XC2S100E-6FTG256C Spartan-IIE FPGA – Complete Product Guide

1. Product Specifications

Core Architecture

• Family: Spartan-IIE Field Programmable Gate Array
• Part Number: XC2S100E-6FTG256C
• Manufacturer: AMD (formerly Xilinx Inc.)
• System Gates: 100,000
• Logic Cells: 2,700
• Total RAM Bits: 40,960

Electrical Characteristics

• Core Voltage (VCCINT): 1.8V (1.71V – 1.89V)
• I/O Voltage (VCCIO): Supports 19 selectable I/O standards
• Maximum Frequency: 357MHz
• Process Technology: 0.15μm CMOS
• Operating Temperature Range: 0°C to +85°C (TJ – Junction Temperature)

Package Details

• Package Type: 256-pin Fine-pitch Ball Grid Array (FTBGA)
• Package Size: 17mm × 17mm
• User I/O Pins: 182
• Mount Type: Surface Mount
• Package Suffix: FTG256C

Memory Architecture

• Distributed RAM: Up to 221,184 bits (16 bits/LUT)
• Block RAM: Configurable 4K-bit true dual-port blocks
• Total Block RAM: Up to 288K bits
• SelectRAM™ Hierarchical Memory support

Advanced Features

• 4 Delay-Locked Loops (DLLs) for precise timing control
• Fast, predictable interconnect architecture
• Based on Virtex-E FPGA streamlined architecture
• Second-generation ASIC replacement technology
• In-system reprogrammability for field upgrades

---

2. Pricing Information

Current Market Pricing (Subject to market fluctuations):

Quantity	Price Range (USD)	Availability
1+ units	$15.00 – $25.00	In Stock
10+ units	$12.00 – $20.00	1-3 weeks
100+ units	$8.00 – $15.00	2-4 weeks
1000+ units	$6.00 – $12.00	Contact for quote

Note: Prices vary by distributor and market conditions. Contact authorized distributors for current pricing and volume discounts.

Popular Distributors:

• Allelco Electronic
• FPGAkey
• Cytech Systems
• IC-Components
• Jotrin Electronics

---

3. Documents & Media

Official Documentation

• Primary Datasheet: Spartan-IIE FPGA Family Complete Data Sheet (108 pages)
• Pin Configuration: 256-FTBGA package pinout diagram
• Package Drawing: Mechanical specifications and dimensions
• Speed Grade Information: -6 speed grade performance characteristics

Design Resources

• Reference Manual: Spartan-IIE FPGA User Guide
• Application Notes: Design implementation guidelines
• IBIS Models: Signal integrity simulation models
• Package Information: Thermal and mechanical data

Software Tools

• AMD Vivado Design Suite (recommended for new designs)
• Legacy ISE Design Suite (for existing projects)
• Programming Tools: iMPACT, ChipScope Pro
• Simulation Models: VHDL and Verilog libraries

---

4. Related Resources

Development Tools

• Spartan-IIE Evaluation Kits (check distributor availability)
• Programming Cables: Platform Cable USB, JTAG programmers
• Development Boards: Third-party evaluation platforms

Alternative Part Numbers

• XC2S100E-6FT256C (256-pin FTBGA variant)
• XC2S100E-6PQ208C (208-pin PQFP package)
• XC2S100E-6FG456C (456-pin FBGA package)

Family Members

• XC2S50E-6FTG256C (50K gates, lower density)
• XC2S150E-6FTG256C (150K gates, higher density)
• XC2S200E-6FTG256C (200K gates, enhanced performance)
• XC2S300E-6FTG256C (300K gates, maximum capacity)

Technical Support

• AMD Developer Zone – Design resources and forums
• Application Engineering – Direct technical support
• Training Materials – FPGA design tutorials and webinars
• University Program – Educational resources

---

5. Environmental & Export Classifications

Environmental Compliance

• RoHS Compliance: Yes – Lead-free package
• REACH Regulation: Compliant (EU chemicals regulation)
• Halogen-Free: Package meets halogen-free requirements
• MSL Rating: Moisture Sensitivity Level 3

Quality Standards

• Automotive Grade: Commercial grade (0°C to +85°C)
• Quality Standard: ISO 9001:2015 certified manufacturing
• Reliability Testing: JEDEC qualification standards
• ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested

Export Control Information

• ECCN Classification: 3A991.a.2 (subject to EAR regulations)
• HTS Code: 8542.31.0001
• Country of Origin: Manufacturing location varies by lot
• Export Restrictions: Subject to US Export Administration Regulations

Packaging & Handling

• Package Marking: Laser-etched part number and date code
• Antistatic Packaging: ESD-safe tray packaging
• Storage Conditions: -55°C to +150°C storage temperature
• Shelf Life: Unlimited when stored properly

Lifecycle Status

• Product Status: Not recommended for new designs (legacy product)
• Replacement Recommendations: Consider newer Spartan-6 or Spartan-7 families
• End of Life: Scheduled for discontinuation (check with AMD for timeline)
• Last Time Buy: Contact AMD for availability updates

---

Applications

The XC2S100E-6FTG256C excels in diverse applications including:

• Industrial Automation – Control systems and sensor interfaces
• Medical Equipment – Diagnostic and monitoring devices
• Telecommunications – Protocol processing and interface bridging
• Consumer Electronics – Digital signal processing applications
• Automotive Systems – Engine control and dashboard electronics
• Test & Measurement – Data acquisition and processing systems

Design Considerations

Advantages:

• Cost-effective ASIC replacement
• Field-upgradeable firmware
• Proven Spartan-IIE architecture reliability
• Comprehensive development tool support

Limitations:

• Legacy product – consider newer alternatives for new designs
• Limited availability compared to current-generation FPGAs
• 0.15μm technology may have higher power consumption than modern devices

---

For the latest pricing, availability, and technical specifications, contact authorized AMD distributors or visit the official AMD website. This product information is subject to change without notice.