Product Specifications
The XA7A50T-2CSG325I features comprehensive technical specifications that make it suitable for complex digital signal processing and control applications:
Core Architecture:
- Logic Cells: 52,160 logic cells providing extensive programmable logic resources
- CLB Slices: 8,150 configurable logic block slices for flexible design implementation
- Block RAM: 2.7 Mb of block RAM for efficient data storage and buffering
- DSP Slices: 120 DSP48E1 slices optimized for high-performance arithmetic operations
Memory and I/O:
- Distributed RAM: 456 Kb of distributed RAM for distributed memory applications
- Maximum I/O Pins: 210 user I/O pins supporting various interface standards
- Package Type: CSG325 – 325-pin plastic ball grid array (PBGA)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC junction temperature)
Performance Characteristics:
- Speed Grade: -2 speed grade ensuring optimal timing performance
- Power Supply: Multiple voltage domains (1.0V core, 1.8V/2.5V/3.3V I/O)
- Configuration: Multiple configuration options including JTAG, SPI, and BPI modes
Price
Pricing for the XA7A50T-2CSG325I varies based on quantity, distributor, and current market conditions. For the most accurate and up-to-date pricing information, contact authorized Xilinx distributors or semiconductor suppliers. Volume discounts are typically available for production quantities.
Documents & Media
Technical Documentation:
- XA7A50T-2CSG325I Product Data Sheet
- Artix-7 FPGAs Data Sheet (DS181)
- Packaging and Pinout Specifications
- PCB Design Guidelines for CSG325 Package
- Automotive Quality and Reliability Report
Design Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Power estimation tools and thermal analysis guides
- Signal integrity and layout guidelines
Software Support:
- Vivado Design Suite support files
- IP core compatibility matrices
- Constraint files and example designs
Related Resources
Development Tools:
- Vivado Design Suite – Primary development environment for the XA7A50T-2CSG325I
- IP Integrator for system-level design
- ChipScope Pro for embedded logic analysis
- Power Estimator (XPE) for power analysis
Evaluation Platforms:
- Compatible development boards and evaluation kits
- Reference design platforms
- Third-party development solutions
Technical Support:
- Xilinx Answer Database for troubleshooting
- Community forums and design hubs
- Application engineering support
- Training materials and webinars
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Meets RoHS directive requirements for hazardous substance restrictions
- REACH Compliant: Complies with EU REACH regulation
- Automotive Grade: AEC-Q100 qualified for automotive applications
- Operating Temperature: -40ยฐC to +100ยฐC junction temperature range
- Storage Temperature: -65ยฐC to +150ยฐC
Export Classifications:
- ECCN (Export Control Classification Number): Subject to US export control regulations
- HTS (Harmonized Tariff Schedule): Classified under semiconductor device categories
- Country of Origin: Manufactured in accordance with international trade requirements
Quality Standards:
- ISO 9001 certified manufacturing processes
- Automotive quality management system compliance
- Statistical quality control and reliability testing
- Traceability and quality documentation
The XA7A50T-2CSG325I represents an excellent choice for engineers seeking a reliable, high-performance FPGA solution that meets stringent automotive and industrial requirements while providing the flexibility and capability needed for advanced digital designs.
