Product Specifications
Core Features
- Family: Xilinx Spartan-IIE 1.8V FPGA
- System Gates: 100,000 gates
- Logic Cells: 2,700 configurable logic blocks (CLBs)
- Maximum Frequency: 357MHz system performance
- Process Technology: Advanced 0.15 micron CMOS technology
- Operating Voltage: 1.8V core voltage
- Package Type: 208-Pin Plastic Quad Flat Pack (PQFP)
- I/O Count: 146 user-configurable I/O pins
- Temperature Grade: Commercial grade (-6 speed grade)
Memory Architecture
- Block RAM: Up to 288K bits of configurable dual-port block RAM
- Distributed RAM: Up to 221,184 bits of distributed SelectRAM
- RAM Configuration: 16 bits per Look-Up Table (LUT) distributed RAM
- True Dual-Port: 4K-bit configurable block RAM modules
Advanced Features
- DLL Support: Four Delay-Locked Loops (DLLs) for clock management
- I/O Standards: 19 selectable I/O standards including LVTTL, LVCMOS, PCI, GTL+
- In-System Programming: Unlimited reprogrammability capability
- Fast Interconnect: Predictable routing for consistent timing closure
- JTAG Boundary Scan: IEEE 1149.1 compliant for testing and debugging
Package Details
- Package Dimensions: 28mm x 28mm
- Pin Pitch: 0.5mm
- Mounting: Surface mount technology (SMT)
- Thermal Characteristics: Enhanced thermal performance for reliable operation
Price
The XC2S100E-6PQ208C pricing varies based on quantity, distributor, and market conditions. Current market factors affecting pricing include:
- Volume Discounts: Available for bulk orders (typically 100+ units)
- Market Status: Listed as obsolete by manufacturer, affecting availability
- Distributor Pricing: Competitive pricing available from authorized Xilinx distributors
- Stock Levels: Limited availability may impact pricing
Price Range: Contact authorized distributors for current quotations. Typical pricing ranges from competitive rates for small quantities to significant volume discounts for production runs.
Recommended Suppliers:
- Digi-Key Electronics
- Mouser Electronics
- Worldway Electronics
- Component-fr.com
- FPGAkey.com
Note: Prices fluctuate based on market conditions and availability. Request current pricing from multiple suppliers for best rates.
Documents & Media
Technical Documentation
- Official Datasheet: Spartan-IIE 1.8V FPGA Family Complete Data Sheet
- Package Information: 208-Pin PQFP mechanical drawings and specifications
- Pin Configuration: Detailed pinout diagrams and I/O assignments
- Electrical Characteristics: DC and AC electrical specifications
- Timing Specifications: Setup, hold, and propagation delay parameters
Design Resources
- PCB Footprint: CAD library footprints for major EDA tools
- SPICE Models: Simulation models for circuit analysis
- Application Notes: Design guidelines and best practices
- Reference Designs: Example implementations and code samples
- Errata Documents: Known issues and workarounds
Software Documentation
- ISE Design Suite: Legacy tool documentation and user guides
- Vivado Compatibility: Migration guidelines for newer design tools
- Constraint Files: Example UCF and XDC constraint templates
- IP Core Documentation: Compatible IP core specifications
Media Resources
- Product Photos: High-resolution package images
- Block Diagrams: Internal architecture illustrations
- Application Diagrams: Typical use case schematics
- Video Tutorials: Design flow demonstrations
Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment (legacy)
- Vivado Design Suite: Modern development platform with migration support
- ChipScope Pro: Integrated logic analyzer for debugging
- ModelSim: Simulation and verification tools
- MATLAB/Simulink: System-level design and verification
Development Boards
- Spartan-IIE Starter Kit: Complete development platform
- Third-Party Boards: Various evaluation and prototyping boards
- Custom PCB Solutions: Design services for production applications
IP Cores and Libraries
- Xilinx LogiCORE: Optimized IP blocks for common functions
- Memory Controllers: DDR, SRAM, and Flash memory interfaces
- Communication Interfaces: UART, SPI, I2C, Ethernet protocols
- DSP Functions: Digital filters, FFT, and signal processing blocks
Technical Support
- Xilinx Answer Database: Comprehensive technical knowledge base
- Community Forums: User community support and discussions
- Application Engineers: Direct technical support from Xilinx
- Training Courses: FPGA design methodology and best practices
Alternative Products
- XC2S100E-6TQ144C: 144-pin TQFP package alternative
- XC2S150E-6PQ208C: Higher gate count option in same package
- XC3S100E Series: Newer Spartan-3E family migration path
- Zynq-7000: ARM+FPGA SoC for advanced applications
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: โ Fully compliant with RoHS directive (Lead-free)
- REACH Compliance: Meets EU REACH regulation requirements
- Halogen-Free: Green package technology without hazardous materials
- Environmental Status: Environmentally friendly manufacturing process
- Recycling: Supports electronic waste recycling programs
Operating Conditions
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
- Shock/Vibration: Meets JEDEC standards for handling and operation
Export Classifications
- ECCN: Export Control Classification Number varies by destination
- Country of Origin: Manufactured in various Xilinx approved facilities
- HS Code: Harmonized System code for customs classification
- Export Restrictions: Subject to US export administration regulations
- Documentation: Certificate of origin available upon request
Quality Standards
- ISO 9001: Manufactured under ISO 9001 quality management system
- JEDEC Standards: Compliant with JEDEC semiconductor standards
- IPC Standards: Package meets IPC standards for surface mount components
- Qualification: Automotive and industrial grade qualification available
- Traceability: Full lot traceability for quality assurance
Package Environmental Data
- Moisture Sensitivity: Level 3 per JEDEC J-STD-020
- Peak Reflow Temperature: 260ยฐC for lead-free soldering
- Storage Requirements: Dry pack storage recommended
- Shelf Life: 12 months in sealed moisture barrier bag
- ESD Sensitivity: Class 2 ESD sensitive device
Part Number: XC2S100E-6PQ208C
Manufacturer: Xilinx (now AMD)
Status: Obsolete – Limited availability through distributors
Recommended for: Legacy design support and maintenance
Alternative Solutions: Contact Xilinx for migration recommendations to current product families
