Product Specification
The XC2S100-6PQG208C is a versatile Spartan-II FPGA (Field-Programmable Gate Array) from Xilinx, designed to deliver exceptional performance for cost-sensitive applications. This FPGA features 100,000 system gates with advanced architecture optimized for digital signal processing, embedded processing, and general-purpose logic applications.
Key Technical Specifications:
- Device Family: Spartan-II
- Logic Cells: 2,500 equivalent logic cells
- System Gates: 100,000 gates
- Package Type: PQG208 (208-pin Plastic Quad Flat Pack)
- Speed Grade: -6 (industrial temperature range)
- Operating Temperature: -40°C to +85°C
- Supply Voltage: 2.5V core, 3.3V I/O
- I/O Pins: 176 user I/O pins
- Block RAM: 40 Kbits distributed RAM
- Clock Management: 4 Digital Clock Managers (DCMs)
The XC2S100-6PQG208C incorporates Xilinx’s proven SRAM-based configuration technology, enabling unlimited reprogrammability and in-system reconfiguration capabilities. This makes it ideal for prototyping, low-volume production, and applications requiring field updates.
Price
Pricing for the XC2S100-6PQG208C varies based on quantity, distribution channel, and current market conditions. Typical pricing ranges from $15-$25 per unit in volume quantities (1000+ pieces). For current pricing and availability:
- Contact authorized Xilinx distributors
- Request quotes through electronic component suppliers
- Check real-time pricing on component marketplaces
- Consider lifecycle status when planning long-term projects
Volume discounts are typically available for orders exceeding 100 pieces, with additional cost savings for annual purchase agreements.
Documents & Media
Technical Documentation:
- Datasheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation guidelines
- Application Notes: Design optimization techniques
- Reference Designs: Sample implementations and best practices
- Migration Guide: Upgrading from previous Spartan generations
Development Resources:
- ISE Design Suite: Complete development environment
- ChipScope Pro: Integrated logic analyzer
- EDK (Embedded Development Kit): Embedded processor design tools
- IP Core Libraries: Pre-verified intellectual property blocks
Package Information:
- Package drawings: Mechanical specifications and pin layouts
- Thermal characteristics: Junction-to-ambient thermal resistance
- PCB layout guidelines: Recommended footprints and routing practices
Related Resources
Compatible Development Boards:
- Spartan-II Starter Kit
- Third-party evaluation platforms
- Custom development boards from design partners
Software Tools:
- Vivado Design Suite (for newer projects)
- ISE WebPACK (free development tools)
- ModelSim simulation environment
- Synplify synthesis tools
Technical Support:
- Xilinx Support Center
- Community forums and knowledge base
- Local field application engineers
- Training courses and webinars
Competitive Alternatives:
- Intel/Altera Cyclone series
- Microsemi ProASIC3 family
- Lattice ECP5 devices
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Lead-free package options available
- REACH Regulation: Compliant with EU chemical restrictions
- Conflict Minerals: Sourced from certified conflict-free suppliers
- Green Package: Halogen-free and antimony-free options
Export Control Classifications:
- ECCN (Export Control Classification Number): 3A991.a.2
- Schedule B: 8542.31.0001
- TARIC: 8542310000
- Country of Origin: Varies by manufacturing location
Quality Standards:
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Temperature: Extended operating range (-40°C to +85°C)
- Military/Aerospace: Contact Xilinx for screening options
- ISO Certifications: Manufactured in ISO 9001 certified facilities
Packaging and Handling:
- MSL Rating: Moisture Sensitivity Level 3
- Storage Requirements: Dry storage recommended
- ESD Sensitivity: Class 2 (>2000V HBM)
- Shelf Life: 2 years from date of manufacture
The XC2S100-6PQG208C represents a mature, cost-effective solution for FPGA-based designs requiring moderate logic density and proven reliability. Its industrial temperature rating and comprehensive development ecosystem make it suitable for a wide range of applications including industrial automation, communications infrastructure, and embedded processing systems.
