Product Specifications
Advanced Architecture Overview
The XA3S1500-4FGG676I represents the pinnacle of Spartan-3A technology with comprehensive specifications engineered for demanding applications:
Logic Capacity:
- System gates: 1,500,000
- Logic cells: 33,192
- CLB array: 64 x 52
- Total CLBs: 3,328
- Distributed RAM bits: 531,072
Memory & DSP Resources:
- Block RAM bits: 1,728,000
- Block RAM blocks: 96
- Dedicated 18×18 multipliers: 104
- Maximum user I/O: 487
- Differential I/O pairs: 243
Package Configuration:
- Package type: FGG676 (Fine-Pitch Grid Array)
- Pin count: 676 pins
- Speed grade: -4 (highest performance tier)
- Temperature range: Industrial (-40ยฐC to +100ยฐC)
- Core voltage: 1.2V, I/O voltage: 1.2V to 3.3V
Performance Specifications:
- System clock frequency: Up to 250+ MHz
- Advanced clock management with up to 8 DCMs
- Support for 19+ I/O standards including LVDS, SSTL-2, HSTL
- PowerPC 405 processor support capability
- Advanced power management features
Interface Capabilities:
- High-speed serial connectivity options
- Multi-gigabit transceiver support
- PCI, PCI-X interface compatibility
- DDR, DDR2 SDRAM controller support
Pricing Information
The XA3S1500-4FGG676I pricing reflects its premium positioning and extensive capabilities:
Current Market Pricing:
- Single unit: $180-250 USD
- Low volume (10-99 units): $150-200 USD per unit
- Medium volume (100-999 units): $120-170 USD per unit
- High volume (1000+ units): Contact distributors for competitive rates
Pricing Factors:
- Market availability and demand fluctuations
- Regional distributor variations
- Long-term agreement pricing available
- End-of-life considerations may affect availability
Pricing subject to change based on market conditions. Consult authorized Xilinx distributors for current quotes and lead times.
Documents & Media
Comprehensive Technical Documentation
The XA3S1500-4FGG676I is supported by extensive documentation resources:
Core Documentation:
- Complete Datasheet: Detailed electrical and timing specifications
- Family User Guide: Spartan-3A architecture and design guidelines
- Package Documentation: FGG676 pinout, mechanical drawings, and thermal data
- Migration Guide: Upgrade paths and design considerations
Design Resources:
- Constraint Files: Pre-validated UCF templates for rapid development
- Reference Designs: Proven implementation examples and IP cores
- Application Notes: Best practices for high-performance design
- Power Estimation: XPower analysis tools and worksheets
Simulation & Modeling:
- Timing Models: Detailed timing analysis data
- IBIS Models: Signal integrity simulation support
- SPICE Models: Analog simulation compatibility
- Behavioral Models: Functional verification resources
Development Media
- Design Software: ISE Design Suite compatibility matrix
- IP Core Catalog: Available intellectual property blocks
- Training Materials: Video tutorials and design workshops
- Community Resources: Forums and knowledge base access
Related Resources
Development Ecosystem
The XA3S1500-4FGG676I integrates with a comprehensive development environment:
Software Tools:
- ISE Design Suite: Full synthesis, implementation, and debugging
- Vivado Design Suite: Limited support for specific workflows
- ChipScope Pro: Advanced on-chip debugging capabilities
- System Generator: DSP design flow integration
- EDK (Embedded Development Kit): Processor-based system design
Hardware Development Platforms:
- ML505 Evaluation Platform: Full-featured development board
- Custom evaluation kits: Third-party development solutions
- Prototyping platforms: Rapid system validation tools
- Production-ready modules: Commercial off-the-shelf solutions
Compatible Product Family
Spartan-3A Variants:
- XA3S700-4FGG484I: Mid-range alternative
- XA3S1000-4FGG676I: Intermediate capacity option
- XA3S1400A-4FGG676I: Enhanced version with additional features
Supporting Components:
- Configuration Devices: XCF32P and higher capacity Platform Flash
- Power Solutions: Multi-rail power management ICs
- Clock Generation: Compatible oscillators and clock distribution
- Interface Components: Level shifters and signal conditioning
Technical Support Infrastructure
- Application Engineering: Direct technical consultation
- Design Services: Professional implementation support
- Training Programs: Comprehensive educational resources
- Community Support: Active user forums and knowledge sharing
Environmental & Export Classifications
Environmental Standards Compliance
The XA3S1500-4FGG676I adheres to rigorous environmental and quality standards:
RoHS & Environmental Compliance:
- RoHS 2011/65/EU: Fully compliant lead-free construction
- WEEE Directive: Proper disposal and recycling guidelines
- REACH Regulation: Substance of Very High Concern (SVHC) compliance
- Green Product: Environmentally conscious manufacturing
Quality & Reliability Standards:
- ISO 9001:2015: Quality management system compliance
- AS9100: Aerospace quality standard qualification
- IPC Standards: Assembly and manufacturing compliance
- JEDEC Standards: Semiconductor reliability testing
Export Control & Trade Classifications
Export Administration Regulations:
- ECCN Classification: 3A001.a.7
- Export License Requirements: Destination and end-user dependent
- Dual-Use Technology: Subject to export control regulations
- BIS Screening: Required for international shipments
International Trade Classifications:
- Harmonized System Code: 8542.31.0001
- Schedule B Number: 8542.31.0001
- Country of Origin: Manufacturing location dependent
- Anti-Dumping Considerations: Regional trade policy compliance
Operating Environment Specifications
Temperature & Environmental Limits:
- Operating Temperature: -40ยฐC to +100ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity Range: 5% to 95% relative humidity, non-condensing
- Altitude: Up to 3,000 meters operational capability
Reliability Metrics:
- Mean Time Between Failures: >1,500,000 hours at 55ยฐC
- Qualification Level: Full industrial temperature qualification
- ESD Protection: Class 1C (>1000V Human Body Model)
- Latch-up Immunity: >100mA per JEDEC Standard 78
Power & Thermal Management:
- Advanced Power Gating: Reduced static power consumption
- Thermal Management: Comprehensive thermal design guidelines
- Power Supply Sequencing: Flexible power-up requirements
- EMI/EMC Compliance: CE marking and FCC Part 15 compatibility
The XA3S1500-4FGG676I represents the ultimate solution for applications demanding maximum FPGA performance, reliability, and feature integration. Its extensive logic capacity, comprehensive I/O support, and industrial-grade qualification make it ideal for aerospace systems, defense applications, telecommunications infrastructure, high-performance computing, and mission-critical industrial automation where failure is not an option.
For the latest technical specifications, current availability, and competitive pricing on the XA3S1500-4FGG676I, contact authorized Xilinx distributors and certified channel partners.
