Product Overview
The XC2C256-7FTG256C is a cutting-edge Complex Programmable Logic Device (CPLD) from Xilinx’s renowned CoolRunner-II family, engineered for superior performance in demanding digital applications. Featuring 256 macrocells in a robust 256-ball Fine-pitch Ball Grid Array (FTBGA) package, the XC2C256-7FTG256C delivers exceptional functionality for aerospace, automotive, industrial automation, and high-reliability systems.
Product Specifications
Core Features
- Part Number: XC2C256-7FTG256C
- Product Family: CoolRunner-II CPLD
- Logic Capacity: 256 macrocells
- Package: 256-ball Fine-pitch Ball Grid Array (FTBGA)
- Speed Grade: -7 (Standard performance)
- Temperature Grade: Commercial (0ยฐC to +70ยฐC)
Technical Parameters
- Function Blocks: 16 optimized function blocks
- Macrocells per Block: 16 macrocells
- User I/O Count: 184 maximum user I/O
- Total I/O Pins: 184
- Core Voltage: 3.3V ยฑ5%
- I/O Voltage Range: 1.8V to 3.3V
- Power Consumption: Ultra-low standby power
- Propagation Delay: 7.5ns typical
- System Frequency: Up to 178 MHz
Advanced Specifications
- Programming Technology: In-System Programmable Flash
- Configuration Interface: IEEE 1149.1 JTAG
- Data Retention: 20+ years non-volatile storage
- Program/Erase Cycles: 10,000+ minimum endurance
- Package Pitch: 1.0mm ball pitch
- Package Dimensions: 17mm x 17mm x 1.2mm
Price Information
The XC2C256-7FTG256C offers excellent value for high-performance CPLD applications. Current pricing and availability:
- Unit Price: Request quote for current pricing
- Volume Discounts: Significant savings for 250+ unit orders
- Sample Pricing: Engineering samples available
- Delivery Schedule: Standard 10-14 week lead time
- Expedited Options: Rush orders available with premium
Pricing Tiers
- 1-99 units: Standard list price
- 100-999 units: 5-15% volume discount
- 1000+ units: Custom pricing available
- Annual contracts: Additional preferred pricing
Pricing subject to change. Contact authorized distributors for real-time quotes.
Documents & Media
Technical Documentation
- Product Datasheet: XC2C256-7FTG256C Complete Specifications
- Reference Manual: CoolRunner-II CPLD Family Architecture Guide
- Application Notes:
- XAPP384: CoolRunner-II CPLD Design Guidelines
- XAPP393: Power Optimization Techniques
- XAPP400: High-Speed Design Considerations
- Errata Documents: Known issues and workarounds
- Migration Guides: Upgrade paths from legacy devices
Design Resources
- IBIS Models: Signal integrity simulation files
- SPICE Models: Analog simulation models
- BSDL Files: Boundary scan test vectors
- Timing Models: Setup and hold time specifications
- Power Models: Dynamic and static power estimation
Software Tools
- Vivado Design Suite: Complete development environment
- ISE Design Suite: Legacy design tools (still supported)
- PlanAhead: Floorplanning and timing closure
- ChipScope Pro: Embedded logic analyzer
- iMPACT: Device programming utility
Package Documentation
- Assembly Drawings: Mechanical specifications
- Land Pattern: PCB layout recommendations
- Thermal Models: Junction-to-ambient thermal resistance
- Soldering Guidelines: Reflow profile recommendations
Related Resources
Product Family
- XC2C128-7FTG256C: Lower-density 128 macrocell option
- XC2C384-7FTG256C: Higher-density 384 macrocell variant
- XC2C512-7FTG256C: Maximum-density 512 macrocell device
- XC2C256-6FTG256C: Faster -6 speed grade version
Development Platforms
- CoolRunner-II Development Kit: Complete evaluation system
- Spartan FPGA Boards: Complementary development platforms
- Custom Reference Designs: Application-specific examples
Programming Hardware
- Platform Cable USB II: High-speed JTAG programmer
- Digilent JTAG-HS3: Third-party programming solution
- In-circuit Debuggers: Real-time debugging tools
Technical Support
- Xilinx Answer Database: Searchable knowledge base
- Community Forums: Peer-to-peer technical discussions
- Technical Support Cases: Direct engineering support
- Training Resources: Online and instructor-led courses
- Design Consulting: Professional design services
Application Examples
- Industrial Control Systems: Motor control and automation
- Communications Infrastructure: Protocol processing
- Automotive Electronics: Body control modules
- Aerospace Systems: Avionics and control systems
Environmental & Export Classifications
Environmental Standards
- RoHS Compliance: Fully RoHS 2.0/3.0 compliant (lead-free)
- REACH Compliance: EU chemical regulation conformance
- Green Package: Halogen-free and environmentally responsible
- Conflict Minerals: DRC conflict-free certified supply chain
Quality Certifications
- ISO 9001: Quality management system certified
- ISO 14001: Environmental management system
- ISO 45001: Occupational health and safety
- TS 16949: Automotive quality standard (automotive grade)
Export Control Information
- Export Control Classification Number (ECCN): 3A001.a.1.a
- Harmonized Tariff Schedule (HTS): 8542.31.0001
- Country of Origin: Malaysia/Philippines (varies by lot)
- Export License: Standard semiconductor export regulations apply
- Shipping Restrictions: Consult current export control lists
Temperature Grades Available
- Commercial (C): 0ยฐC to +70ยฐC (standard)
- Industrial (I): -40ยฐC to +85ยฐC (extended range)
- Automotive (A): -40ยฐC to +125ยฐC (AEC-Q100 qualified)
- Military (M): -55ยฐC to +125ยฐC (MIL-STD-883 screened)
Package Environmental Ratings
- Moisture Sensitivity Level: MSL-3 (168 hours @ 30ยฐC/60% RH)
- ESD Classification: Class 1A (>1000V HBM)
- Latch-up Immunity: >100mA (per JEDEC standard)
- Alpha Particle Immunity: <0.001 FIT
Compliance Certifications
- CE Marking: European Conformity
- FCC Compliance: Electromagnetic compatibility
- UL Recognition: Safety standard compliance
- CSA Certification: Canadian safety approval
Why Choose XC2C256-7FTG256C?
The XC2C256-7FTG256C represents the pinnacle of CPLD technology, combining high logic density with ultra-low power consumption in a space-efficient FTBGA package. Its 256 macrocells provide substantial logic resources for complex applications, while the fine-pitch BGA package maximizes I/O density for space-constrained designs.
Key Advantages:
- Compact Form Factor: 17mm x 17mm package saves board space
- High I/O Density: 184 user I/Os in small footprint
- Low Power Design: Extends battery life in portable applications
- Fast Performance: 178 MHz system frequency capability
- Industrial Reliability: Proven CoolRunner-II architecture
- Design Flexibility: In-system programmability for easy updates
The XC2C256-7FTG256C is the ideal choice for designers requiring high-performance logic in space-critical applications. Its combination of features makes it perfect for next-generation embedded systems, communication equipment, and industrial automation solutions.
Ready to get started? Contact your local Xilinx distributor or field applications engineer to discuss how the XC2C256-7FTG256C can enhance your design.
