XC2S100E-6FTG256I: Xilinx Spartan-IIE FPGA – Complete Product Overview

1. Product Specifications

Core Architecture

• Family: Xilinx Spartan-IIE FPGA
• Logic Capacity: 100,000 equivalent system gates
• Logic Cells: 2,700 configurable logic blocks (CLBs)
• CLB Array: 20 x 30 configuration
• Distributed RAM: 38,400 bits
• Block RAM: 40K bits (10 blocks × 4K bits each)

Performance Characteristics

• Maximum Frequency: 357 MHz
• Speed Grade: -6 (Industrial temperature range)
• Process Technology: 0.15μm CMOS
• Toggle Frequency: Up to 357 MHz
• Propagation Delay: <cite index=”21-1″>0.47ns typical</cite>

Power and Voltage

• Core Voltage (VCCINT): 1.8V ±5%
• I/O Voltage (VCCO): 1.5V, 2.5V, or 3.3V (configurable by bank)
• Power Consumption: Low power design optimized for battery applications

Package Details

• Package Type: 256-pin Fine-Pitch Ball Grid Array (FTBGA)
• Package Code: FTG256
• Ball Pitch: 1.0mm
• Package Dimensions: 17mm × 17mm
• Package Height: 1.55mm
• Operating Temperature: -40°C to +100°C (Industrial grade)

I/O Capabilities

• Maximum User I/O: 182 pins
• Differential I/O Pairs: 83 LVDS/LVPECL pairs
• I/O Standards Supported: 19 different standards including LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL
• Global Clock Networks: 4 dedicated low-skew networks
• DLL Clock Management: 4 Delay-Locked Loops for advanced timing control

Memory Architecture

• SelectRAM: Hierarchical memory structure
  • 16 bits/LUT distributed RAM
  • True dual-port 4K-bit block RAM modules
• Block RAM Configuration: Multiple aspect ratios from 256×16 to 4096×1
• Fast External Memory Interface: Optimized for SRAM/DRAM connections

---

2. Price

Market Pricing Overview

Current Market Range: $15 – $85 USD per unit (varies by quantity and supplier)

Pricing by Quantity:

• 1-9 units: $65-85 USD each
• 10-99 units: $45-65 USD each
• 100-999 units: $25-45 USD each
• 1000+ units: $15-25 USD each (contact for volume pricing)

Price Factors:

• Availability: Limited stock due to obsolete status
• Condition: New original vs. refurbished
• Packaging: Tray vs. reel packaging
• Lead Time: Immediate availability vs. extended lead times
• Supplier Certification: Authorized vs. independent distributors

Note: <cite index=”28-1″>This product is marked as “NOT RECOMMENDED for NEW DESIGN” due to obsolescence</cite>, which affects pricing and availability.

---

3. Documents & Media

Official Documentation

• DS077 Spartan-IIE Family Datasheet – Complete 108-page technical specification
• Product Change Notice XCN12026 – Obsolescence notification (August 2013)
• Application Notes:
  • XAPP179: Using SelectIO Interfaces in Spartan-II and Spartan-IIE FPGAs
  • XAPP174: Using DLLs in Spartan-IIE FPGAs
  • XAPP176: Configuration and Readback Guide

Design Resources

• Pinout Tables: Complete pin assignment documentation
• Package Drawings: Mechanical specifications and dimensions
• IBIS Models: Signal integrity simulation models
• BSDL Files: Boundary scan description language files

Development Tools

• Xilinx ISE Design Suite: Legacy development environment
• CORE Generator: IP core library access
• ChipScope Pro: Debug and analysis tools
• Programming Files: Bitstream generation and device configuration

Reference Designs

• Evaluation Boards: Development platform specifications
• Design Examples: Sample VHDL/Verilog implementations
• Getting Started Guides: Quick setup and first design tutorials

---

4. Related Resources

Development Ecosystem

Software Tools:

• Xilinx ISE Design Suite (Legacy support)
• ModelSim integration for simulation
• Synplify Pro synthesis tool compatibility
• ChipScope Pro for real-time debugging

Hardware Platforms:

• Spartan-IIE Evaluation Boards
• Third-party development modules
• Compatible programming cables (Platform Cable USB, Parallel Cable IV)

Migration and Alternatives

Recommended Migration Path:

• Current Xilinx Families: Spartan-7, Artix-7 series
• Direct Alternatives: XC2S200E-6FTG256I, XC2S300E-6FTG256I (same package, higher capacity)
• Modern Equivalents: XC7S50-2FTGB196C (Spartan-7 family)

Cross-Reference Parts:

• Intel/Altera Cyclone series equivalents
• Microsemi SmartFusion alternatives
• Lattice ECP5 family options

Application Resources

Common Applications:

• Digital Signal Processing (DSP) implementations
• Embedded system prototyping
• Communications infrastructure
• Industrial control systems
• Test and measurement equipment

Industry Solutions:

• Automotive electronics (meets AEC-Q100 when specified)
• Aerospace and defense applications
• Medical device development
• Telecommunications equipment

Community and Support

• Xilinx Community Forums (archived content)
• Legacy design examples repository
• Third-party IP cores and designs
• Academic institutional support materials

---

5. Environmental & Export Classifications

Environmental Compliance

RoHS Compliance:

• <cite index=”22-1″>RoHS-compliant component as indicated by “FT” designation</cite>
• Meets EU Directive 2011/65/EU restrictions on hazardous substances
• Lead-free soldering compatible
• Compliant with China RoHS regulations

REACH Regulation:

• Complies with EU Registration, Evaluation, Authorization and Restriction of Chemicals
• No Substances of Very High Concern (SVHC) above reporting thresholds
• Full material composition documentation available upon request

Additional Environmental Standards:

• WEEE Compliant: Waste Electrical and Electronic Equipment Directive
• Halogen-Free: Available in halogen-free package variants
• MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30°C/60% RH)

Package Environmental Data

• Package Materials: Lead-free solder balls, halogen-free mold compound
• Thermal Characteristics: θJA = 25.0°C/W (still air), θJC = 5.8°C/W
• Operating Humidity: 85% RH maximum (non-condensing)
• Storage Temperature: -65°C to +150°C

Export Classifications

Export Control Classification:

• ECCN: 3A001.a.2.c (US Export Administration Regulations)
• HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
• Country of Origin: Varies by manufacturing facility (typically Malaysia, Philippines)

Trade Compliance:

• ITAR: Not subject to International Traffic in Arms Regulations
• EAR: Subject to Export Administration Regulations
• Dual-Use: Commercial grade, standard export licensing

Restricted Countries:

• Subject to US and international trade sanctions
• Requires export license for restricted destinations
• Check current BIS Entity List for shipping restrictions

Quality and Reliability Standards

• AEC-Q100: Qualified automotive versions available
• MIL-STD-883: Military standard testing available for select variants
• ISO 9001: Manufacturing quality system certification
• ISO 14001: Environmental management system compliance

Recycling and End-of-Life

• Material Recovery: High-value precious metals recoverable
• Proper Disposal: Electronic waste recycling centers recommended
• Design for Environment: Reduced packaging, recyclable materials
• Take-Back Programs: Xilinx legacy product return programs (contact for details)

---

Conclusion

The XC2S100E-6FTG256I represents a mature, proven FPGA solution from Xilinx’s successful Spartan-IIE family. While officially obsoleted in 2013, this device remains valuable for legacy system maintenance, educational applications, and cost-sensitive designs where the latest features aren’t required.

Key Advantages:

• ✅ Proven reliability with extensive field deployment history
• ✅ Cost-effective solution for moderate complexity designs
• ✅ Comprehensive documentation and design resources available
• ✅ RoHS compliant for modern manufacturing requirements
• ✅ Multiple supplier options maintaining inventory availability

Considerations:

• ⚠️ Obsolete status – not recommended for new designs
• ⚠️ Limited long-term availability as inventory depletes
• ⚠️ Legacy toolchain requires older ISE Design Suite versions

For new designs, consider migrating to current Xilinx 7-Series or Ultrascale families, or contact authorized distributors for alternative recommendations that provide similar functionality with modern feature sets and long-term availability.