The XA6SLX45-2CSG324I is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-6 family, designed to deliver exceptional performance for demanding applications. This automotive-grade device combines advanced processing capabilities with robust reliability, making it an ideal choice for aerospace, defense, and industrial applications.
Product Specification
The XA6SLX45-2CSG324I features a comprehensive set of specifications that make it suitable for complex digital signal processing and control applications:
Core Architecture:
- Logic Cells: 45,000 equivalent gates
- Configurable Logic Blocks (CLBs): 2,791
- Block RAM: 2,088 Kb total memory
- DSP48A1 Slices: 58 dedicated multiply-accumulate blocks
- Maximum User I/O: 218 pins
Performance Characteristics:
- Speed Grade: -2 (optimized for balanced performance and power)
- Operating Temperature: -55ยฐC to +125ยฐC (automotive grade)
- Supply Voltage: 1.2V core, 2.5V/3.3V I/O
- Package Type: CSG324 (324-pin Chip Scale Grid array)
Memory and Connectivity:
- Distributed RAM: 401 Kb
- Block RAM/FIFO: 2,088 Kb
- Clock Management Tiles (CMTs): 4
- Phase-Locked Loops (PLLs): 4
- Digital Clock Managers (DCMs): 8
The XA6SLX45-2CSG324I supports multiple I/O standards including LVDS, SSTL, and HSTL, ensuring compatibility with various system interfaces and protocols.
Price
Pricing for the XA6SLX45-2CSG324I varies based on quantity, distributor, and current market conditions. The device is positioned as a mid-range solution within the Spartan-6 family, offering excellent value for applications requiring automotive-grade reliability.
For current pricing and availability, contact authorized Xilinx distributors or visit the official Xilinx website. Volume discounts are typically available for production quantities, with additional cost considerations for extended temperature testing and automotive qualification.
Documents & Media
Comprehensive documentation supports the XA6SLX45-2CSG324I implementation:
Technical Documentation:
- Spartan-6 Family Data Sheet (DS160)
- XA6SLX45-2CSG324I Device-specific specifications
- Spartan-6 FPGA Configuration User Guide
- Spartan-6 Libraries Guide for HDL Designs
- Package and pinout specifications
Development Resources:
- Vivado Design Suite compatibility information
- ISE Design Suite legacy support documentation
- Reference designs and application notes
- Power estimation and thermal analysis guides
Quality and Reliability:
- Automotive qualification test reports
- Reliability data and MTBF calculations
- Environmental stress screening procedures
- Quality management system certifications
Related Resources
The XA6SLX45-2CSG324I ecosystem includes extensive development tools and support resources:
Development Platforms:
- Spartan-6 FPGA SP605 Evaluation Kit
- Compatible development boards and reference designs
- Third-party evaluation platforms supporting CSG324 package
Software Tools:
- Xilinx Vivado Design Suite (limited support)
- ISE Design Suite (primary development environment)
- ChipScope Pro analyzer for debugging
- PlanAhead design and analysis tool
IP Cores and Libraries:
- Xilinx LogiCORE IP portfolio compatibility
- Memory controllers and interface IP
- DSP and signal processing IP cores
- Connectivity and protocol IP solutions
Training and Support:
- Xilinx University Program resources
- Technical support and design consultation
- Community forums and knowledge base
- Regional applications engineering support
Environmental & Export Classifications
The XA6SLX45-2CSG324I meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH (Registration, Evaluation, Authorization of Chemicals) compliant
- Automotive grade qualification per AEC-Q100
- Extended temperature range: -55ยฐC to +125ยฐC junction temperature
Quality Standards:
- ISO/TS 16949 automotive quality management
- ISO 9001 quality management system
- AS9100 aerospace quality standard compatibility
- IPC standards for assembly and handling
Export Classifications:
- Export Control Classification Number (ECCN) varies by configuration
- Dual-use technology considerations for certain applications
- Country-specific import/export documentation requirements
- Anti-diversion clause compliance for sensitive applications
Package and Handling:
- Moisture Sensitivity Level (MSL): Level 3
- Lead-free package construction
- Tape and reel packaging for automated assembly
- Electrostatic discharge (ESD) sensitive device handling required
The XA6SLX45-2CSG324I represents a mature, well-supported FPGA solution that balances performance, reliability, and cost-effectiveness for automotive and industrial applications requiring proven technology with long-term availability.
