1. Product Specifications
Core Technical Specifications
- Family: XA Spartan-3 Automotive FPGA
- System Gates: 1,500,000 (1.5M gates)
- Logic Cells: 29,952 cells
- Technology Node: 90nm CMOS process
- Supply Voltage: 1.2V core, 2.5V/3.3V I/O
- Package Type: 456-pin Fine-pitch Ball Grid Array (FBGA)
- Package Code: FGG456
- Speed Grade: -4 (Industrial temperature range)
- Operating Frequency: Up to 630 MHz
- Temperature Grade: Industrial (-40ยฐC to +85ยฐC)
Memory and I/O Features
- User I/O Pins: 333 maximum user I/O
- Block RAM: 432 Kbits total
- Distributed RAM: 239 Kbits
- Digital Clock Managers (DCMs): 4 DCMs
- Multipliers: 32 dedicated 18×18 multipliers
- Global Clock Networks: 8 global clocks
- Maximum Single-Ended I/O Standards: LVTTL, LVCMOS, PCI, GTL+
Advanced Features
- Configuration Options: Master Serial, Slave Serial, SelectMAP, JTAG
- Partial Reconfiguration: Supported
- Boundary Scan: IEEE 1149.1 compatible
- Power Management: Multiple power domains with flexible power sequencing
- Design Security: Bitstream encryption and authentication support
Package Details
- Pin Count: 456 pins
- Package Body Size: 23mm x 23mm
- Ball Pitch: 1.0mm
- Package Height: 2.39mm typical
- Weight: Approximately 2.5 grams
2. Pricing Information
Current Market Pricing (As of 2025)
- Single Unit Price: $180 – $220 USD (varies by distributor)
- Volume Pricing (100+ units): $165 – $185 USD per unit
- High Volume (1000+ units): $150 – $170 USD per unit
- Distributor Pricing: Contact authorized distributors for current quotes
Price Factors
- Automotive qualification adds premium over commercial versions
- Lead times may affect pricing due to specialized automotive testing
- Volume discounts available for automotive OEM customers
- Regional pricing variations may apply
Note: Prices are subject to change based on market conditions, lead times, and order quantities. Contact authorized distributors for current pricing.
3. Documents & Media
Technical Documentation
- Datasheet: XA Spartan-3 Automotive FPGA Family Datasheet (DS099)
- User Guide: Spartan-3 Configuration User Guide
- Application Notes:
- XAPP453: Using Digital Clock Managers in Spartan-3
- XAPP290: Spartan-3 FPGA Family Power Management
- Package Information: FGG456 Package User Guide
- Pin-out Documentation: XA3S1500 Pin Assignment Reference
Design Resources
- ISE Design Tools: Legacy support via ISE 14.7
- IP Cores: Compatible with Xilinx LogiCORE IP
- Reference Designs: Automotive communication protocols
- Evaluation Boards: Spartan-3 automotive development platforms
- ECAD Models: Available for major PCB design tools
Compliance Documentation
- Automotive Qualification Report: AEC-Q100 compliance
- Reliability Data: MTBF calculations and stress testing results
- Environmental Test Reports: Temperature, humidity, and vibration testing
- Quality Certifications: ISO/TS 16949 manufacturing certification
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment
- Vivado Design Suite: Limited support for legacy device programming
- ChipScope Pro: Integrated logic analyzer for debugging
- ModelSim: Simulation and verification environment
IP and Libraries
- MicroBlaze Soft Processor: Embedded processor core
- Communication IP: CAN, LIN, FlexRay protocol stacks
- DSP Libraries: Optimized signal processing functions
- Memory Controllers: DDR, SRAM, and Flash memory interfaces
Partner Ecosystem
- Board Partners: Digilent, Avnet, Trenz Electronic
- Software Partners: National Instruments, The MathWorks
- IP Partners: CAST, Xilinx Alliance Partners
- Automotive Tier-1 Suppliers: Extensive ecosystem support
Training and Support
- Xilinx University Program: Educational resources and curriculum
- Technical Support: Automotive-dedicated support team
- Community Forums: Xilinx automotive developer community
- Training Courses: FPGA design for automotive applications
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Lead-free and RoHS compliant (6/6)
- REACH Regulation: EU chemical safety compliance
- Halogen-Free: Meets halogen-free requirements
- Conflict Minerals: 3TG compliance reporting available
- Green Packaging: Recyclable packaging materials
Automotive Standards
- AEC-Q100: Automotive Electronics Council qualification
- ISO 26262: Functional safety standard compliance (ASIL-B capable)
- ISO/TS 16949: Quality management system certification
- PPAP: Production Part Approval Process documentation
- MSL Rating: Moisture Sensitivity Level 3
Export Control Classifications
- ECCN: 3A991.d (Export Administration Regulations)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Various (check specific lot markings)
- Export License: Generally no license required for most destinations
- Dual-Use Technology: Standard commercial encryption limitations
Temperature and Stress Ratings
- Operating Temperature: -40ยฐC to +85ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Thermal Resistance: ฮธJA = 5.1ยฐC/W (with proper thermal management)
- Maximum Junction Temperature: +125ยฐC
- Vibration Rating: Per AEC-Q100 automotive standards
Lifecycle and Obsolescence
- Product Status: Active production (automotive lifecycle)
- Recommended for New Designs: Yes, for automotive applications
- Long-term Support: Extended automotive lifecycle support
- Migration Path: Zynq-7000 series for future designs
- Last Time Buy: Not currently scheduled
Summary
The XA3S1500-4FGG456I represents a proven, automotive-qualified FPGA solution that bridges the gap between cost-effectiveness and automotive reliability. With 1.5 million system gates, comprehensive I/O capabilities, and full automotive qualification, this FPGA enables innovative automotive electronics while meeting strict industry standards for safety, reliability, and environmental compliance.
For detailed technical specifications, current pricing, and design support, contact authorized AMD Xilinx distributors or automotive field application engineers.
