1. Product Specifications
Core Technical Specifications
- Part Number: XC2S100E-6FGG456C
- Manufacturer: Xilinx (now AMD)
- Product Family: Spartan-IIE 1.8V FPGA Family
- System Gates: 100,000 gates
- Logic Cells: 2,700 cells
- Maximum Operating Frequency: 357 MHz
- Process Technology: 0.15 micron CMOS
- Supply Voltage: 1.8V
- Package Type: 456-Pin Fine-pitch Ball Grid Array (FBGA)
- Package Designation: FGG456
- Speed Grade: -6 (Commercial temperature range)
Memory Features
- Block RAM: Up to 288K bits configurable
- Distributed RAM: Up to 221,184 bits
- SelectRAM: Hierarchical memory architecture
- 16 bits/LUT distributed RAM
- Configurable 4K-bit true dual-port block RAM
I/O and Interface Features
- I/O Standards: 19 selectable I/O standards supported
- DLL Support: 4 Delay-Locked Loops (DLLs) for clock management
- High-speed I/O: Optimized for high-frequency applications
- Flexible pin assignment: Comprehensive I/O planning capabilities
Performance Characteristics
- Architecture: Based on proven Virtex-E FPGA architecture
- Interconnect: Fast, predictable routing architecture
- Logic Resources: Abundant programmable logic resources
- Clock Management: Advanced clocking capabilities with DLL support
- Design Security: Unlimited in-system reprogrammability
2. Price Information
Pricing Note: The XC2S100E-6FGG456C pricing varies significantly based on:
- Quantity ordered (volume discounts available)
- Supplier location and inventory levels
- Market demand fluctuations
- Lead times and availability
Current Market Status:
- Legacy product with limited availability
- Pricing typically higher than when in active production
- Contact authorized distributors for current quotes
- Consider substitute products for new designs
Price Range Factors:
- Small quantities: Premium pricing due to limited stock
- Volume orders: Better pricing through authorized distributors
- Lead times: Extended due to end-of-life status
3. Documents & Media
Official Documentation
- Primary Datasheet: Spartan-IIE FPGA Family Data Sheet (DS077)
- DC and Switching Characteristics: DS077-3 specifications
- User Guide: Spartan-IIE FPGA User Guide
- Configuration Guide: Configuration methods and procedures
Development Resources
- ISE Design Suite: Legacy development environment (recommended)
- Vivado Design Suite: Limited support for legacy devices
- IP Core Library: Compatible IP cores for Spartan-IIE
- Reference Designs: Application-specific design examples
Package Information
- Package drawings: Mechanical specifications and dimensions
- Pinout information: Complete pin assignment documentation
- PCB layout guidelines: Design recommendations for FBGA package
- Thermal management: Heat dissipation guidelines
Programming Documentation
- Configuration options: Multiple configuration methods supported
- JTAG programming: Boundary scan and programming protocols
- BitGen options: Bitstream generation parameters
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment (legacy)
- ChipScope Pro: On-chip debugging and analysis
- EDK (Embedded Development Kit): For embedded processor designs
- System Generator: MATLAB/Simulink integration
Compatible Products
- Configuration Memory: Compatible PROM and Flash devices
- Development Boards:
- Spartan-IIE Starter Kit (discontinued)
- Third-party evaluation boards
- Custom development platforms
Successor Products
Recommended Alternatives for new designs:
- Spartan-7 Family: Modern low-cost FPGA solution
- Artix-7 Family: Higher performance alternative
- Zynq-7000: SoC solutions with ARM processing
Support Resources
- Xilinx Answer Database: Technical support articles
- User Forums: Community support and discussions
- Application Notes: Design implementation guidance
- Training Materials: Online courses and tutorials
Third-Party Resources
- Development Boards: Various evaluation platforms
- IP Providers: Third-party intellectual property cores
- Design Services: Professional design and consulting services
- Programming Solutions: Third-party programming tools
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Not Compliant (contains restricted substances)
- REACH Compliance: Subject to REACH regulations
- Conflict Minerals: Compliant with conflict minerals reporting
- Environmental Classification: Industrial electronic component
Operating Conditions
- Commercial Temperature Range: 0°C to +85°C (C-grade)
- Junction Temperature: Up to +125°C maximum
- Storage Temperature: -65°C to +150°C
- Humidity: 85% relative humidity (non-condensing)
Reliability Specifications
- MTBF: Mean Time Between Failures per MIL-HDBK-217
- Quality Grade: Commercial grade device
- Qualification: Industrial standards compliance
- Lifecycle: End-of-life product with limited support
Export Control Classification
- ECCN: Export Control Classification Number applies
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to US export administration regulations
- International Compliance: Meets international trade regulations
Package Environmental Data
- Moisture Sensitivity Level: MSL-3 (168 hours at 30°C/60% RH)
- Lead-Free Status: Contains lead (legacy product)
- Soldering Profile: Standard surface mount reflow profile
- ESD Sensitivity: Class 1 (<1000V HBM)
Quality and Standards
- ISO Standards: ISO 9001 manufacturing quality
- Automotive: Not qualified for automotive applications
- Medical: Not qualified for medical device applications
- Aerospace: Contact manufacturer for aerospace qualification
Note: The XC2S100E-6FGG456C is a legacy product. For new designs, consider current-generation Xilinx/AMD FPGA families that offer improved performance, lower power consumption, and modern tool support. Contact authorized distributors for availability, pricing, and recommended alternatives.
