: Standard version available (non-Pb-free)
• Lead-Free Option: FGG456 package (Pb-free version available)
• Halogen-Free: Available upon request
• REACH Compliance: EU chemical regulation compliant

Operating Conditions

• Junction Temperature: 0°C to +85°C (Commercial)
• Storage Temperature: -65°C to +150°C
• Humidity: Standard industrial levels
• Thermal Resistance: θJA = 25.0°C/W (still air)

Quality & Reliability

• Quality Standard: ISO 9001:2015 manufacturing
• Reliability Testing: JEDEC standard qualification
• ESD Protection: Built-in electrostatic discharge protection
• Latch-up Immunity: CMOS latch-up resistant design

Export Classification

• ECCN: 3A001.a.7 (Export Control Classification Number)
• Country of Origin: Varies by manufacturing location
• Trade Compliance: Subject to export control regulations
• Documentation: Certificate of origin available upon request

Packaging & Handling

• Moisture Sensitivity: Level 3 (168 hours at 30°C/60% RH)
• Anti-Static: ESD protective packaging required
• Storage: Dry, temperature-controlled environment
• Shelf Life: Unlimited when properly stored

---

Applications

The XC2S100E-7FGG456C is ideal for:

✅ Telecommunications: Protocol processing, signal routing
✅ Industrial Control: Automation systems, motor control
✅ Medical Devices: Signal processing, data acquisition
✅ Test & Measurement: Instrumentation, data analysis
✅ Communications: Network processing, wireless systems
✅ Consumer Electronics: Audio/video processing
✅ Automotive: Control systems, driver assistance
✅ Aerospace: Avionics, satellite communications

---

Why Choose XC2S100E-7FGG456C?

1. Proven Reliability: Millions of units deployed worldwide
2. Design Flexibility: Unlimited reprogramming capability
3. Performance: Commercial-grade -7 speed rating
4. I/O Rich: 202 user I/O pins with multiple standards
5. Memory Options: Distributed and block RAM configurations
6. Clock Management: Advanced DLL-based clock control
7. Cost Effective: Lower total cost of ownership vs. ASICs

Contact authorized distributors for availability, pricing, and technical support for your XC2S100E-7FGG456C requirements.