Product Specifications
The XC18V01SOG20I features a robust architecture with 1-Mbit (131,072 x 8) memory capacity, operating at industrial temperature ranges from -40ยฐC to +85ยฐC. This device supports 3.3V operation with low power consumption characteristics, making it ideal for power-sensitive applications. The XC18V01SOG20I utilizes advanced Flash memory technology with 20-pin SOIC packaging, ensuring compact footprint and reliable performance.
Key technical specifications include fast programming and erase capabilities, with typical programming time of 10 seconds for full device capacity. The device supports both serial and parallel programming modes, offering flexibility in system integration. Data retention specifications exceed 20 years at 85ยฐC, ensuring long-term reliability in critical applications.
Pricing Information
XC18V01SOG20I pricing varies based on order quantity and distribution channel. Contact authorized distributors or the manufacturer directly for current pricing information, volume discounts, and availability schedules. Industrial-grade components like the XC18V01SOG20I typically command premium pricing due to their enhanced reliability specifications and extended operating temperature ranges.
Documents & Media
Technical documentation for the XC18V01SOG20I includes comprehensive datasheets detailing electrical characteristics, timing specifications, and programming procedures. Application notes provide implementation guidance for common use cases and design considerations. Programming software and utilities are available for download, supporting various development environments and programming hardware interfaces.
Reference designs and evaluation boards help accelerate development cycles when integrating the XC18V01SOG20I into new products. These resources include schematic examples, PCB layout guidelines, and software examples demonstrating proper device utilization.
Related Resources
The XC18V01SOG20I family includes multiple density options and package variants to meet diverse application requirements. Compatible programming hardware includes dedicated programmers and development boards supporting in-system programming capabilities. Software development tools provide seamless integration with popular FPGA design environments.
Related products in the configuration memory portfolio offer different capacities and feature sets, enabling designers to select optimal solutions for specific performance and cost requirements. Cross-reference guides help identify suitable alternatives and migration paths for existing designs.
Environmental & Export Classifications
The XC18V01SOG20I complies with RoHS (Restriction of Hazardous Substances) directives, ensuring environmental compatibility and regulatory compliance. The device meets REACH regulations and is manufactured using environmentally responsible processes.
Export classification information is available through official export control documentation. The XC18V01SOG20I may be subject to export licensing requirements depending on end-use applications and destination countries. Consult current export control regulations and manufacturer guidelines for specific compliance requirements.
Manufacturing processes incorporate lead-free soldering compatibility and moisture sensitivity level (MSL) classifications appropriate for standard surface-mount assembly procedures. Package marking includes environmental compliance indicators and traceability information supporting quality management systems.
The XC18V01SOG20I represents advanced configuration memory technology, combining high performance, reliability, and environmental responsibility in a compact, industry-standard package suitable for demanding industrial applications.
