The XA6SLX25-3FTG256I is a high-performance, automotive-qualified Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx) designed specifically for cost-sensitive applications requiring exceptional reliability. This AEC-Q100 qualified device delivers optimal system integration capabilities at the lowest total cost for high-volume automotive, industrial, and consumer applications.
Product Specifications
Core Features
- FPGA Family: Spartan-6 LX XA (Automotive Grade)
- Logic Cells: 24,051 cells
- Process Technology: 45nm low-power CMOS
- Operating Voltage: 1.2V core voltage
- Package Type: 256-pin Fine-pitch Ball Grid Array (FTBGA-256)
- Package Dimensions: 17mm x 17mm with 1mm pitch
- Speed Grade: -3 (667 MHz maximum frequency)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- Qualification: AEC-Q100 automotive standard
Technical Specifications
- Configurable Logic Blocks (CLBs): 1,879 CLBs
- User I/O Pins: 186 programmable I/Os
- Block RAM: Multiple 18Kb dual-port block RAMs
- DSP Slices: DSP48A1 slices for high-performance signal processing
- Memory Controllers: Integrated SDRAM memory controllers
- Clock Management: Enhanced mixed-mode clock management blocks
- Built-in Security: AES encryption and Device DNA protection
Key Performance Features
- Logic-optimized LX subfamily design for absolute lowest cost
- High logic-to-pin ratios for maximum design efficiency
- Small form-factor packaging for space-constrained applications
- Dual-register 6-input lookup table (LUT) architecture
- SelectIO technology supporting diverse I/O protocols
- Power-optimized design with advanced system-level power management
Price
The XA6SLX25-3FTG256I pricing varies by quantity and distributor, with typical single-unit pricing ranging from $30-60 USD depending on current market conditions and order volume. For volume pricing and current availability:
- Contact authorized distributors for quantity-based pricing tiers
- Request quotes for orders exceeding standard displayed quantities
- Prices subject to market fluctuations in the semiconductor industry
- Academic and development pricing may be available through select programs
Note: Due to semiconductor market volatility, please contact distributors directly for current pricing and lead times.
Documents & Media
Technical Documentation
- Product Datasheet: Complete electrical characteristics and specifications
- User Guide: Design implementation guidelines and best practices
- Package Information: Detailed pinout diagrams and package specifications
- Errata Documentation: Known issues and workarounds
- Migration Guide: Transitioning from other FPGA families
Design Resources
- Reference Designs: Proven implementations for common applications
- Application Notes: Specific use-case implementations and optimizations
- PCB Layout Guidelines: Board design recommendations for optimal performance
- Thermal Management Guide: Heat dissipation and cooling considerations
Development Tools
- Vivado Design Suite: Complete FPGA design and implementation environment
- ISE Design Suite: Legacy development environment support
- IP Core Library: Pre-verified intellectual property blocks
- Simulation Models: Behavioral and timing simulation support
Related Resources
Development Platforms
- Spartan-6 Development Boards: Hardware platforms for prototyping and evaluation
- Third-party Development Kits: Compatible boards from ecosystem partners
- Evaluation Modules: Specific application-focused demonstration platforms
Software Ecosystem
- Vivado HLS: High-level synthesis for C/C++ to RTL conversion
- SDSoC Development Environment: Software-defined SoC design flow
- MicroBlaze Soft Processor: Embedded processor IP for system integration
- Linux and Real-time OS Support: Operating system compatibility
Application Areas
- Automotive Infotainment: Dashboard displays, entertainment systems
- Industrial Automation: Control systems, sensor interfaces, motor control
- Consumer Electronics: Set-top boxes, digital cameras, gaming
- Communications: Protocol bridging, interface conversion
- Medical Devices: Portable diagnostic equipment, monitoring systems
Replacement and Compatibility
- Pin-compatible Variants: Alternative speed grades and temperature ranges
- Upgrade Path: Migration to newer FPGA families
- Second Source Options: Alternative suppliers for supply chain security
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free manufacturing process
- Halogen-Free: Environmentally friendly packaging materials
- REACH Compliance: European chemical regulation conformity
- Green Package: Sustainable packaging materials and processes
Automotive Qualifications
- AEC-Q100 Grade 2: Qualified for automotive applications (-40ยฐC to +105ยฐC)
- Automotive Supply Chain: Qualified manufacturing and distribution network
- Long-term Availability: Extended product lifecycle support
- Change Control Process: Formal notification for any manufacturing changes
Export and Trade Compliance
- Export Control Classification Number (ECCN): 3A001.a.7
- Country of Origin: Various (refer to specific lot markings)
- ITAR Status: Not subject to International Traffic in Arms Regulations
- Dual-Use Technology: Standard commercial encryption capabilities
Quality and Reliability
- Zero Defects Program: Comprehensive quality assurance processes
- Statistical Quality Control: Continuous monitoring and improvement
- Reliability Testing: Extended temperature cycling, vibration, and shock testing
- Failure Analysis Support: Comprehensive investigation of field failures
Packaging and Shipping
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- Anti-static Packaging: ESD-safe handling and storage
- Traceability: Full lot tracking and genealogy records
- Tape and Reel: High-volume automated assembly packaging available
The XA6SLX25-3FTG256I represents the optimal balance of performance, cost, and reliability for automotive and industrial applications requiring programmable logic solutions. Its automotive qualification, robust feature set, and extensive ecosystem support make it an ideal choice for demanding embedded system designs.
