Product Specifications
Core Features
- Device Family: Spartan-3A FPGA
- Logic Cells: 1,500,000 system gates
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 456 pins
- Speed Grade: -4 (high performance)
- Temperature Grade: Automotive (-40ยฐC to +125ยฐC)
- Voltage: 1.2V core, 3.3V I/O
Technical Specifications
- Distributed RAM: 120 Kbits
- Block RAM: 1,872 Kbits
- Dedicated Multipliers: 32 (18×18 bit)
- Digital Clock Managers (DCMs): 4
- Maximum User I/O: 372
- Configuration Memory: 11,608 Kbits
- Maximum Operating Frequency: Up to 326 MHz
Package Details
- Package: 456-pin Fine-pitch Ball Grid Array (FGG456)
- Package Size: 23mm x 23mm
- Ball Pitch: 1.0mm
- Height: 1.2mm maximum
Pricing Information
The XA3S1500-4FGG456Q pricing varies based on quantity and distributor. Contact authorized Xilinx distributors for current pricing information. Volume discounts are typically available for orders of 100+ units. Educational pricing may be available for qualified institutions.
Note: Prices are subject to change and may vary by region and distributor.
Documents & Media
Technical Documentation
- Datasheet: Spartan-3A FPGA Family Complete Data Sheet (DS529)
- User Guide: Spartan-3A FPGA Family User Guide (UG334)
- Package Information: 456-Ball Fine-Pitch BGA Package specifications
- Configuration Guide: Spartan-3A Configuration User Guide
Design Resources
- Reference Designs: Available through Xilinx Design Hub
- Application Notes: Automotive FPGA design guidelines
- PCB Layout Guidelines: High-speed design recommendations
- Thermal Management: Thermal design guidelines for FGG456 package
Software Tools
- ISE Design Suite: Complete development environment
- Vivado Design Suite: Advanced synthesis and implementation
- ChipScope Pro: Integrated logic analyzer
- CORE Generator: IP core library access
Related Resources
Development Boards
- Spartan-3A Starter Kit
- Spartan-3A DSP Starter Kit
- Custom evaluation boards from third-party vendors
Companion Devices
- Configuration Memory: SPI Flash, Parallel Flash options
- Power Management: Dedicated FPGA power solutions
- Clock Generation: Low-jitter oscillators and clock buffers
- Interface Solutions: Level translators and I/O expanders
Design Services
- Reference design consulting
- Custom IP core development
- PCB layout services for high-speed FPGA designs
- Thermal simulation and analysis
Training and Support
- Xilinx University Program resources
- Online training modules for Spartan-3A architecture
- Community forums and technical support
- Local field application engineer support
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package construction
- REACH Compliant: EU chemical safety regulation
- Conflict Minerals: Compliant with Dodd-Frank Act requirements
- Green Package: Halogen-free construction available
Operating Conditions
- Operating Temperature: -40ยฐC to +125ยฐC (automotive grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 85% non-condensing
- Altitude: Up to 3,000 meters operational
Export Classifications
- ECCN: 3A001.a.7 (US Export Administration Regulations)
- CCATS: Not required for standard commercial applications
- Country of Origin: Varies by manufacturing location
- HTS Code: 8542.33.0001
Quality Standards
- AEC-Q100: Automotive Electronics Council qualified
- ISO/TS 16949: Automotive quality management system
- Military Temperature: Extended temperature variants available
- Radiation Tolerance: Commercial grade (radiation-hardened versions available separately)
The XA3S1500-4FGG456Q represents an excellent choice for designers requiring high-performance FPGA capabilities in automotive and industrial applications. Its combination of logic density, speed performance, and environmental ruggedness makes it suitable for the most demanding embedded system requirements.
