The XA6SLX100-2FGG484I is a powerful automotive-grade Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-6 family, designed to deliver exceptional performance for demanding digital signal processing and embedded applications. This advanced FPGA combines high logic density with automotive reliability standards, making it ideal for mission-critical systems.
Product Specifications
The XA6SLX100-2FGG484I features robust specifications that meet the demanding requirements of automotive and industrial applications:
Core Architecture:
- Logic Cells: 101,261
- CLB Slices: 15,822
- Block RAM: 4,824 Kb total capacity
- DSP48A1 Slices: 180 dedicated multiply-accumulate blocks
- Maximum User I/O: 338 pins
Package Details:
- Package Type: FBGA (Fine-pitch Ball Grid Array)
- Pin Count: 484 pins
- Package Size: 23mm x 23mm
- Ball Pitch: 0.8mm
Performance Characteristics:
- Speed Grade: -2 (mid-range performance)
- Operating Temperature: -40ยฐC to +125ยฐC (automotive grade)
- Supply Voltage: 1.2V core, 3.3V/2.5V/1.8V I/O
- Maximum Operating Frequency: Up to 400+ MHz
Memory and Connectivity:
- Distributed RAM: 1,355 Kb
- Memory Controller: Built-in hard memory controller
- Transceivers: Not applicable for this model
- PCI Express: Endpoint support available
Pricing Information
XA6SLX100-2FGG484I pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing tiers:
- Small Quantity (1-24 units): Contact for quote
- Medium Volume (25-99 units): Volume discounts available
- Large Volume (100+ units): Significant cost reductions possible
- OEM Pricing: Custom pricing for high-volume applications
Note: Prices subject to change based on market conditions and availability. Request official quotes from authorized distributors for accurate pricing.
Documents & Media
Essential documentation and resources for the XA6SLX100-2FGG484I:
Technical Documentation:
- Spartan-6 FPGA Data Sheet (DS160)
- XA6SLX100-2FGG484I Product Brief
- Spartan-6 FPGA Configuration User Guide
- Packaging and Pinout Specifications
- Automotive Temperature Characterization Report
Design Resources:
- Vivado Design Suite compatibility information
- ISE Design Suite 14.7 support files
- Reference designs and application notes
- PCB footprint and layout guidelines
- Power estimation spreadsheets
Software Tools:
- Xilinx ISE WebPACK (free version available)
- Vivado Design Suite (for newer projects)
- ChipScope Pro Analyzer support
- Impact programming tool compatibility
Related Resources
Development Platforms:
- Spartan-6 FPGA SP605 Evaluation Kit
- Spartan-6 FPGA SP601 Evaluation Kit
- Custom development boards from third-party vendors
Companion Products:
- XA6SLX75-2FGG484I (smaller density option)
- XA6SLX150-2FGG484I (higher density alternative)
- Configuration memory devices (Platform Flash)
- Power management solutions
Application Areas:
- Automotive infotainment systems
- Advanced driver assistance systems (ADAS)
- Industrial automation and control
- Medical device applications
- Aerospace and defense systems
- High-performance computing accelerators
Technical Support:
- Xilinx Community Forums
- Application engineering support
- Training courses and webinars
- Third-party IP core ecosystem
Environmental & Export Classifications
The XA6SLX100-2FGG484I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS Compliant (Lead-free)
- REACH Regulation compliant
- Conflict Minerals Reporting Template available
- Green packaging standards met
Automotive Standards:
- AEC-Q100 qualified for automotive applications
- Temperature Grade 2 (-40ยฐC to +125ยฐC)
- Automotive Product Lifecycle Management
- ISO/TS 16949 manufacturing quality
Export Control Classification:
- ECCN (Export Control Classification Number): 5A002
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various (check specific lot)
- Export licensing may be required for certain destinations
Quality and Reliability:
- Automotive-grade screening and testing
- Extended temperature range validation
- Enhanced qualification testing
- Long-term supply commitment
Packaging and Handling:
- Moisture Sensitivity Level (MSL): Level 3
- ESD sensitive device – proper handling required
- Tape and reel packaging available
- Anti-static packaging standards
The XA6SLX100-2FGG484I represents an excellent choice for engineers requiring high-performance FPGA capabilities with automotive-grade reliability. Its combination of logic density, DSP resources, and environmental robustness makes it suitable for the most demanding applications across multiple industries.
