1. Product Specifications
Core Architecture
- Device Family: Spartan-3E FPGA
- Logic Cells: 500,000 system gates
- CLBs (Configurable Logic Blocks): 4,656 logic cells
- Block RAM: 360 Kbits total block RAM
- Distributed RAM: 73 Kbits
- Multipliers: 20 dedicated 18×18 multipliers
Package & Pinout
- Package Type: FTBGA (Fine-pitch Ball Grid Array)
- Pin Count: 256 pins
- Package Size: 17x17mm
- Ball Pitch: 1.0mm
- Operating Temperature Range: -40ยฐC to +125ยฐC (Automotive grade)
Performance Specifications
- Speed Grade: -4 (High performance)
- Maximum Frequency: Up to 326 MHz
- I/O Standards: Support for multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL
- User I/O Pins: 190 maximum user I/O pins
- Differential I/O Pairs: 95 pairs
Power Specifications
- Supply Voltage:
- Core: 1.2V ยฑ5%
- I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
- Power Consumption: Optimized for low-power applications
- Sleep Mode: Ultra-low power standby mode available
Memory Resources
- Block RAM Blocks: 20 blocks (18 Kbit each)
- FIFO Support: Hardware FIFO implementation
- ROM/RAM Configuration: Flexible memory configuration options
2. Pricing Information
Note: Pricing for the XA3S500E-4FTG256Q varies based on quantity, distribution channel, and current market conditions. For accurate pricing information:
- Contact authorized Xilinx distributors for current pricing
- Volume pricing available for quantities over 1,000 units
- Engineering samples may be available for qualified projects
- Pricing typically ranges from $15-45 USD per unit depending on volume
Contact your local Xilinx sales representative or authorized distributor for detailed pricing and availability.
3. Documents & Media
Technical Documentation
- XA3S500E-4FTG256Q Datasheet – Complete electrical and mechanical specifications
- Spartan-3E FPGA Family Data Sheet – Comprehensive family overview
- Spartan-3E FPGA User Guide – Implementation and design guidelines
- Package and Pinout Specifications – Detailed pinout diagrams and package information
Design Resources
- ISE Design Suite – Complete development environment
- IP Core Libraries – Pre-verified IP blocks and cores
- Reference Designs – Application-specific design examples
- Constraint Files (UCF) – Pin assignment and timing constraint templates
Application Notes
- Power Management Guidelines – Optimizing power consumption
- PCB Layout Recommendations – Best practices for board design
- Thermal Management – Heat dissipation and thermal design guidelines
- Signal Integrity Guidelines – High-speed design considerations
4. Related Resources
Development Tools
- Xilinx ISE Design Suite – Integrated development environment
- ChipScope Pro – Real-time debugging and analysis
- EDK (Embedded Development Kit) – Embedded processor design tools
- System Generator for DSP – MATLAB/Simulink integration
Evaluation Boards
- Spartan-3E Starter Kit – Complete development platform
- Custom evaluation boards available from third-party vendors
- Application-specific demo boards for rapid prototyping
Software Support
- Device drivers for multiple operating systems
- VHDL/Verilog libraries and design templates
- Simulation models for popular simulators
- Programming file formats (.bit, .mcs, .hex)
Technical Support
- Xilinx Support Center – Online technical support portal
- Community Forums – User community and expert discussions
- Training Courses – FPGA design methodology and tools training
- Application Engineers – Direct technical support for complex designs
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant – Lead-free and environmentally friendly
- REACH Regulation – EU chemical safety compliance
- Conflict Minerals – 3TG conflict-free sourcing certified
- ISO 14001 – Environmental management system certified
Quality & Reliability Standards
- AEC-Q100 Qualified – Automotive Electronics Council standards
- Automotive Grade – Extended temperature range and enhanced reliability
- Quality Grade: Industrial/Automotive grade components
- MTBF Rating: >1,000,000 hours at 25ยฐC
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Varies by manufacturing location
- Export License: May require export license for certain destinations
Safety & Regulatory Approvals
- FCC Compliance – Electromagnetic compatibility
- CE Marking – European conformity standards
- UL Recognition – Safety certification for electronic components
- CSA Certification – Canadian safety standards
Packaging & Handling
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- ESD Sensitivity: Class 1C (1000V Human Body Model)
- Storage Temperature: -65ยฐC to +150ยฐC
- Shelf Life: 10 years from date of manufacture
Keywords: XA3S500E-4FTG256Q, Spartan-3E FPGA, Xilinx FPGA, automotive FPGA, programmable logic, field programmable gate array, 256-pin FTBGA, high-performance FPGA, embedded systems, digital signal processing
This product description is optimized for search engines while maintaining technical accuracy and readability. The XA3S500E-4FTG256Q represents a robust solution for demanding applications requiring reliable programmable logic performance.
