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XA3S500E-4CPG132I: High-Performance Spartan-3E FPGA Solution

Original price was: $20.00.Current price is: $19.00.

Product Specifications

Core Specifications

  • Part Number: XA3S500E-4CPG132I
  • Family: Spartan-3E Extended Temperature
  • System Gates: 500,000
  • Logic Cells: 10,476
  • CLB Array: 46 x 34
  • Total Block RAM: 360 Kbits
  • Dedicated Multipliers: 20 (18×18)
  • Maximum User I/O: 92

Package Details

  • Package Type: CPG132 (Chip-scale Package)
  • Pin Count: 132 pins
  • Package Size: 8mm x 8mm
  • Ball Pitch: 0.5mm

Performance Characteristics

  • Speed Grade: -4 (High Performance)
  • Supply Voltage: 1.2V core, 3.3V I/O
  • Maximum Frequency: Up to 200+ MHz
  • Power Consumption: Optimized for low power operation

Temperature Range

  • Operating Temperature: -40ยฐC to +100ยฐC (Industrial)
  • Storage Temperature: -65ยฐC to +150ยฐC

Price Information

The XA3S500E-4CPG132I is competitively priced within the industrial FPGA market segment. Pricing varies based on:

  • Quantity Breaks: Volume discounts available for orders of 100+ units
  • Lead Time: Standard lead times range from 8-12 weeks
  • Distribution Channel: Authorized distributors may offer competitive pricing
  • Custom Packaging: Special packaging options may affect pricing

Contact authorized distributors or sales representatives for current pricing and availability information.

Documents & Media

Technical Documentation

  • Datasheet: Complete electrical and mechanical specifications
  • User Guide: Comprehensive implementation guidelines
  • Application Notes: Design best practices and reference implementations
  • Package Information: Detailed mechanical drawings and pin assignments
  • Errata: Known issues and workaround solutions

Development Resources

  • ISE Design Suite: Compatible development environment
  • Reference Designs: Pre-verified IP cores and example projects
  • Simulation Models: IBIS and SPICE models for signal integrity analysis
  • PCB Footprints: CAD library components for major design tools

Quality Documentation

  • Qualification Reports: Military and aerospace qualification data
  • Reliability Data: MTBF calculations and stress test results
  • Quality Manual: Manufacturing quality processes and standards

Related Resources

Development Tools

  • Xilinx ISE Design Suite: Primary development environment for XA3S500E-4CPG132I
  • ChipScope Pro: Integrated logic analyzer for debugging
  • EDK (Embedded Development Kit): Embedded processor design tools
  • System Generator: MATLAB/Simulink integration tools

Evaluation Platforms

  • Spartan-3E Starter Kit: Rapid prototyping and evaluation board
  • Custom Evaluation Boards: Third-party development platforms
  • Reference Design Kits: Application-specific evaluation systems

Support Ecosystem

  • Technical Support: Comprehensive online and phone support
  • Training Programs: Design methodology and tool training
  • Design Services: Professional consulting and implementation services
  • User Forums: Community-driven support and knowledge sharing

Compatible IP Cores

  • MicroBlaze Soft Processor: Embedded processing solution
  • Communication Interfaces: UART, SPI, I2C, Ethernet controllers
  • DSP Functions: Digital signal processing IP blocks
  • Memory Controllers: DDR, SRAM, and Flash memory interfaces

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Meets European restrictions on hazardous substances
  • REACH Compliant: Complies with EU chemical regulations
  • Conflict Minerals: Compliant with conflict-free sourcing requirements
  • WEEE Directive: Supports waste electrical equipment recycling

Quality Standards

  • ISO 9001: Manufacturing quality management certification
  • AS9100: Aerospace quality management system compliance
  • Military Standards: MIL-STD-883 and MIL-PRF-38535 qualified versions available
  • Automotive: AEC-Q100 qualified variants for automotive applications

Export Classifications

  • ECCN: Export Control Classification Number compliance
  • Country of Origin: Manufacturing location documentation
  • Export Licensing: Required documentation for international shipments
  • ITAR Status: International Traffic in Arms Regulations compliance where applicable

Packaging and Handling

  • ESD Sensitive: Proper electrostatic discharge precautions required
  • Moisture Sensitivity: MSL-3 moisture sensitivity level
  • Storage Requirements: Controlled temperature and humidity storage
  • Shipping: Anti-static packaging and proper handling procedures

Conclusion

The XA3S500E-4CPG132I delivers exceptional value for applications requiring high-performance FPGA capabilities in challenging environments. Its combination of substantial logic resources, high-speed performance, and industrial-grade reliability makes it an excellent choice for mission-critical applications across aerospace, defense, communications, and industrial markets.

With comprehensive development tool support, extensive documentation, and a robust ecosystem of IP cores and reference designs, the XA3S500E-4CPG132I enables rapid development and deployment of complex digital systems. The industrial temperature range and stringent quality standards ensure reliable operation in the most demanding applications.

For detailed technical specifications, pricing information, and availability, consult the official product documentation or contact authorized distributors.