The XA6SLX25T-2FGG484I is a premium field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-6 LXT family, engineered for mission-critical embedded applications requiring exceptional reliability and performance. This automotive-grade FPGA delivers optimal balance of logic capacity, power efficiency, and cost-effectiveness for demanding industrial and automotive environments.
1. Product Specifications
Core Architecture
- Logic Elements: 24,051 programmable logic cells
- Configurable Logic Blocks (CLBs): 1,879 CLBs for maximum design flexibility
- Memory Resources: 958,464 total RAM bits with 18Kb block RAMs
- DSP Resources: Enhanced DSP48A1 slices for high-performance signal processing
- Process Technology: Advanced 45nm low-power copper CMOS technology
Package & I/O Specifications
- Package Type: 484-pin Fine-pitch Ball Grid Array (FBGA)
- Package Dimensions: 23mm ร 23mm with 1mm pitch
- I/O Pins: 250 user I/O pins for extensive connectivity
- Lead-Free: RoHS compliant, lead-free construction
- Mounting: Surface Mount Technology (SMT) compatible
Performance Characteristics
- Speed Grade: -2 (667 MHz maximum operating frequency)
- Core Voltage: 1.2V nominal supply voltage
- Operating Temperature: Extended range -40ยฐC to +100ยฐC
- Moisture Sensitivity Level: MSL 3 (168 hours)
Advanced Features
- Clock Management: Enhanced mixed-mode clock management blocks with DCM and PLL
- Serial Transceivers: Power-optimized high-speed serial transceiver blocks
- Interface Support: PCI Express compatible Endpoint blocks
- Security: AES encryption and Device DNA protection for IP security
- Configuration: Auto-detect configuration options with multiple boot modes
Supported High-Speed Interfaces
- Serial ATA (SATA)
- Aurora protocol
- 1 Gigabit Ethernet
- PCI Express (PCIe)
- OBSAI and CPRI telecommunications standards
- EPON and GPON fiber optic networks
- DisplayPort video interface
- XAUI 10 Gigabit Ethernet
2. Price Information
The XA6SLX25T-2FGG484I is competitively positioned in the mid-range FPGA market segment. Pricing varies based on:
Volume Pricing Tiers
- Sample Quantities (1-9 units): Contact for current pricing
- Small Production (10-99 units): Volume discounts available
- Medium Production (100-999 units): Significant cost reductions
- High Volume (1000+ units): Maximum cost optimization
Pricing Factors
- Order quantity and lead times
- Market conditions and supply chain status
- Distribution channel and authorized reseller network
- Geographic region and shipping requirements
- Long-term supply agreements and forecasting
For current pricing and availability, contact authorized AMD Xilinx distributors or request quotes through certified electronic component suppliers. Educational institutions may qualify for special academic pricing programs.
3. Documents & Media
Essential Documentation
- Product Datasheet: Comprehensive technical specifications and electrical characteristics
- User Guide: Complete implementation guidelines and design recommendations
- Application Notes: Industry-specific design examples and best practices
- Packaging Information: Mechanical drawings and thermal characteristics
- Pin Configuration: Detailed pinout diagrams and signal descriptions
Development Resources
- Reference Designs: Proven design examples for rapid prototyping
- IP Core Library: Pre-verified intellectual property blocks
- Evaluation Boards: Development platforms for proof-of-concept designs
- Design Tools: Xilinx ISE and Vivado Design Suite compatibility
- Programming Files: Configuration bitstream examples
Media Resources
- Technical Videos: Implementation tutorials and design walkthroughs
- Webinar Recordings: Expert-led training sessions and product overviews
- Case Studies: Real-world application examples and success stories
- White Papers: In-depth technical analysis and comparative studies
4. Related Resources
Software Development Tools
- Xilinx ISE Design Suite: Legacy development environment with full support
- Vivado Design Suite: Advanced design tools for modern FPGA development
- SDK (Software Development Kit): Embedded software development platform
- ChipScope Pro: Hardware debugging and verification tools
- PlanAhead: Design planning and implementation optimization
Development Platforms
- Evaluation Boards: Ready-to-use development platforms
- Starter Kits: Complete development ecosystems for beginners
- Reference Designs: Production-ready implementation examples
- IP Portfolio: Extensive library of verified IP cores
- Third-Party Tools: Compatible EDA tools and simulation environments
Application Areas
- Automotive Electronics: Advanced driver assistance systems (ADAS)
- Industrial Automation: Process control and manufacturing systems
- Medical Imaging: High-resolution diagnostic equipment
- Communications Infrastructure: Network processing and protocol handling
- Consumer Electronics: Digital signal processing applications
- Aerospace & Defense: Mission-critical embedded systems
Compatible Product Family
- XA6SLX4T-2FGG484I (smaller capacity variant)
- XA6SLX9T-2FGG484I (entry-level option)
- XA6SLX16T-2FGG484I (mid-range alternative)
- XA6SLX45T-3FGG484I (higher performance option)
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Directive Compliant: Fully compliant with EU RoHS 2011/65/EU restrictions on hazardous substances
- REACH Regulation: Compliant with European chemical regulation standards
- Conflict Minerals: Certified conflict-free materials sourcing
- Green Packaging: Environmentally conscious packaging materials
- WEEE Directive: Electronic waste management compliance
Export Control Classifications
- ECCN (Export Control Classification Number): Classified under U.S. Department of Commerce regulations
- Export Administration Regulations (EAR): Subject to U.S. export control requirements
- HTS Code: Harmonized Tariff Schedule classification for international trade
- Country of Origin: Manufacturing origin documentation available
- End-Use Restrictions: Specific applications may require export licenses
Quality & Reliability Standards
- Automotive Grade: Extended temperature range and enhanced reliability testing
- ISO/TS 16949: Automotive quality management system compliance
- IPC Standards: PCB assembly and manufacturing guidelines compliance
- JEDEC Standards: Semiconductor device reliability and testing standards
- MIL-STD Compatibility: Military standard environmental testing compliance
Sustainability Initiatives
- Carbon Footprint Reduction: Optimized manufacturing processes
- Recyclable Materials: Environmentally responsible material selection
- Energy Efficiency: Low-power design optimization
- Supply Chain Transparency: Ethical sourcing verification
- Extended Product Life: Enhanced reliability for reduced electronic waste
