1. Product Specifications
Core Architecture
- Device Family: Spartan-3A FPGA
- Logic Cells: 400,000 system gates
- CLB Array: 22 x 22 Configurable Logic Blocks
- Total Logic Elements: 8,064 logic cells
- Speed Grade: -4 (high performance)
Memory Configuration
- Block RAM: 360 Kbits total
- Distributed RAM: 126 Kbits
- Memory Blocks: 20 dedicated 18-Kbit block RAMs
I/O Capabilities
- User I/O Pins: 264 maximum
- Differential I/O Pairs: 132 pairs
- I/O Standards: Support for LVDS, SSTL, HSTL, and other high-speed standards
- Package Type: FGG456 (Fine-pitch Ball Grid Array)
- Pin Count: 456 pins
Performance Specifications
- Operating Frequency: Up to 200+ MHz
- Power Consumption: Optimized for low-power applications
- Temperature Range: Extended military temperature range
- Supply Voltage: Multiple voltage domains supported
Advanced Features
- Digital Clock Manager (DCM): 4 DCMs for advanced clocking
- Multipliers: 16 dedicated 18×18 multipliers
- Configuration: Multiple configuration modes supported
- Security: Built-in security features for IP protection
2. Pricing Information
The XA3S400-4FGG456Q pricing varies based on quantity, distribution channel, and current market conditions. For accurate pricing and availability:
- Contact authorized Xilinx distributors
- Volume pricing available for OEM customers
- Military/aerospace pricing may differ from commercial variants
- Lead times vary based on current production schedules
Note: Due to the specialized military-grade nature of the XA3S400-4FGG456Q, pricing typically requires direct quotation from qualified suppliers.
3. Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Comprehensive implementation and design guidelines
- Migration Guide: Upgrade paths from previous Spartan generations
- Application Notes: Design optimization and best practices
- Errata: Known issues and workarounds
Design Resources
- Reference Designs: Proven implementation examples
- IP Cores: Compatible intellectual property modules
- Evaluation Boards: Development and prototyping platforms
- Software Tools: ISE Design Suite compatibility information
Media Resources
- Product Videos: Technical overviews and demonstrations
- Webinars: Training and educational content
- White Papers: Advanced application discussions
- Case Studies: Real-world implementation examples
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete development environment
- ChipScope Pro: Advanced debugging and analysis
- System Generator: MATLAB/Simulink integration
- EDK (Embedded Development Kit): Embedded processor design
Compatible Products
- Configuration Devices: Compatible PROM and flash memories
- Power Management: Recommended power supply solutions
- Clocking Solutions: Crystal oscillators and clock generators
- Interface Devices: Level translators and signal conditioning
Training and Support
- Online Training Modules: Self-paced learning resources
- Technical Support: Expert assistance and troubleshooting
- Community Forums: Peer-to-peer knowledge sharing
- Application Engineering: Custom design consultation
Evaluation Platforms
- Development Boards: Ready-to-use evaluation platforms
- Starter Kits: Entry-level development packages
- Reference Designs: Proven application examples
- Debug Tools: Hardware and software debugging solutions
5. Environmental & Export Classifications
Environmental Specifications
- Operating Temperature: -55ยฐC to +125ยฐC (military grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 85% RH non-condensing
- Shock and Vibration: MIL-STD-883 qualified
- Radiation Tolerance: Enhanced for space applications
Quality and Reliability
- Quality Standard: MIL-PRF-38535 qualified
- Reliability Rating: Military-grade reliability specifications
- MTBF: Extended mean time between failures
- Quality Assurance: 100% production testing
- Traceability: Full manufacturing traceability
Compliance Certifications
- RoHS Compliance: Lead-free and environmentally friendly
- REACH Compliance: European chemical regulation compliance
- ISO Standards: ISO 9001 quality management certified
- Military Standards: MIL-STD-883 and MIL-PRF-38535
Export Control Classifications
- ECCN: Export Control Classification Number varies by configuration
- ITAR: International Traffic in Arms Regulations compliance
- EAR: Export Administration Regulations applicable
- Country Restrictions: Specific export limitations may apply
Packaging and Handling
- ESD Sensitivity: Class 1 electrostatic discharge sensitive
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) rating
- Package Marking: Full traceability markings
- Storage Requirements: Controlled environment storage recommended
The XA3S400-4FGG456Q represents the pinnacle of military-grade FPGA technology, offering uncompromising performance and reliability for the most demanding applications. Its combination of high logic density, advanced features, and ruggedized design makes it the preferred choice for aerospace, defense, and critical infrastructure applications where failure is not an option.
For detailed technical specifications, pricing, and availability of the XA3S400-4FGG456Q, contact your authorized Xilinx distributor or military/aerospace supplier.
