XC2C384-7FGG324C | High-Performance CPLD in FBGA Package

Product Specification

The XC2C384-7FGG324C is a premium Complex Programmable Logic Device (CPLD) from Xilinx’s renowned CoolRunner-II family. This high-speed variant features an advanced FBGA package design, providing excellent thermal performance and superior signal integrity for demanding applications requiring both high performance and reliable operation.

Key Technical Specifications:

• Logic Capacity: 9K Gates with 384 Macro Cells
• Logic Blocks: 24 Function Blocks with 16 macrocells per block
• Performance: Faster 7.1ns propagation delay
• Maximum Frequency: Enhanced 217MHz operation
• Technology: Advanced 0.18um CMOS technology
• Supply Voltage: Low-power 1.8V (operating range 1.7V to 1.9V)
• Package: 324-Pin Fine-Pitch Ball Grid Array (FBGA)
• I/O Pins: Expanded I/O capabilities compared to TQFP variants
• Power Consumption: Ultra-low power at just 28.8uW
• Standby Current: Minimal 16uA
• Operating Temperature: Commercial grade (0°C to 70°C)

Advanced Features:

• RealDigital Design Technology: Optimizes connection to CMOS-powered logic gates
• DataGATE Technology: Selectively disable inputs to reduce power consumption
• CoolCLOCK Technology: Dynamic power reduction through clock management
• Advanced Interconnect Matrix (AIM): Provides 40 true and complement inputs to each Function Block
• Flexible Clocking Options:
  • Optional DualEDGE triggered registers
  • Clock divider (÷ 2,4,6,8,10,12,14,16)
  • Multiple global clocks with phase selection per macrocell
• I/O Banking: Supports easy interfacing to 3.3V, 2.5V, 1.8V, and 1.5V devices
• In-System Programming: For easy field updates and configuration
• JTAG Support: IEEE Standard 1149.1/1532 for programming, prototyping, and testing
• Non-volatile Technology: Instant-on capability with no configuration memory

The XC2C384-7FGG324C offers the perfect balance of high-speed operation and low power consumption, with the “-7” speed grade providing faster performance than standard “-10” variants. The FBGA package design enables higher pin count and improved thermal characteristics, making it ideal for applications where board space is at a premium and reliable high-speed operation is critical.

Price

The XC2C384-7FGG324C is available through authorized distributors with pricing typically in the premium range due to its high-speed grade and FBGA package. While exact pricing varies based on quantity and market conditions, expect prices to range from approximately $25-40 per unit, with substantial volume discounts available for larger orders.

Important purchasing notes:

• This product is typically marked as Non-Cancellable and Non-Returnable (NCNR)
• Pricing fluctuates based on market availability and supply chain conditions
• For current pricing and availability, it’s recommended to request a quote from authorized Xilinx (now AMD) distributors
• Stock availability should be verified before design commitment

Documents & Media

Comprehensive documentation is available to support your development with the XC2C384-7FGG324C:

1. Product Datasheet (DS095): Detailed technical specifications for the XC2C384 family
2. CoolRunner-II Family Datasheet (DS090): Overview of the entire CoolRunner-II CPLD family
3. Application Notes: Implementation guides and design best practices
4. Pin Diagrams and Package Information: Detailed FBGA pinout for PCB design
5. Timing Models: For accurate simulation and verification
6. Environmental Information: RoHS and REACH compliance documentation
7. IBIS Models: For signal integrity analysis
8. Package Thermal Models: For thermal analysis and management

All documentation can be accessed through Xilinx’s (now AMD) documentation portal or from authorized distributors’ websites. The datasheet provides critical information about electrical characteristics, timing parameters, and package dimensions necessary for successful implementation.

Related Resources

Development Tools:

• Xilinx ISE Design Suite: Comprehensive development environment
• Vivado Design Suite: Modern design environment for newer projects
• WebPACK Tools: Free development tools for smaller designs

Programming Support:

• In-System Programming: Field updates and configuration capability
• IEEE Standard 1149.1/1532 Boundary-Scan (JTAG): For programming, prototyping, and testing
• JTAG Command Initiation: For standard FPGA configuration

Compatible Development Boards:

Several development boards are suitable for evaluation and prototyping with the XC2C384 family, including:

• ZedBoard
• Basys 3 board
• TinyFPGA BX
• Nexys4-DDR
• Terasic DE10-Nano
• Digilent Arty S7

Application Areas:

The XC2C384-7FGG324C is particularly well-suited for:

• High-performance computing systems
• Telecommunications equipment
• Industrial control systems
• Medical devices
• Test and measurement equipment
• High-speed interface applications
• Complex state machine implementations

Environmental & Export Classifications

Environmental Specifications:

• RoHS Status: RoHS Compliant
• REACH Compliance: REACH 211 Certified
• Operating Temperature Range: Commercial grade (0°C to 70°C)
• Storage Temperature: -65°C to +150°C
• Moisture Sensitivity Level: Standard handling requirements
• Lead-Free Status: Pb-free packaging available
• Package Material: Environmentally friendly materials

Export Classifications:

• USHTS Code: 8542390001
• CNHTS Code: 8542399000
• TARIC Code: 8542399000
• ECCN: EAR99

The XC2C384-7FGG324C combines high-speed performance with the benefits of a space-efficient FBGA package, making it ideal for complex digital systems where board space is limited but performance requirements are demanding. The 324-pin FBGA package provides excellent thermal performance and signal integrity, ensuring reliable operation in mission-critical applications.