Product Specifications
The XC2S100-6FG256CES is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s proven Spartan-II family, designed to deliver cost-effective programmable logic solutions for a wide range of applications. This commercial-grade device combines advanced architecture with reliable performance characteristics.
Core Specifications
- Family: Spartan-II FPGA
- System Gates: 100,000 gates
- Logic Cells: 2,700 cells
- Configurable Logic Blocks (CLBs): 600
- Maximum Frequency: 200 MHz system clock
- Technology Node: 0.18μm CMOS process
- Supply Voltage: 2.5V
- Package: 256-pin Fine-pitch Ball Grid Array (FBGA)
- Package Code: FG256
- Speed Grade: -6 (Commercial temperature range)
- Part Suffix: CES (Commercial, Extended temperature, RoHS compliant)
Memory and I/O Features
- Block RAM: Synchronous dual-port 4K-bit RAMs
- Distributed RAM: LUTs configurable as 16-bit RAM, 32-bit RAM, or 16-bit dual-ported RAM
- I/O Standards: Multi-standard SelectIO interfaces supporting 16 high-performance interface standards
- Global Clock Networks: 4 primary low-skew global clock distribution nets plus 24 secondary local clock nets
- DLL Clock Management: Built-in Delay-Locked Loops (DLLs) for advanced clock control
Advanced Features
- Fast carry logic for high-speed arithmetic operations
- Dedicated multiplier support for DSP applications
- Cascade chain capability for wide-input functions
- Programmable set and reset on all flip-flops with clock enable
- Hot-swappable capability for Compact PCI applications
- 66-MHz PCI compliance
Price
Current Market Pricing: The XC2S100-6FG256CES is available from authorized distributors with pricing typically ranging from $45-65 USD per unit depending on quantity and supplier. Bulk pricing is available for volumes of 100+ units. Contact authorized distributors for current quote and availability as pricing may vary based on market conditions.
Note: This device is marked as “NOT RECOMMENDED for NEW DESIGN” by AMD Xilinx, indicating it’s in mature/legacy status. Consider newer FPGA families for new projects.
Documents & Media
Official Documentation
- Spartan-II FPGA Family Data Sheet (DS001) – Complete technical specifications and electrical characteristics
- Spartan-II User Guide – Design guidelines, configuration options, and application notes
- Package Information Document – Pin assignments, mechanical drawings, and thermal characteristics
- Spartan-II Configuration Guide – Programming and configuration procedures
Design Resources
- Reference Designs: Sample VHDL/Verilog code examples
- Application Notes: Best practices for power management, timing closure, and I/O interfacing
- PCB Layout Guidelines: Recommended footprints and routing guidelines for FG256 package
- Thermal Management Guide: Heat dissipation recommendations and thermal calculations
Software Tools
- Xilinx ISE Design Suite: Legacy development environment (recommended for Spartan-II designs)
- Vivado Design Suite: Modern development platform with limited Spartan-II support
- Impact Configuration Tool: Device programming and boundary scan testing
Related Resources
Development Platforms
- Spartan-II Development Boards: Third-party evaluation platforms available
- Compatible Design Kits: ZedBoard, Basys 3 board, Nexys4-DDR (newer alternatives)
Compatible Components
- Memory Interfaces: DDR SDRAM, SRAM, Flash memory controllers
- Communication Protocols: UART, SPI, I2C, Ethernet MAC implementations
- Processing Cores: MicroBlaze soft processor compatibility
Migration Path
- Recommended Upgrades:
- Spartan-6 family (XC6SLX series) for enhanced performance
- Spartan-7 family (XC7S series) for modern low-power applications
- Artix-7 family for higher performance requirements
Technical Support
- Design Consultation: Available through AMD Xilinx technical support
- Community Forums: Active user community for troubleshooting and design assistance
- Training Resources: Online courses for FPGA design methodology
Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS: Not Compliant (Legacy device predates current RoHS requirements)
- Lead-Free Status: Not lead-free (contains lead in solder and die attach materials)
- Halogen Content: Standard halogen content (not halogen-free)
- REACH Compliance: Compliant with current REACH regulations
Operating Conditions
- Commercial Temperature Range (-6 speed grade):
- Operating: 0°C to +85°C
- Storage: -65°C to +150°C
- Humidity: 85% non-condensing
- Altitude: Up to 2000m operational
Export Classification
- ECCN (Export Control Classification Number): 3A991.a.2
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to US export administration regulations
- Documentation: Export licenses may be required for certain destinations
Quality Standards
- Automotive Qualification: Not AEC-Q100 qualified
- Industrial Grade: Commercial temperature range device
- Reliability: MTBF data available in reliability reports
- Quality System: Manufactured under ISO 9001 certified processes
Package Environmental Information
- Package Material: Standard mold compound
- Lead Frame: Copper alloy with standard plating
- Moisture Sensitivity Level (MSL): Level 3 (168 hours at 30°C/60% RH)
- Storage Requirements: Dry storage in moisture barrier bag recommended
The XC2S100-6FG256CES represents mature FPGA technology suitable for legacy design support and cost-sensitive applications where proven reliability is paramount. For new designs, consider migrating to current-generation AMD Xilinx FPGA families for enhanced features and long-term support.
