The XA6SLX25-3FGG484Q is a ruggedized field-programmable gate array (FPGA) from Xilinx’s aerospace-grade Spartan-6 family, specifically designed for mission-critical applications in harsh environments. This advanced FPGA delivers exceptional performance, reliability, and flexibility for aerospace, defense, and space applications where standard commercial components cannot meet stringent requirements.
Product Specifications
Core Architecture
The XA6SLX25-3FGG484Q features a robust 45nm process technology with 24,051 logic cells and 3,470 configurable logic blocks (CLBs). This aerospace-qualified FPGA includes 52 dedicated multipliers and 1,835 Kb of total block RAM, providing substantial computational resources for complex signal processing and control applications.
Key Technical Features
- Logic Cells: 24,051 logic cells for complex digital designs
- Package Type: 484-pin Fine-Pitch Ball Grid Array (FBGA484)
- Speed Grade: -3 (highest performance grade available)
- Operating Temperature: Extended aerospace temperature range (-55ยฐC to +125ยฐC)
- I/O Pins: 266 user I/O pins with multiple voltage standards support
- Memory: 52 dedicated 18Kb block RAMs totaling 936 Kb
- Clock Management: 4 Clock Management Tiles (CMTs) with advanced clocking features
Power and Performance
The XA6SLX25-3FGG484Q operates with low power consumption while maintaining high performance. The device supports multiple power supply voltages including 1.2V core voltage and 1.5V, 1.8V, 2.5V, and 3.3V I/O standards, enabling flexible system integration.
Price Information
Pricing Structure
The XA6SLX25-3FGG484Q typically commands premium pricing due to its aerospace qualification and extended screening processes. Pricing varies based on:
- Order quantity (volume discounts available)
- Packaging requirements
- Delivery timeline
- Additional screening or testing requirements
Contact authorized distributors for current pricing and availability, as aerospace-grade components often have longer lead times and require proper export documentation.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation guidelines and best practices
- Packaging Information: Detailed package drawings and specifications
- Qualification Report: Aerospace screening and testing results
- Application Notes: Design guidance for aerospace applications
Development Resources
- Vivado Design Suite: Professional FPGA development environment
- Reference Designs: Pre-validated designs for common aerospace applications
- IP Cores: Certified intellectual property blocks for rapid development
- Simulation Models: SPICE and behavioral models for system simulation
Compliance Certificates
- Military Standard Compliance: MIL-PRF-38535 qualification documentation
- Space Applications: NASA screening and qualification reports
- Quality Certifications: AS9100 and ISO 9001 manufacturing certifications
Related Resources
Development Tools
The XA6SLX25-3FGG484Q is fully supported by Xilinx’s comprehensive development ecosystem, including the Vivado Design Suite for design entry, synthesis, implementation, and debugging. ChipScope Pro provides advanced on-chip debugging capabilities essential for aerospace applications.
Compatible Products
- XA6SLX16-3FGG484Q: Lower logic density option in same package
- XA6SLX45-3FGG484Q: Higher logic density alternative
- XA7A35T-2FGG484Q: Next-generation 7-series aerospace FPGA
- Supporting Components: Aerospace-qualified configuration memories, power management ICs, and crystal oscillators
Application Areas
The XA6SLX25-3FGG484Q excels in demanding aerospace applications including satellite payload processing, avionics systems, radar signal processing, communication systems, and space-based instrumentation where reliability and radiation tolerance are paramount.
Design Services
Authorized design service partners provide specialized expertise in aerospace FPGA implementation, including radiation-hardened design techniques, fault-tolerant architectures, and compliance with aerospace standards.
Environmental & Export Classifications
Environmental Specifications
The XA6SLX25-3FGG484Q meets stringent aerospace environmental requirements:
- Operating Temperature Range: -55ยฐC to +125ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Up to 85% relative humidity, non-condensing
- Altitude: Operational up to 70,000 feet
- Vibration: Compliant with MIL-STD-883 vibration requirements
- Shock: Meets aerospace shock and acceleration specifications
Radiation Performance
- Total Ionizing Dose (TID): Qualified for space radiation environments
- Single Event Effects (SEE): Characterized for cosmic ray susceptibility
- Neutron Displacement: Tested for neutron-induced degradation
Export Classifications
The XA6SLX25-3FGG484Q is subject to export control regulations:
- ECCN (Export Control Classification Number): 3A001.a.2.c
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Export License: May require export license for certain countries and applications
- ITAR Compliance: Potential International Traffic in Arms Regulations applicability
Quality Standards
- MIL-PRF-38535: Military specification for microcircuits
- AS9100: Aerospace quality management system
- ISO 9001: International quality management standard
- NASA Standards: Space-flight qualified screening processes
Manufacturing Location
Manufactured in controlled facilities with full traceability and chain of custody documentation required for aerospace applications. All devices undergo extensive screening including burn-in, temperature cycling, and electrical testing to ensure maximum reliability.
The XA6SLX25-3FGG484Q represents the pinnacle of aerospace-qualified FPGA technology, combining high performance with uncompromising reliability for the most demanding space and defense applications.
