The XC2S100-6FGG256C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, designed to deliver exceptional processing capabilities for demanding applications. This versatile FPGA solution combines advanced programmable logic with cost-effective implementation, making the XC2S100-6FGG256C ideal for industrial automation, telecommunications, and embedded system applications.
Product Specifications
Core Features
- Part Number: XC2S100-6FGG256C
- Family: Xilinx Spartan-II FPGA Series
- Logic Cells: 100,000 system gates
- Speed Grade: -6 (Commercial temperature range)
- Package Type: FGG256 (Fine-pitch Ball Grid Array)
- Pin Count: 256 pins
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
Technical Specifications
- Configurable Logic Blocks (CLBs): 1,200 CLBs
- Input/Output Pins: Up to 176 user I/O pins
- Block RAM: 40 Kbits of dual-port block RAM
- Dedicated Multipliers: 4 dedicated 18×18 multipliers
- Digital Clock Managers (DCMs): 4 DCMs for advanced clock management
- Supply Voltage: 2.5V core, 3.3V I/O
- Power Consumption: Low-power CMOS technology
Package Details
The XC2S100-6FGG256C features a compact 256-pin Fine-pitch Ball Grid Array (FGG) package, measuring 17mm x 17mm with 1.0mm ball pitch. This space-efficient packaging makes the XC2S100-6FGG256C suitable for applications where board space is at a premium while maintaining excellent thermal and electrical performance.
Price Information
The XC2S100-6FGG256C is competitively priced within the Spartan-II FPGA family, offering excellent value for mid-range FPGA applications. Pricing varies based on:
- Quantity ordered (volume discounts available)
- Distribution channel (authorized distributors vs. direct from manufacturer)
- Geographic region and local market conditions
- Current market availability and demand
For current XC2S100-6FGG256C pricing and availability, contact authorized Xilinx distributors or visit official semiconductor marketplaces. Educational and development quantities may qualify for special pricing programs.
Documents & Media
Official Documentation
- XC2S100-6FGG256C Datasheet: Complete electrical specifications, timing parameters, and package information
- Spartan-II Family Data Sheet: Comprehensive family overview and feature comparison
- Package and Pinout Specification: Detailed FGG256 package drawings and pin assignments
- Design Guidelines: Best practices for PCB layout and signal integrity
Development Resources
- Reference Designs: Example implementations and application notes
- Evaluation Boards: Compatible development and evaluation platforms
- Software Tools: ISE Design Suite compatibility and configuration guides
- Technical Application Notes: Implementation strategies and optimization techniques
CAD Resources
- IBIS Models: For signal integrity simulation and analysis
- SPICE Models: Detailed electrical models for circuit simulation
- 3D Package Models: For mechanical design and thermal analysis
- Symbol and Footprint Libraries: For popular CAD tools (Altium, Cadence, KiCad)
Related Resources
Compatible Development Tools
- Xilinx ISE Design Suite: Complete development environment for the XC2S100-6FGG256C
- ModelSim: Industry-standard simulation software for FPGA verification
- ChipScope Pro: Integrated logic analyzer for real-time debugging
Evaluation and Development Boards
- Spartan-II Starter Kit: Entry-level development platform
- Custom Evaluation Boards: Third-party solutions featuring the XC2S100-6FGG256C
- Prototyping Boards: For rapid prototype development and testing
Related Xilinx Products
- XC2S50-6FGG256C: Lower gate count alternative in same package
- XC2S150-6FGG256C: Higher capacity option for more complex designs
- XC2S200-6FGG456C: Expanded I/O version for pin-intensive applications
Technical Support Resources
- Xilinx Community Forums: Peer-to-peer technical discussions
- Application Engineering Support: Direct technical assistance
- Training and Certification: Educational programs for FPGA development
- Design Services: Third-party design and consulting services
Environmental & Export Classifications
Environmental Compliance
The XC2S100-6FGG256C meets stringent environmental standards:
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Certified conflict-free sourcing
- Green Packaging: Recyclable and environmentally responsible packaging materials
Export Control Information
- ECCN Classification: 3A001.a.2 (Export Control Classification Number)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufactured in ISO-certified facilities
- Export Licensing: May require export license for certain destinations
Quality and Reliability Standards
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Temperature: Extended temperature range options
- Quality Management: ISO 9001:2015 certified manufacturing
- Reliability Testing: Comprehensive qualification and stress testing
Packaging and Handling
- Moisture Sensitivity: MSL-3 (Moisture Sensitivity Level 3)
- ESD Protection: Class 1C ESD sensitivity rating
- Storage Requirements: Temperature and humidity controlled storage recommended
- Handling Procedures: Anti-static precautions required during assembly
Keywords: XC2S100-6FGG256C, Xilinx FPGA, Spartan-II, Field Programmable Gate Array, FGG256 package, programmable logic, embedded systems, industrial automation, FPGA development, digital signal processing
