Product Specifications
The XC17S10PD8C features a 10 Mbit (1,048,576 x 10) memory capacity, providing ample storage for complex FPGA bitstreams and configuration data. Operating at speeds up to 50 MHz, this serial PROM ensures fast and efficient data transfer during system initialization.
Key Technical Specifications:
- Memory density: 10 Mbit organized as 1,048,576 x 10 bits
- Operating voltage: 3.3V ยฑ 10%
- Maximum clock frequency: 50 MHz
- Package type: 8-pin PDIP (Plastic Dual In-line Package)
- Operating temperature range: 0ยฐC to +70ยฐC (commercial grade)
- Storage temperature range: -65ยฐC to +150ยฐC
- Programming cycles: 100 minimum erase/program cycles
- Data retention: 20 years minimum at 85ยฐC
The device incorporates advanced error detection and correction mechanisms, ensuring reliable operation in demanding industrial environments. Its low power consumption design makes the XC17S10PD8C ideal for battery-powered and energy-efficient applications.
Price
Pricing for the XC17S10PD8C varies based on order quantity, packaging options, and current market conditions. Volume discounts are typically available for orders exceeding 1,000 units. Contact authorized distributors or the manufacturer directly for current pricing information, as semiconductor prices fluctuate based on supply chain factors and market demand.
Educational institutions and development teams may qualify for special pricing programs. Long-term supply agreements can provide price stability for high-volume production requirements.
Documents & Media
Comprehensive technical documentation supports the XC17S10PD8C implementation process. The complete datasheet provides detailed electrical characteristics, timing diagrams, and application examples. Programming specifications outline the configuration process and compatible development tools.
Available Documentation:
- Complete product datasheet with electrical specifications
- Programming guide and software compatibility information
- Application notes for FPGA configuration scenarios
- Package dimensions and PCB layout recommendations
- Reliability and qualification test reports
- Migration guides from previous generation devices
Development software tools and drivers are available through the manufacturer’s website, providing seamless integration with popular FPGA design environments and programming platforms.
Related Resources
The XC17S10PD8C integrates seamlessly with various FPGA families and embedded processors. Compatible development boards and evaluation kits accelerate prototype development and system validation. Programming adapters and socket solutions support both development and production environments.
Complementary Products:
- FPGA configuration cables and programming adapters
- Development boards featuring the XC17S10PD8C
- Socket adapters for prototyping and testing
- Alternative density options within the same product family
- Next-generation serial configuration memory devices
Technical support resources include online forums, application engineering assistance, and comprehensive design guides. Training materials and webinars help engineers optimize their XC17S10PD8C implementations.
Environmental & Export Classifications
The XC17S10PD8C meets stringent environmental compliance standards, including RoHS (Restriction of Hazardous Substances) directive compliance for lead-free manufacturing. The device achieves MSL (Moisture Sensitivity Level) 3 classification, requiring standard dry packing and handling procedures.
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for European markets
- Conflict minerals reporting for responsible sourcing
- MSL 3 moisture sensitivity rating
- Green package marking for environmental identification
Export Classifications:
- ECCN (Export Control Classification Number): EAR99
- HTS (Harmonized Tariff Schedule) classification available
- Country of origin marking as required
- Standard commercial export licensing requirements
The XC17S10PD8C manufacturing process incorporates sustainable practices and environmental responsibility initiatives. Packaging materials utilize recyclable components where possible, supporting corporate environmental stewardship goals.
This reliable serial configuration PROM provides the performance, durability, and compliance characteristics required for modern electronic systems. The XC17S10PD8C represents proven technology for FPGA configuration applications across industrial, communications, and embedded computing markets.
