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XC18V02VQ44C: High-Performance FPGA Configuration Memory Solution

Original price was: $20.00.Current price is: $19.00.

Product Specification

The XC18V02VQ44C is a 2-Mbit In-System Programmable Configuration PROM designed specifically for Xilinx FPGA applications. This advanced configuration memory device delivers reliable, high-speed programming capabilities in a compact 44-pin VQFP package.

Key Technical Specifications:

  • Memory Capacity: 2 Megabits (256K x 8-bit organization)
  • Package Type: 44-pin Very thin Quad Flat Pack (VQFP)
  • Operating Voltage: 3.3V ยฑ10%
  • Programming Interface: In-System Programmable via JTAG
  • Access Time: Fast read access for efficient FPGA configuration
  • Operating Temperature Range: Commercial (0ยฐC to +70ยฐC)
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Endurance: 10,000 program/erase cycles minimum
  • Data Retention: 20 years typical at 85ยฐC

The XC18V02VQ44C features advanced configuration capabilities including boundary scan testing, in-system programming, and cascading support for larger memory requirements. Its compact VQFP44 footprint makes it ideal for space-constrained applications while maintaining excellent thermal performance.

Price

XC18V02VQ44C pricing varies based on quantity and supplier. Typical market pricing ranges:

  • Unit Price (1-99 pieces): $15-25 USD
  • Volume Pricing (100-999 pieces): $12-18 USD
  • Production Volumes (1000+ pieces): Contact authorized distributors for custom quotes

Note: Prices fluctuate based on market conditions, availability, and supplier. Contact authorized Xilinx distributors for current pricing and availability information.

Documents & Media

Technical Documentation:

  • Datasheet: Complete electrical specifications, timing diagrams, and package information
  • Programming Guide: Step-by-step instructions for in-system programming procedures
  • Application Notes: Best practices for PCB layout, decoupling, and thermal management
  • BSDL Files: Boundary scan description language files for testing and debugging
  • Package Drawings: Mechanical specifications and land pattern recommendations

Software Tools:

  • iMPACT Programming Software: Xilinx tool for device programming and verification
  • ChipScope Pro: For advanced debugging and analysis
  • ISE Design Suite: Complete development environment compatibility

Reference Designs:

  • Evaluation board schematics and layouts
  • Sample code and configuration examples
  • Integration guidelines with various FPGA families

Related Resources

Compatible FPGA Families:

  • Spartan-II series FPGAs
  • Spartan-IIE series FPGAs
  • Virtex series (selected devices)

Related Configuration PROMs:

  • XC18V01VQ44C: 1-Mbit version for smaller applications
  • XC18V04VQ44C: 4-Mbit version for larger configuration requirements
  • XC18V02PC44C: Plastic DIP package alternative

Development Tools:

  • Platform Cable USB: For JTAG programming interface
  • Parallel Cable IV: Alternative programming solution
  • Configuration PROM File Formatter: Software utility for bitstream preparation

Technical Support Resources:

  • Xilinx Answer Database for troubleshooting
  • Community forums and user groups
  • Field Application Engineer support
  • Online training modules and webinars

Environmental & Export Classifications

Environmental Compliance:

  • RoHS Compliant: Meets EU Directive 2011/65/EU restrictions on hazardous substances
  • REACH Compliant: Complies with EU chemical regulation requirements
  • Halogen-Free: Meets JEDEC JS709 halogen-free requirements
  • Conflict Minerals: Compliant with Section 1502 of Dodd-Frank Act

Quality Standards:

  • Automotive Grade: AEC-Q100 qualified versions available
  • Military/Aerospace: Extended temperature and screening options
  • Industrial Grade: -40ยฐC to +85ยฐC operating range variants

Export Classifications:

  • ECCN (Export Control Classification Number): 3A001.a.7
  • HTS (Harmonized Tariff Schedule): 8542.39.0001
  • Country of Origin: Varies by manufacturing location
  • Export License: May require export license depending on end-use and destination

Packaging and Shipping:

  • MSL (Moisture Sensitivity Level): Level 3 per JEDEC J-STD-020
  • ESD Classification: Class 1C per JEDEC JS-001
  • Packaging Options: Tape and reel, tube, or tray packaging available

The XC18V02VQ44C represents a reliable, industry-standard solution for FPGA configuration memory requirements, offering excellent performance, comprehensive documentation, and full regulatory compliance for diverse application needs.