1. Product Specifications
Core Architecture
- Device Family: Spartan-3A FPGA
- Logic Capacity: 400,000 system gates
- CLB Configuration: 22 x 22 Configurable Logic Blocks
- Logic Elements: 8,064 total logic cells
- Speed Grade: -4 (high-performance variant)
- Temperature Grade: I (Industrial: -40ยฐC to +100ยฐC)
Memory Architecture
- Block RAM: 360 Kbits total capacity
- Distributed RAM: 126 Kbits available
- Memory Blocks: 20 dedicated 18-Kbit block RAMs
- Memory Configuration: Flexible single/dual-port configurations
I/O Specifications
- Maximum User I/O: 264 pins
- Differential I/O Pairs: 132 high-speed pairs
- Package: FGG456 (Fine-pitch Ball Grid Array)
- Total Pins: 456 pins with 0.8mm pitch
- I/O Standards: LVDS, SSTL, HSTL, LVCMOS support
Performance Characteristics
- System Clock: Up to 200+ MHz operation
- Internal Clock: Multiple clock domains supported
- Power Optimization: Advanced power management features
- Propagation Delay: Optimized for high-speed applications
Advanced Features
- Digital Clock Managers: 4 DCMs for clock synthesis and management
- Dedicated Multipliers: 16 high-speed 18×18 multipliers
- Configuration Options: Multiple programming modes
- IP Security: Built-in intellectual property protection
2. Pricing Information
The XA3S400-4FGG456I pricing structure reflects its industrial-grade specifications and market positioning:
Pricing Factors
- Quantity Breaks: Volume discounts available for large orders
- Distribution Channel: Authorized distributors vs. direct sales
- Market Conditions: Current semiconductor market dynamics
- Lead Time: Standard vs. expedited delivery options
Cost Considerations
- Industrial Premium: Higher cost than commercial variants
- Long-term Availability: Extended product lifecycle support
- Quality Assurance: Enhanced testing and screening costs
- Package Options: FGG456 packaging premium
For current XA3S400-4FGG456I pricing and availability, contact authorized Xilinx distributors or industrial electronics suppliers. Volume pricing and long-term agreements available for qualified customers.
3. Documents & Media
Technical Documentation
- Product Datasheet: Complete electrical and timing specifications
- Design Guide: Comprehensive implementation methodology
- Pin-out Diagrams: Detailed package and signal assignments
- Thermal Analysis: Junction temperature and power dissipation data
- Reliability Report: Industrial-grade qualification test results
Software Documentation
- ISE Design Suite: Compatible development environment guides
- Constraint Files: Pre-validated timing and placement constraints
- IP Core Library: Compatible intellectual property documentation
- Migration Guides: Upgrade paths and design conversion
Application Resources
- Reference Designs: Validated implementation examples
- Application Notes: Best practices and optimization techniques
- Design Patterns: Common industrial application templates
- Troubleshooting Guide: Common issues and solutions
Multimedia Content
- Technical Webinars: Industrial FPGA design methodologies
- Product Demonstrations: Live application showcases
- Training Videos: Design tool tutorials and workflows
- Case Studies: Real-world industrial implementations
4. Related Resources
Development Ecosystem
- Xilinx ISE Design Suite: Complete development environment
- Vivado Design Suite: Next-generation design tools (migration path)
- ChipScope Pro Analyzer: Advanced debugging and verification
- System Generator: High-level design entry for DSP applications
Hardware Ecosystem
- Development Boards: Industrial-focused evaluation platforms
- Configuration Devices: Compatible PROM and flash memories
- Power Solutions: Recommended industrial power supplies
- Interface Components: Level shifters and signal conditioning
Design Services
- Application Engineering: Custom design consultation
- Technical Support: Industrial-grade support services
- Training Programs: Professional development courses
- Design Reviews: Expert design validation services
Complementary Products
- Spartan-6 Family: Upgrade migration path
- Zynq SoCs: ARM+FPGA integration options
- Kintex Series: Higher performance alternatives
- Artix Series: Lower power consumption options
Industry Solutions
- Industrial Automation: Control system implementations
- Motor Control: Advanced drive applications
- Communications: Industrial networking solutions
- Test Equipment: Automated test system designs
5. Environmental & Export Classifications
Operating Environment
- Temperature Range: -40ยฐC to +100ยฐC (Industrial Grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 10% to 85% non-condensing
- Altitude: Up to 3,000 meters operational
- Vibration Resistance: Industrial equipment standards
Quality Standards
- Manufacturing Standard: Industrial-grade production processes
- Quality System: ISO 9001:2015 certified manufacturing
- Reliability Testing: Extended burn-in and screening
- Statistical Quality Control: Advanced process monitoring
- Traceability: Complete manufacturing lot tracking
Environmental Compliance
- RoHS Directive: Fully compliant lead-free construction
- REACH Regulation: European chemical safety compliance
- WEEE Directive: Waste electrical equipment compliance
- Green Packaging: Environmentally responsible packaging materials
Export Control Information
- Export Classification: Commercial technology classification
- ECCN Designation: Export Control Classification Number assigned
- Country Restrictions: Standard commercial export limitations
- Documentation: Certificate of origin available upon request
Safety and Regulatory
- EMC Compliance: Electromagnetic compatibility certified
- Safety Standards: International safety regulation compliance
- FCC Certification: Federal Communications Commission approved
- CE Marking: European Conformity declaration
Package and Handling
- ESD Protection: Class 1 electrostatic discharge rating
- Moisture Sensitivity: MSL-3 moisture sensitivity level
- Package Integrity: Rigorous package qualification testing
- Handling Guidelines: Detailed ESD and thermal handling procedures
Lifecycle Management
- Product Longevity: Extended industrial lifecycle commitment
- Obsolescence Management: Proactive end-of-life planning
- Alternative Products: Migration path recommendations
- Long-term Support: Extended technical support availability
The XA3S400-4FGG456I delivers industrial-strength FPGA performance with the reliability and environmental tolerance required for demanding commercial and industrial applications. Its optimized architecture, comprehensive development ecosystem, and industrial-grade qualification make it the ideal choice for mission-critical systems where consistent performance and long-term availability are essential.
For detailed technical specifications, current pricing, and availability information for the XA3S400-4FGG456I, please contact your authorized Xilinx distributor or industrial electronics supplier. Technical support and application engineering services are available to ensure successful implementation.
