The XA6SLX9-3CSG324Q is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-6 family, designed to deliver exceptional performance for demanding applications. This advanced FPGA combines cost-effectiveness with robust functionality, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
The XA6SLX9-3CSG324Q features a comprehensive set of specifications that make it suitable for a wide range of applications:
Core Architecture:
- Logic Cells: 9,152
- Configurable Logic Blocks (CLBs): 1,430
- Block RAM: 576 Kb total
- DSP48A1 Slices: 16
- Maximum User I/O: 200
Performance Characteristics:
- Speed Grade: -3 (highest performance grade)
- Operating Temperature: Extended range for demanding environments
- Package Type: CSG324 (324-pin Chip Scale BGA)
- Supply Voltage: 1.2V core, 2.5V/3.3V I/O
Memory and Processing:
- Distributed RAM: 73 Kb
- Block RAM/FIFO: 576 Kb with ECC support
- Dedicated multipliers for high-speed DSP operations
- Advanced clock management with multiple PLLs
The XA6SLX9-3CSG324Q delivers exceptional logic density while maintaining low power consumption, making it perfect for battery-powered applications and systems requiring efficient thermal management.
Pricing Information
The XA6SLX9-3CSG324Q is competitively priced within the Spartan-6 family, offering excellent value for its feature set. Pricing varies based on:
- Order quantity (volume discounts available)
- Distribution channel
- Regional availability
- Current market conditions
For current pricing on the XA6SLX9-3CSG324Q, contact authorized Xilinx distributors or visit official pricing portals. Educational discounts may be available for qualifying institutions.
Documents & Media
Comprehensive documentation supports the XA6SLX9-3CSG324Q development process:
Technical Documentation:
- Spartan-6 Family Data Sheet
- XA6SLX9-3CSG324Q Pin Configuration Guide
- Power consumption and thermal analysis reports
- Package mechanical drawings and specifications
Development Resources:
- Reference designs and application notes
- Getting started guides for new users
- Best practices documentation
- Timing and constraint guidelines
Software Support:
- Xilinx ISE Design Suite compatibility
- Vivado Design Suite support (limited)
- IP core libraries and reference implementations
- Simulation models and verification tools
Related Resources
The XA6SLX9-3CSG324Q ecosystem includes numerous supporting resources:
Development Boards:
- Spartan-6 FPGA SP605 Evaluation Kit
- Third-party development platforms
- Custom evaluation boards from partners
IP Cores and Libraries:
- Xilinx LogiCORE IP portfolio
- DSP and communications IP
- Interface IP for common protocols
- Memory controllers and interfaces
Community and Support:
- Xilinx Community Forums
- Technical support resources
- Training materials and webinars
- Design examples and tutorials
Compatible Products:
- Other Spartan-6 family devices
- Configuration memories and support ICs
- Development tools and programming cables
Environmental & Export Classifications
The XA6SLX9-3CSG324Q meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliance
- Conflict minerals reporting
- ISO 14001 environmental management standards
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Extended temperature variants available
- Humidity tolerance: Up to 85% relative humidity
- Shock and vibration resistance per industry standards
Export Classifications:
- ECCN (Export Control Classification Number): Varies by configuration
- HTS (Harmonized Tariff Schedule) classification
- Country-specific import/export requirements
- Dual-use technology considerations
Quality Standards:
- Manufactured in ISO 9001 certified facilities
- Automotive-grade variants available (AEC-Q100)
- Industrial temperature grade options
- Extended reliability testing and qualification
The XA6SLX9-3CSG324Q represents an excellent balance of performance, features, and cost-effectiveness in the FPGA market. Its robust architecture, comprehensive development ecosystem, and proven reliability make it a preferred choice for engineers developing next-generation digital systems across industries including telecommunications, automotive, industrial automation, and consumer electronics.
