1. Product Specifications
Core Architecture
- Logic Capacity: 200,000 system gates for complex digital designs
- Logic Cells: 4,320 configurable logic cells for maximum flexibility
- Configurable Logic Blocks (CLBs): 480 CLBs with advanced routing resources
- Technology Node: Advanced 90nm CMOS process technology
- Maximum Clock Frequency: Up to 630 MHz for high-speed signal processing
Memory and Processing Resources
- Block RAM: 216 Kbits (221,184 total RAM bits) for efficient data storage
- Distributed RAM: Additional distributed memory resources
- Dedicated Multipliers: 12 ร 18×18 hardware multipliers for DSP operations
- Memory Configuration: Flexible block RAM configurations (1K to 18K bit blocks)
I/O and Connectivity Features
- User I/O Pins: 97 configurable I/O pins with programmable standards
- Package Type: TQFP (Thin Quad Flat Pack) for surface mount applications
- Pin Count: 144 pins in compact form factor
- Package Code: TQG144I (Industrial temperature grade)
- I/O Banks: 8 independent I/O banks for voltage flexibility
Power and Electrical Specifications
- Core Voltage: 1.2V nominal (1.14V to 1.26V operating range)
- I/O Voltage: 1.2V to 3.3V configurable per bank
- Power Consumption: Optimized low-power design for battery applications
- Supply Current: Minimal standby current for power-sensitive designs
Environmental and Reliability Specifications
- Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial I-grade)
- Junction Temperature: -40ยฐC to +100ยฐC TJ for harsh environments
- Industry Compliance: AEC-Q100 qualified for automotive reliability
- Package Material: Lead-free, RoHS compliant construction
- MTBF: High Mean Time Between Failures for critical applications
Advanced Features
- Digital Clock Managers (DCMs): 4 DCMs for precision clock management
- Clock Distribution: Low-skew global and regional clock networks
- Configuration Memory: Non-volatile configuration support
- JTAG Boundary Scan: IEEE 1149.1 compliant for testing and debug
2. Price Information
Current Market Pricing
- Unit Price Range: $46.36 – $55.19 USD (volume dependent)
- Volume Pricing Tiers:
- 1+ units: $55.19 USD
- 10+ units: $51.88 USD
- 100+ units: $49.12 USD
- 1,000+ units: $46.36 USD
- 10,000+ units: Contact for enterprise pricing
Commercial Terms
- Lead Time: 7-16 weeks for standard orders
- Minimum Order Quantity: 1 unit (flexibility for prototyping)
- Stock Availability: Over 2,000 units in authorized distributor inventory
- Packaging: Available in tape and reel for automated assembly
- Lifecycle Status: Active production with long-term availability commitment
Cost Optimization Benefits
- No NRE Costs: Eliminates non-recurring engineering expenses versus ASICs
- Reduced Time-to-Market: Accelerated development cycles
- Design Reusability: Reprogrammable architecture reduces redesign costs
- Inventory Flexibility: Single part number supports multiple applications
3. Documents & Media
Technical Documentation
- Primary Datasheet: Spartan-3 FPGA Family Complete Data Sheet (DS099)
- Automotive Datasheet: XA Spartan-3 Automotive FPGA Family Data Sheet (DS529)
- User Guide: Spartan-3 Generation FPGA User Guide
- Configuration Guide: Spartan-3 Generation Configuration User Guide
Design Resources and Tools
- Pinout Documentation: 144-pin TQFP package pinout and signal descriptions
- PCB Footprint: Land pattern recommendations and thermal considerations
- Reference Designs: Automotive and industrial application examples
- Application Notes: Power management, clock distribution, and I/O standards
Software and Development Tools
- Design Software: Xilinx ISE Design Suite (legacy) / Vivado (newer projects)
- Programming Tools: iMPACT configuration software and utilities
- Simulation Models: SPICE models and timing simulation libraries
- IP Core Library: Extensive pre-verified IP core portfolio
Quality and Compliance Documentation
- Quality Certificates: AEC-Q100 qualification reports and test data
- Reliability Data: MTBF calculations and stress test results
- Environmental Compliance: RoHS and REACH compliance certificates
- Package Information: Mechanical drawings and assembly guidelines
4. Related Resources
Development and Evaluation Tools
- Evaluation Boards: Spartan-3 starter kits and development platforms
- Programming Hardware: Platform Cable USB II and JTAG programmers
- Debug Tools: ChipScope Pro analyzer for real-time system debugging
- Prototyping Boards: Breadboard-friendly breakout modules
Educational and Training Resources
- Online Training: Comprehensive FPGA design methodology courses
- Application Examples: Automotive, industrial, and communications designs
- Technical Webinars: Design best practices and optimization techniques
- Community Support: Active user forums and knowledge base
Compatible and Alternative Products
- Higher Capacity: XA3S400-4TQG144I (400K gates in same package)
- Lower Cost: XA3S50-4TQG144I (50K gates for simpler applications)
- Different Packages: XA3S200-4PQG208I (208-pin for more I/O)
- Next Generation: Zynq-7000 automotive series for ARM+FPGA integration
Integration and Design Services
- Design Consultation: FPGA design optimization and review services
- Custom IP Development: Application-specific IP core development
- Board Design Services: PCB layout and signal integrity optimization
- Manufacturing Support: DFM review and assembly guidelines
5. Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Compliance: Fully compliant with RoHS 3 directive 2015/863/EU
- REACH Regulation: Compliant with EU REACH regulation EC 1907/2006
- Lead-Free Construction: Pb-free solder and package materials
- Halogen-Free: Meets automotive halogen-free requirements
- Conflict Minerals: DRC conflict-free mineral sourcing certified
Export Control and Trade Classifications
- ECCN Classification: 3A001.a.7 (US Export Administration Regulations)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule classification)
- Country of Origin: Varies by manufacturing location (Asia/USA)
- Export License: May require export license for certain destinations
- Dual Use: Subject to dual-use export control regulations
Automotive Quality Standards
- AEC-Q100: Automotive Electronics Council stress test qualification
- ISO/TS 16949: Automotive quality management system compliance
- Zero Defects: Automotive-grade quality and reliability standards
- Statistical Process Control: SPC monitoring throughout manufacturing
- Traceability: Complete supply chain traceability for automotive applications
Packaging and Handling Requirements
- ESD Protection: Electrostatic discharge protective packaging required
- Moisture Sensitivity: MSL-3 (Moisture Sensitivity Level 3)
- Storage Conditions: -55ยฐC to +150ยฐC storage temperature range
- Shelf Life: Minimum 2 years from date of manufacture
- Handling Guidelines: IPC/JEDEC standards for component handling
Regulatory Certifications
- CE Marking: European Conformity for electromagnetic compatibility
- FCC Compliance: Federal Communications Commission equipment authorization
- UL Recognition: Underwriters Laboratories component recognition
- CSA Certification: Canadian Standards Association approval where applicable
Applications and Use Cases
Primary Application Domains
- Automotive Electronics: Engine control units, transmission control, and body electronics
- Industrial Automation: Process control, motor drives, and sensor interfaces
- Communications Infrastructure: Protocol processing and signal conditioning
- Test and Measurement: Data acquisition systems and signal analysis equipment
Key Advantages for Harsh Environments
- Extended Temperature: -40ยฐC to +100ยฐC operation for extreme conditions
- High Reliability: AEC-Q100 qualification ensures automotive-grade reliability
- Flexible I/O: Supports multiple voltage standards for system integration
- Low Power: Optimized for battery-powered and energy-efficient applications
Design Flexibility Benefits
- Reconfigurable Logic: Field-upgradeable functionality for product evolution
- Custom Interfaces: Implement proprietary protocols and communication standards
- Parallel Processing: Massive parallel computation capabilities
- Real-Time Performance: Deterministic timing for real-time control applications
The XA3S200-4TQG144I represents the optimal balance of performance, reliability, and cost-effectiveness for industrial-grade FPGA applications, making it the preferred choice for engineers developing robust electronic systems for automotive and harsh environment applications.
