The XA6SLX4-3CSG225I is a robust, military-grade FPGA from AMD Xilinx’s Spartan-6 family, specifically designed for aerospace, defense, and industrial applications requiring exceptional reliability and performance. This extended temperature range device delivers outstanding processing capabilities while maintaining cost-effectiveness for critical system implementations.
Product Specifications
Core Architecture
- Device Family: Spartan-6 LX Extended Temperature
- Logic Cells: 3,840 logic cells
- System Gates: 95,000 gates
- Block RAM: 216 Kb total block RAM
- Distributed RAM: 60 Kb
- DSP48A1 Slices: 8 dedicated multiply-accumulate blocks
Package & Pinout
- Package Type: CSG225 (Chip Scale Grid Array)
- Pin Count: 225 pins
- Package Size: 13mm x 13mm
- Ball Pitch: 0.8mm
- Maximum I/O: 132 user I/O pins
Performance Characteristics
- Speed Grade: -3 (highest performance grade)
- Maximum Frequency: Up to 375 MHz internal clock
- Operating Temperature: -55ยฐC to +125ยฐC (Extended/Military range)
- Supply Voltage: 1.2V core, 3.3V/2.5V/1.8V I/O
- Power Consumption: Low power consumption optimized
Memory & Connectivity
- Configuration Memory: External configuration required
- PCI Express: PCIe endpoint support
- Memory Interface: DDR3/DDR2/LPDDR support up to 800 Mbps
- High-Speed Serial: Up to 3.2 Gbps differential signaling
Pricing Information
The XA6SLX4-3CSG225I pricing varies based on quantity and distribution channel. Contact authorized distributors for current pricing:
- Small Quantity (1-99 units): Premium pricing for prototyping
- Medium Volume (100-999 units): Volume discount tiers available
- Large Volume (1000+ units): Significant cost reductions for production
- Long-term Agreements: Custom pricing for multi-year commitments
Pricing subject to change based on market conditions and availability. Contact your local distributor for current quotes.
Documents & Media
Technical Documentation
- Datasheet: XA6SLX4-3CSG225I complete electrical and mechanical specifications
- User Guide: Spartan-6 FPGA Configuration User Guide (UG380)
- PCB Layout Guidelines: Package-specific layout recommendations
- Power Estimation: XPower Analyzer compatibility and power calculation tools
Development Resources
- Vivado Design Suite: Full development environment support
- IP Core Library: Extensive pre-verified IP portfolio
- Reference Designs: Application-specific starting points
- Simulation Models: IBIS, SPICE, and behavioral models
Application Notes
- AN-531: Military Temperature FPGA Design Considerations
- AN-463: PCIe Endpoint Implementation Guide
- AN-586: High-Speed Design Techniques
- WP-284: Spartan-6 FPGA Architecture White Paper
Related Resources
Compatible Development Boards
- Spartan-6 FPGA SP605 Evaluation Kit: Full-featured development platform
- Custom Carrier Boards: Third-party solutions for specific applications
- Breadboard Adapters: CSG225 to DIP conversion boards
Complementary Products
- XA6SLX9-3CSG225I: Higher logic density alternative
- XA6SLX16-3CSG225I: Maximum performance option in same package
- Configuration Devices: Platform Flash and SPI Flash solutions
- Power Management: Dedicated FPGA power supply solutions
Software & Tools
- Vivado ML Edition: Advanced synthesis and implementation
- ChipScope Pro: Real-time debugging and analysis
- System Generator: DSP algorithm development
- EDK/SDK: Embedded processor development
Technical Support
- Design Consulting: Expert guidance for complex implementations
- Training Courses: Hands-on FPGA design workshops
- Community Forums: Peer-to-peer technical discussions
- Knowledge Base: Searchable solution database
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly
- REACH Regulation: Full compliance with EU chemical regulations
- Conflict Minerals: Responsible sourcing certification
- ISO 14001: Environmental management system certified
Quality Standards
- Military Temperature: MIL-STD-883 qualified components
- Automotive Grade: AEC-Q100 qualified for automotive applications
- Quality Grade: Industrial grade with enhanced screening
- Reliability Testing: Extended burn-in and temperature cycling
Export Classifications
- ECCN Classification: 3A001.a.2 (Export Administration Regulations)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufactured in ISO-certified facilities
- Export Licensing: May require export license for certain destinations
Certifications & Standards
- FCC Part 15: Electromagnetic compatibility certified
- CE Marking: European Conformity compliance
- UL Recognition: Safety standard compliance
- ITAR Classification: Not subject to International Traffic in Arms Regulations
The XA6SLX4-3CSG225I represents an ideal solution for applications demanding high reliability, extended temperature operation, and proven FPGA technology. Its combination of performance, package efficiency, and extensive tool support makes it the preferred choice for aerospace, defense, and industrial applications where failure is not an option.
For technical support, pricing inquiries, or application-specific guidance, contact your authorized AMD Xilinx distributor or visit the official product page for the most current information.
