1. Product Specifications
Core Architecture
- Logic Cells: 4,320 logic cells
- System Gates: 200,000 gates
- Process Technology: 90nm process node
- Speed Grade: -4 (high performance)
- Package Type: FTG256 (Fine-pitch Ball Grid Array)
- Total I/O Pins: 195 user I/O pins
Memory Resources
- Block RAM: 216 Kbits total block RAM
- Distributed RAM: 60 Kbits distributed RAM
- Configuration Memory: SRAM-based configuration
Processing Elements
- Dedicated Multipliers: 16 x 18-bit dedicated multipliers
- Digital Clock Managers (DCMs): 4 DCMs for clock management
- Maximum Operating Frequency: Up to 400 MHz (speed grade dependent)
Package Details
- Package: 256-pin Fine-pitch Ball Grid Array (FTG256)
- Pin Pitch: 1.0mm ball pitch
- Package Dimensions: 17mm x 17mm
- Operating Temperature Range: -40ยฐC to +125ยฐC (automotive grade)
Power Specifications
- Core Voltage: 1.2V ยฑ 5%
- I/O Voltage: 1.2V to 3.3V (selectable per bank)
- Typical Power Consumption: Varies by utilization and frequency
2. Pricing Information
Current Market Pricing
The XA3S200A-4FTG256Q is positioned as a premium automotive-grade FPGA solution. Pricing varies based on:
- Volume Quantities: Substantial discounts available for production volumes
- Distribution Channel: Authorized distributors vs. direct from manufacturer
- Lead Times: Standard vs. expedited delivery options
- Geographic Region: Regional pricing variations may apply
Price Range: Contact authorized Xilinx distributors for current pricing Minimum Order Quantity: Typically 1 piece for samples, higher MOQs for production
Note: Prices subject to change without notice. Contact your local Xilinx representative or authorized distributor for current pricing and availability.
3. Documents & Media
Technical Documentation
- XA3S200A-4FTG256Q Datasheet: Complete electrical and timing specifications
- Spartan-3A Family User Guide: Comprehensive architecture and usage guidelines
- Automotive FPGA Design Guide: Best practices for automotive applications
- Package and Pinout Documentation: Detailed pin assignments and package drawings
Development Resources
- Reference Designs: Pre-verified design examples and application notes
- Evaluation Boards: Compatible development and evaluation platforms
- Software Tools: ISE Design Suite compatibility information
- Simulation Models: IBIS and SPICE models for signal integrity analysis
Compliance Certificates
- Automotive Qualification Reports: AEC-Q100 compliance documentation
- Environmental Test Reports: Temperature, humidity, and shock test results
- Quality Certifications: ISO/TS 16949 manufacturing quality standards
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete development environment
- Vivado Design Suite: Next-generation design tools (limited support)
- ChipScope Pro: Integrated logic analyzer for debugging
- System Generator: MATLAB/Simulink integration tools
Compatible Products
- Configuration Devices: Platform Flash PROMs and SPI Flash memories
- Power Management: Dedicated FPGA power supply solutions
- Clock Generation: Compatible oscillators and clock distribution devices
- Interface Components: Level translators and signal conditioning circuits
Application Examples
- Automotive Electronics: Engine control units, safety systems, infotainment
- Industrial Automation: Motor control, process monitoring, machine vision
- Communications: Protocol processing, signal conditioning, interface bridging
- Aerospace Systems: Flight control, navigation, data acquisition
Training and Support
- Online Training Modules: FPGA design fundamentals and advanced techniques
- Technical Webinars: Regular updates on design methodologies and tools
- Community Forums: Peer-to-peer support and knowledge sharing
- Professional Services: Design consulting and technical support options
5. Environmental & Export Classifications
Environmental Specifications
- Operating Temperature: -40ยฐC to +125ยฐC (automotive grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity Resistance: 85% RH at 85ยฐC (non-condensing)
- Thermal Cycling: AEC-Q100 Grade 2 qualification
Reliability Standards
- Automotive Qualification: AEC-Q100 Grade 2 certified
- Quality Standards: ISO/TS 16949 manufacturing
- MTBF Rating: > 1,000,000 hours at 55ยฐC junction temperature
- ESD Protection: HBM > 2kV, CDM > 500V
Export Control Information
- ECCN Classification: 3A001.a.7 (subject to export regulations)
- Country of Origin: Various (see product marking)
- Export Restrictions: Subject to U.S. Export Administration Regulations
- Documentation Required: May require export licenses for certain destinations
Environmental Compliance
- RoHS Compliance: Fully RoHS compliant (lead-free)
- REACH Regulation: Compliant with EU REACH requirements
- Conflict Minerals: Compliant with Dodd-Frank Act Section 1502
- Environmental Management: ISO 14001 certified manufacturing
Packaging and Handling
- MSL Rating: Moisture Sensitivity Level 3
- Packaging Options: Tape and reel, Jedec trays available
- Anti-Static Requirements: Standard ESD precautions required
- Shelf Life: 12 months in sealed moisture barrier bag
The XA3S200A-4FTG256Q represents the pinnacle of automotive-grade FPGA technology, combining proven Spartan-3A architecture with enhanced environmental specifications for the most demanding applications. For technical support, pricing information, or design assistance, contact your local Xilinx representative or authorized distributor.
