Product Specifications
Core Architecture
- Logic Cells: 200,000 system gates equivalent
- Configurable Logic Blocks (CLBs): 1,728 CLBs
- Total Logic Elements: 3,584 logic elements
- Memory: 216 Kbits of block RAM
- Multipliers: 16 dedicated 18×18 multipliers
- Digital Clock Managers (DCMs): 4 DCMs for advanced clock management
Package & Interface
- Package Type: Fine-pitch Ball Grid Array (FTBGA)
- Pin Count: 256 pins
- Package Size: 17mm x 17mm
- I/O Standards: Support for multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL
- User I/O Pins: Up to 195 user I/O pins
Performance Characteristics
- Speed Grade: -4 (highest performance grade)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Power Supply: 1.2V core, 2.5V/3.3V I/O
- Maximum Operating Frequency: Up to 320 MHz
- Power Consumption: Optimized for low power applications
Price Information
The XA3S200A-4FTG256I pricing varies based on quantity and supplier. Current market pricing typically ranges from $45-85 per unit for standard quantities (1-99 pieces), with volume discounts available for orders exceeding 100 units. For the most current pricing and availability, contact authorized Xilinx distributors or check leading electronic component suppliers.
Note: Prices are subject to market fluctuations and may vary by region and supplier.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and timing parameters
- User Guide: Comprehensive implementation and design guidelines
- Application Notes: Design optimization and best practices
- Reference Manual: Detailed architectural information
- Errata: Known issues and workarounds
Design Resources
- Development Tools: ISE Design Suite compatibility
- IP Cores: Access to Xilinx IP core library
- Reference Designs: Sample implementations and demos
- Simulation Models: VHDL and Verilog behavioral models
Media Resources
- Block Diagrams: System architecture illustrations
- Package Drawings: Mechanical specifications and pinout diagrams
- Thermal Analysis: Heat dissipation characteristics
- Layout Guidelines: PCB design recommendations
Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete design environment for the XA3S200A-4FTG256I
- ChipScope Pro: Real-time debugging and analysis
- EDK (Embedded Development Kit): Embedded processor design tools
- System Generator: MATLAB Simulink integration
Evaluation Boards
- Spartan-3A Starter Kit: Rapid prototyping platform
- Custom Development Boards: Third-party evaluation platforms
- Reference Design Kits: Application-specific development boards
Support Resources
- Xilinx Forums: Community-driven technical support
- Application Engineers: Direct technical assistance
- Training Materials: Online courses and documentation
- Design Services: Professional implementation support
Compatible Products
- XA3S50A Series: Lower density alternatives
- XA3S400A Series: Higher density options
- Configuration Devices: Compatible PROM and Flash solutions
- Power Management: Recommended power supply solutions
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Compliant with European chemical regulations
- Conflict Minerals: Compliant with conflict-free sourcing requirements
- ISO 14001: Manufactured under environmental management standards
Operating Environment
- Temperature Range: -40ยฐC to +100ยฐC junction temperature
- Humidity: Up to 85% relative humidity (non-condensing)
- Altitude: Operational up to 2000 meters
- Shock & Vibration: MIL-STD-883 qualified
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) compliant
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Varies by manufacturing facility
- Export License: May require export license for certain destinations
- ITAR Status: Not subject to International Traffic in Arms Regulations
Quality & Reliability
- Military Temperature Range: Extended temperature qualification
- Qualification Standards: MIL-STD-883 methods
- Reliability Testing: Accelerated life testing and burn-in procedures
- Quality Management: ISO 9001 certified manufacturing
- Traceability: Full supply chain traceability maintained
The XA3S200A-4FTG256I represents a pinnacle of FPGA technology, combining high performance with military-grade reliability. Its comprehensive feature set, robust environmental specifications, and extensive development ecosystem make it the preferred choice for mission-critical applications requiring the ultimate in programmable logic performance and dependability.
