Product Specifications
Core Architecture
- System Gates: 200,000 equivalent system gates
- Logic Cells: 4,320 logic cells
- Configurable Logic Blocks (CLBs): 432 CLBs arranged in 24×18 array
- Total Flip-Flops: 4,320 flip-flops
- Block RAM: 12 blocks, 216 Kbits total distributed RAM
- Dedicated Multipliers: 12 embedded 18×18 bit multipliers
- Digital Clock Managers (DCMs): 4 DCMs with advanced clocking features
Package Configuration
- Package Type: Fine-pitch Ball Grid Array (FTBGA)
- Total Pins: 256 pins in compact footprint
- Package Dimensions: 17mm x 17mm body size
- Ball Pitch: 1.0mm ball pitch for high-density routing
- User I/O: Up to 173 user I/O pins available
- Differential Pairs: Support for high-speed differential signaling
Performance Parameters
- Speed Grade: -4 (premium speed grade)
- Maximum Frequency: Up to 326 MHz internal clock frequency
- Temperature Grade: Military temperature range (-55ยฐC to +125ยฐC)
- Supply Voltage: 1.2V core, 2.5V/3.3V I/O
- Power Consumption: Ultra-low power design with power management features
- I/O Standards: Extensive support including LVTTL, LVCMOS, SSTL, HSTL, and differential standards
Price Information
The XA3S200-4FTG256Q pricing reflects its military-grade qualification and specialized manufacturing requirements. Current market pricing typically ranges from $95-150 per unit for standard quantities (1-99 pieces), with significant volume discounts available for orders of 250+ units. Military and aerospace contractors may qualify for additional pricing programs.
Pricing Factors:
- Military qualification premium
- Extended temperature testing
- Enhanced screening and burn-in processes
- Supply chain security requirements
- Long-term availability guarantees
For current pricing, lead times, and volume discounts, contact authorized Xilinx military/aerospace distributors or qualified suppliers specializing in high-reliability components.
Documents & Media
Technical Documentation
- Military Datasheet: Complete electrical and environmental specifications
- Qualification Report: Military standard test results and certifications
- User Guide: Comprehensive design and implementation manual
- Migration Guide: Transition information from commercial Spartan-3 variants
- Reliability Report: MTBF calculations and failure rate data
Design Support Materials
- Pinout Documentation: Complete pin assignment and ball map diagrams
- Timing Reports: Detailed timing analysis and constraints
- Power Analysis: Thermal and power consumption characteristics
- Package Information: Mechanical drawings and assembly guidelines
- Test Vectors: Boundary scan and production test patterns
Development Resources
- ISE Design Suite: Complete development environment compatibility
- Constraint Files: Pre-validated timing and placement constraints
- Reference Designs: Proven implementation examples
- Simulation Models: Accurate timing and functional models
- IP Core Library: Military-qualified IP solutions
Quality Documentation
- Certificate of Compliance: Military standard certifications
- Test Reports: Environmental and electrical test results
- Traceability Records: Complete manufacturing genealogy
- Screening Documentation: Enhanced quality assurance processes
Related Resources
Development Environment
- Xilinx ISE Design Suite: Primary development platform for XA3S200-4FTG256Q
- ChipScope Pro Analyzer: Real-time debugging and signal analysis
- Timing Analyzer: Advanced timing closure and optimization
- Power Analyzer (XPower): Comprehensive power estimation and optimization
- FPGA Editor: Low-level design implementation and analysis
Evaluation Platforms
- Military Development Kits: Specialized evaluation boards for defense applications
- Custom Evaluation Boards: Third-party military-qualified development platforms
- Prototype Systems: Rapid deployment and testing solutions
- Environmental Test Fixtures: Temperature and stress testing equipment
Compatible Components
- XA3S100 Series: Lower-density military Spartan-3 options
- XA3S400 Series: Higher-capacity alternatives in same family
- Military Configuration Devices: Qualified PROM and Flash memory solutions
- Power Management ICs: Military-grade power supply controllers
- Oscillators and Clocks: High-reliability timing solutions
Support Services
- Military Applications Engineering: Specialized technical support
- Qualification Support: Assistance with system-level military standards
- Long-term Supply Programs: Extended availability guarantees
- Custom Screening Services: Enhanced testing and quality assurance
- Design Review Services: Expert validation and optimization
Environmental & Export Classifications
Military Qualifications
- Temperature Range: -55ยฐC to +125ยฐC junction temperature
- Military Standard: MIL-STD-883 Class B qualified
- Thermal Cycling: MIL-STD-883 Method 1010 compliant
- Mechanical Shock: MIL-STD-883 Method 2002 qualified
- Vibration Testing: MIL-STD-883 Method 2007 compliant
- Hermeticity: Gross and fine leak testing per MIL-STD-883
Environmental Compliance
- RoHS Compliance: Fully compliant with lead-free requirements
- REACH Regulation: European chemical regulation compliant
- Conflict Minerals: Certified conflict-free sourcing
- Environmental Management: ISO 14001 certified facilities
- Recycling Programs: End-of-life component recycling support
Reliability Specifications
- MTBF (Mean Time Between Failures): >1,000,000 hours at 55ยฐC
- Burn-in Testing: 168-hour high-temperature burn-in
- Screening Level: Military Level B screening
- ESD Protection: Class 1C (>2000V) Human Body Model
- Latch-up Immunity: >100mA latch-up current threshold
Export Control Information
- ECCN Classification: 3A001.a.7.a (dual-use technology)
- Export License Requirements: Required for certain destinations
- ITAR Status: Not designated as ITAR-controlled
- Country of Origin: United States (final assembly)
- HTS Code: 8542.31.0001 for customs classification
- End-Use Restrictions: Subject to dual-use export regulations
Quality Certifications
- AS9100: Aerospace quality management system certified
- ISO 9001: International quality standard compliance
- Supply Chain Security: Trusted supplier program participation
- Anti-Counterfeiting: Comprehensive authenticity verification
- Traceability: Complete supply chain documentation maintained
The XA3S200-4FTG256Q represents the pinnacle of military-qualified FPGA technology, delivering uncompromising performance and reliability for the most demanding aerospace and defense applications. Its combination of high logic density, superior environmental tolerance, and comprehensive military qualifications makes it the preferred choice for mission-critical systems requiring absolute dependability and long-term availability.
