Product Specifications
The XC17S10XLVO8I delivers exceptional performance with its comprehensive specification set:
Memory Configuration:
- Memory capacity: 10 Mbit (1,048,576 x 10 bits)
- Organization: Serial configuration memory
- Technology: CMOS EPROM with UV erasable capability
- Operating voltage: 3.3V ยฑ 5%
- Access time: 90ns maximum
Package Details:
- Package type: 8-pin SOIC (Small Outline Integrated Circuit)
- Temperature range: Industrial grade (-40ยฐC to +85ยฐC)
- Pin configuration: Standard 8-pin layout optimized for board space efficiency
Performance Characteristics:
- Fast serial data output for quick FPGA configuration
- Low power consumption during operation and standby
- High reliability with proven EPROM technology
- Compatible with Xilinx FPGA configuration protocols
Price
The XC17S10XLVO8I is competitively priced for volume applications. Pricing varies based on order quantity, delivery requirements, and current market conditions. Contact authorized distributors or Xilinx directly for current pricing information, volume discounts, and availability schedules. Educational and development pricing may be available for qualifying institutions and projects.
Documents & Media
Comprehensive technical documentation supports the XC17S10XLVO8I implementation:
Technical Documentation:
- Complete datasheet with electrical specifications and timing diagrams
- Application notes covering configuration best practices
- Programming specifications and procedures
- Pin-out diagrams and package mechanical drawings
- Configuration timing requirements and protocols
Design Resources:
- Reference designs for common FPGA configuration scenarios
- Schematic symbols and PCB footprints for major CAD tools
- Programming software utilities and device support files
- Compatibility matrices with Xilinx FPGA families
Quality Documentation:
- Reliability data and qualification test results
- Environmental compliance certificates
- Manufacturing process quality standards
Related Resources
The XC17S10XLVO8I integrates seamlessly with the broader Xilinx ecosystem:
Compatible FPGA Families:
- Spartan series FPGAs requiring serial configuration
- Virtex family devices supporting PROM-based configuration
- Legacy FPGA devices requiring external configuration memory
Development Tools:
- Xilinx ISE Design Suite for configuration file generation
- Vivado Design Suite for newer FPGA families
- Programming cables and hardware for device programming
- Configuration memory programming utilities
Alternative Solutions:
- Other capacity options in the XC17S series (2Mbit, 4Mbit, 20Mbit)
- Platform Flash configuration devices for advanced applications
- SPI Flash alternatives for cost-sensitive designs
Environmental & Export Classifications
The XC17S10XLVO8I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant with lead-free package options available
- REACH regulation compliance for European markets
- Conflict minerals compliance reporting available
- Halogen-free package variants for environmental sensitivity
Export Classifications:
- ECCN (Export Control Classification Number): 3A991.a.2
- CCATS (Commodity Classification Automated Tracking System) registered
- No export license required for most destinations
- Standard commercial export classification
Quality Standards:
- ISO 9001 certified manufacturing processes
- Automotive grade options available (AEC-Q100 qualified)
- Industrial temperature range standard (-40ยฐC to +85ยฐC)
- Extended temperature variants available for harsh environments
Reliability Specifications:
- MTBF (Mean Time Between Failures): >1,000,000 hours at 25ยฐC
- Data retention: 20 years minimum at 25ยฐC
- Endurance: 1,000 program/erase cycles minimum
- Electrostatic discharge (ESD) protection: 2kV HBM minimum
The XC17S10XLVO8I represents a proven solution for FPGA configuration applications requiring reliable, cost-effective memory storage. Its combination of proven EPROM technology, comprehensive documentation, and broad compatibility makes it an ideal choice for both development and production environments.
