Product Specifications
Core Architecture
The XA3S200-4FTG256I features a comprehensive set of specifications designed for versatility and performance:
Logic Resources:
- System gates: 200,000
- Logic cells: 4,320
- CLB array: 24 x 18
- Total CLBs: 432
- Distributed RAM bits: 69,120
Memory & Processing:
- Block RAM bits: 216,000
- Block RAM blocks: 12
- Dedicated multipliers: 16
- Maximum user I/O: 173
Package & Operating Conditions:
- Package type: FTG256 (Fine-Pitch Ball Grid Array)
- Speed grade: -4 (high performance)
- Temperature range: Industrial (-40ยฐC to +100ยฐC)
- Supply voltage: 1.2V core, 3.3V I/O
Performance Characteristics:
- Maximum frequency: Up to 200+ MHz
- Low power consumption with advanced power management
- Support for multiple I/O standards including LVDS, SSTL, and HSTL
Pricing Information
The XA3S200-4FTG256I pricing varies based on quantity and supplier. Typical pricing ranges:
- Single unit: $45-65 USD
- Volume pricing (100+): $35-50 USD per unit
- Large volume (1000+): Contact authorized distributors for competitive pricing
Prices are subject to market conditions and may vary by region and distributor. Contact authorized Xilinx distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Datasheet: XA3S200-4FTG256I complete specifications and electrical characteristics
- User Guide: Spartan-3A FPGA Family Complete Data Sheet
- Application Notes: Design guidelines and best practices
- Package Information: FTG256 pinout diagrams and mechanical drawings
Development Resources
- ISE Design Suite: Compatible development environment
- Reference designs: Sample projects and implementation examples
- Constraint files: UCF templates for rapid development
- Simulation models: IBIS and SPICE models for signal integrity analysis
Compliance Certificates
- RoHS compliance documentation
- Industrial temperature qualification reports
- Quality and reliability test reports
Related Resources
Development Tools
The XA3S200-4FTG256I integrates seamlessly with Xilinx development ecosystem:
Software Support:
- Xilinx ISE Design Suite (legacy support)
- Vivado Design Suite (limited support)
- ChipScope Pro for debugging
- ModelSim simulation environment
Hardware Platforms:
- Spartan-3A evaluation boards
- Custom development kits
- Third-party prototyping platforms
Compatible Products
- XA3S50-4FTG256I: Smaller capacity alternative
- XA3S400-4FTG256I: Higher capacity option
- Configuration devices: XCF series Platform Flash
- Power management: Compatible voltage regulators and power modules
Technical Support
- Xilinx Community Forums
- Application engineering support
- Training courses and webinars
- Design consultation services
Environmental & Export Classifications
Environmental Compliance
The XA3S200-4FTG256I meets stringent environmental and regulatory standards:
RoHS Compliance:
- Lead-free package construction
- Compliant with RoHS 2011/65/EU directive
- WEEE directive compliance
Quality Standards:
- ISO 9001:2015 manufacturing
- Automotive AEC-Q100 qualified variants available
- IPC standards compliance for assembly
Export Control Classifications
ECCN Classification: 3A001.a.7
- Dual-use technology requiring export license consideration
- Subject to Export Administration Regulations (EAR)
- Restricted countries and end-user screening required
International Classifications:
- HS Code: 8542.31.0001
- Country of origin: Various (check specific lot)
- Anti-dumping duty considerations may apply
Operating Environment
Temperature Specifications:
- Industrial grade: -40ยฐC to +100ยฐC junction temperature
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
Reliability Metrics:
- MTBF: >1,000,000 hours at 55ยฐC
- Qualification level: Industrial standard
- ESD protection: Class 1C (>1000V HBM)
The XA3S200-4FTG256I represents a proven solution for applications requiring reliable FPGA performance in challenging environments. Its combination of logic capacity, industrial temperature operation, and comprehensive development support makes it an excellent choice for aerospace, defense, industrial automation, and high-reliability commercial applications.
For the most current technical specifications, pricing, and availability of the XA3S200-4FTG256I, consult authorized Xilinx distributors and the official product documentation.
