Product Specifications
Core Architecture Details
- Device Family: Xilinx Spartan-3E FPGA series
- System Gates: 500,000 equivalent logic gates
- Package Configuration: FT256Q (Ceramic Quad Flat Pack)
- Total Pins: 256 ceramic package pins
- Speed Grade: -4 (premium performance grade)
- Temperature Range: Extended industrial (-40ยฐC to +125ยฐC)
Logic Resources
- Configurable Logic Blocks: High-density CLB array
- Look-Up Tables: 4-input LUT configuration
- Flip-Flops: Distributed throughout fabric
- Slice Count: Optimized for complex designs
- Routing Matrix: Advanced interconnect architecture
Memory Architecture
- Block RAM: 360 Kbits total block memory
- Distributed RAM: 40 Kbits embedded memory
- Memory Controllers: Multiple interface support
- Configuration Storage: Fast reconfiguration capability
- FIFO Support: Hardware FIFO implementation
Input/Output Capabilities
- User I/O Count: Up to 190 configurable I/O pins
- Voltage Support: 1.2V to 3.3V I/O standards
- Differential Signaling: LVDS and LVPECL support
- Termination: Programmable input/output termination
- Drive Strength: Selectable output drive capabilities
Performance Characteristics
- System Clock: Up to 320 MHz operation
- Digital Signal Processing: Embedded multiplier blocks
- Clock Management: Integrated Digital Clock Manager
- Timing Closure: Advanced timing analysis tools
- Power Efficiency: Optimized power consumption
Pricing Information
XA3S500E-4FT256Q pricing depends on volume requirements and market conditions:
Standard Pricing Tiers
- Low Volume (1-24 units): Premium pricing – contact distributor
- Medium Volume (25-99 units): Volume discount pricing available
- High Volume (100+ units): Significant cost reduction opportunities
- Production Quantities (1000+): Competitive long-term pricing contracts
Pricing Factors
- Package Type: Ceramic quad flat pack premium
- Speed Grade: -4 grade commands higher pricing
- Temperature Range: Extended range adds cost premium
- Lead Time: Standard vs. expedited delivery options
- Geographic Region: Regional pricing variations apply
Current pricing available through authorized Xilinx distributors. Contact local representatives for detailed quotations and availability information.
Documents & Media
Technical Documentation Suite
- Product Datasheet: Complete electrical specifications and characteristics
- Reference Manual: Detailed architecture and implementation guide
- Package Documentation: Mechanical drawings and pinout information
- Characterization Reports: Performance and timing analysis data
- Qualification Documentation: Reliability and testing standards
Design Implementation Resources
- Constraints Guide: UCF file templates and timing constraints
- Power Estimation: Power consumption analysis and optimization
- Thermal Management: Heat dissipation and cooling requirements
- Signal Integrity: Layout guidelines and best practices
- EMI/EMC Compliance: Electromagnetic compatibility considerations
Software Documentation
- ISE Tutorial: Step-by-step design implementation guide
- Synthesis Guidelines: HDL coding best practices
- Place and Route: Optimization strategies and techniques
- Debugging Guide: ChipScope and troubleshooting procedures
- Migration Guide: Upgrade paths from previous generations
Multimedia Resources
- Architecture Overview: Technical presentation videos
- Design Methodology: Webinar series and training content
- Application Spotlights: Real-world implementation case studies
- Product Demonstrations: Live development environment tours
Related Resources
Development Environment
- Xilinx ISE Design Suite: Complete FPGA development platform
- Vivado Compatibility: Future migration pathway support
- ModelSim Integration: Advanced simulation capabilities
- Synopsys Support: Third-party synthesis tool compatibility
- Mentor Graphics: Professional verification tool support
IP Core Library
- Communication Interfaces: Ethernet, USB, PCIe controllers
- Signal Processing: DSP and filtering IP blocks
- Memory Controllers: DDR, SRAM, and Flash interfaces
- Processor Cores: Soft-core processor implementations
- Custom IP: Application-specific intellectual property
Evaluation and Development Boards
- Spartan-3E Development Kit: Complete prototyping platform
- Application-Specific Boards: Targeted development solutions
- Third-Party Platforms: Partner ecosystem development tools
- Custom Board Support: Reference designs and layouts
- Breakout Modules: Individual component evaluation tools
Design Services and Support
- Xilinx Alliance Program: Certified design service partners
- Technical Support: Engineering assistance and consultation
- Training Programs: Professional development workshops
- User Community: Online forums and peer collaboration
- Application Engineering: Dedicated technical expertise
Environmental & Export Classifications
Environmental Standards Compliance
- RoHS Directive: Lead-free manufacturing and materials
- WEEE Compliance: Waste electrical equipment regulations
- REACH Regulation: Chemical substance safety requirements
- Conflict Minerals: Responsible sourcing certification
- Carbon Footprint: Environmental impact assessment
Operating Environment Specifications
- Ambient Temperature: -40ยฐC to +125ยฐC operational range
- Storage Temperature: -65ยฐC to +150ยฐC non-operational
- Relative Humidity: 5% to 95% non-condensing operation
- Altitude Operating: Sea level to 2000 meters
- Vibration Resistance: MIL-STD shock and vibration testing
Export Control Classifications
- ECCN Designation: Export Administration Regulations compliance
- ITAR Classification: International Traffic in Arms Regulations
- Country of Origin: Manufacturing location documentation
- Re-export Controls: Technology transfer restrictions
- End-User Licensing: Government authorization requirements
Quality and Reliability Standards
- Automotive Qualification: AEC-Q100 Grade 2 availability
- Military Standards: MIL-STD-883 qualification testing
- Space Applications: Radiation-tolerant variants available
- Industrial Certification: Extended temperature validation
- Reliability Testing: HTOL, TC, and burn-in qualification
Package Environmental Characteristics
- Moisture Sensitivity: MSL-3 classification standard
- Reflow Profile: Lead-free soldering compatibility
- Storage Requirements: Moisture barrier bag packaging
- Handling Guidelines: Electrostatic discharge protection
- Thermal Cycling: Package stress testing validation
Sustainability Initiatives
- Green Manufacturing: Environmentally conscious production
- Recyclable Materials: End-of-life disposal considerations
- Energy Efficiency: Low-power design optimization
- Supply Chain: Sustainable sourcing practices
- Life Cycle Assessment: Environmental impact evaluation
The XA3S500E-4FT256Q delivers uncompromising performance and reliability for applications demanding the highest levels of quality and long-term support. Its ceramic package construction and extended temperature range make it ideal for harsh environment deployments, while the comprehensive development ecosystem ensures rapid time-to-market for complex FPGA-based solutions.
